UPG2134TB-E3 NEC [NEC], UPG2134TB-E3 Datasheet

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UPG2134TB-E3

Manufacturer Part Number
UPG2134TB-E3
Description
L-BAND PA DRIVER AMPLIFIER
Manufacturer
NEC [NEC]
Datasheet
1.UPG2134TB-E3.pdf (9 pages)

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Document No. PG10194EJ01V0DS (1st edition)
Date Published October 2002 CP(K)
Printed in Japan
DESCRIPTION
band application.
super minimold package. And this package is able to high-density surface mounting.
FEATURES
• Operation frequency
• Supply voltage
• Circuit current
• Power gain
• Gain control range
• Low distortion
• High-density surface mounting : 6-pin super minimold package (2.0
APPLICATION
• Digital Cellular: PDC 1.5 GHz etc.
ORDERING INFORMATION
Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge.
PG2134TB-E3
Remark To order evaluation samples, contact your nearby sales office.
The PG2134TB is GaAs MMIC for PA driver amplifier which were developed for mobile phone and another L-
This device can operate with 3.0 V TYP., having the high gain and low distortion. This device is housed in a 6-pin
Part Number
The information in this document is subject to change without notice. Before using this document, please confirm that
this is the latest version.
Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices
representative for availability and additional information.
Part number for sample order: PG2134TB
6-pin super minimold
Package
: f
: V
: V
: I
: G
: GCR = 42 dB TYP. @ V
: P
L-BAND PA DRIVER AMPLIFIER
P
f = 1 441 MHz, f = 50 kHz, 21 kHz Bandwidth
opt
DD
DD1
DD2
in
adj1
P
= 15 dBm
= 1 429 to 1 453 MHz (1 441 MHz TYP.)
= 28 mA TYP. @ V
= 28 dB TYP. @ V
= 60 dBc TYP. @ V
= 2.7 to 3.3 V (3.0 V TYP.)
= 2.7 to 4.2 V (3.5 V TYP.)
Marking
G3B
DATA SHEET
Embossed tape 8 mm wide
Pin 1, 2, 3 face the perforation side of the tape
Qty 3 kpcs/reel
DD1
DD1
DD1
= 3.0 V, V
DD1
= 3.0 V, V
= 3.0 V, V
= 3.0 V, V
DD2
DD2
1.25
GaAs INTEGRATED CIRCUIT
DD2
= 3.5 V, V
DD2
= 3.5 V, V
= 3.5 V, V
Supplying Form
= 3.5 V, V
0.9 mm)
AGC
AGC
PG2134TB
AGC
= 2.5 V, P
AGC
= 2.5 V, P
= 0.5 to 2.5 V,
= 2.5 V, P
NEC Compound Semiconductor Devices 2002
in
in
= 15 dBm
= 15 dBm
out
= +10 dBm,

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UPG2134TB-E3 Summary of contents

Page 1

L-BAND PA DRIVER AMPLIFIER DESCRIPTION The PG2134TB is GaAs MMIC for PA driver amplifier which were developed for mobile phone and another L- band application. This device can operate with 3.0 V TYP., having the high gain and low distortion. ...

Page 2

PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM (Top View ABSOLUTE MAXIMUM RATINGS (T Parameter Symbol Supply Voltage1 DD1, 2 Gain Control Voltage V Input Power P Power Dissipation P Operating ...

Page 3

ELECTRICAL CHARACTERISTICS ( 3.5 V, /4DQPSK modulated signal input, with external input and A DD1 DD2 output matching, unless otherwise specified) Parameter Symbol Operating Frequency f Circuit Current I Power Gain ...

Page 4

EVALUATION CIRCUIT 441 MHz 3 3.5 V DD1 DD2 OUTPUT DD2 10 000 pF 1 000 pF 2 DD1 1 000 pF The application circuits ...

Page 5

ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD IN USING THE NEC EVALUATION BOARD Symbol Values C1 000 pF GRM39CH102J25PB GRM39CH030C50PB GRM39CH020C50PB C5 100 pF GRM39CH101J50PB C6 10 000 pF GRM39CH103J25PB ...

Page 6

TYPICAL CHARACTERISTICS (T A OUTPUT POWER, CIRCUIT CURRENT, ADJACENT CHANNEL POWER LEAKAGE vs. INPUT POWER + 441 MHz 3.5 V, DD1 DD2 V = 2.5 V AGC + ...

Page 7

PACKAGE DIMENSIONS 6-PIN SUPER MINIMOLD (UNIT: mm) 2.1±0.1 1.25±0.1 0.1 MIN. Data Sheet PG10194EJ01V0DS PG2134TB 7 ...

Page 8

RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Infrared Reflow Peak temperature (package surface temperature) Time at peak ...

Page 9

The information in this document is current as of October 2002. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications ...

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