AM29F010B120DGC1 AMD [Advanced Micro Devices], AM29F010B120DGC1 Datasheet - Page 10

• Manufacturer Part Number: AM29F010B120DGC1
• Description: 1 Megabit (128 K x 8-Bit) CMOS 5.0 Volt-only, Uniform Sector Flash Memory-Die Revision 1
• Manufacturer: AMD [Advanced Micro Devices]

PHYSICAL SPECIFICATIONS
Die dimensions . . . . . . . . . . . . . . . 90 mils x 159 mils
Die Thickness. . . . . . . . . . . . . . . ~20 mils or ~500 µm
Bond Pad Size . . . . . . . . . . . . . . 4.69 mils x 4.69 mils
Pad Area Free of Passivation . . . . . . . . . .13.96 mils
Pads Per Die . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30
Bond Pad Metalization . . . . . . . . . . . . . . . . . . . . Al/Cu
Die Backside . . . . . . . . . . . . . . . . . . . . . . . . No metal,
Passivation . . . . . . . . . . . . . . . . . . . . . . . SiN/SOG/SiN
DC OPERATING CONDITIONS
V
Junction Temperature Under Bias . .T
Operating Temperature . . . Commercial 0°C to +70°C
8
CC
(Supply Voltage) . . . . . . . . . . . . . . . 4.5 V to 5.5 V
For Read-only . . . . . . . . . . .T
may be grounded (optional)
Extended –55°C to +125°C
Industrial –40°C to +85°C
115.9 µm x 115.9 µm
2.28 mm x 4.04 mm
J
J
(max) = 130°C
(max) = 140°C
Am29F010B Known Good Die
9,025 µm
S U P P L E M E N T
2
2
MANUFACTURING INFORMATION
Manufacturing . . . . . . . . . . . . . . . . . . . . . . . . . . . FASL
Wafer Sort Test . . . . . . . . . . . . . . Sunnyvale, CA, USA
Manufacturing ID. . . . . . . . . . . . . . . . . . . . . . . . 98A01
Preparation for Shipment . . . . . . . . Penang, Malaysia
Fabrication Process . . . . . . . . . . . . . . . . . . . . CS39S
Die Revision . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
SPECIAL HANDLING INSTRUCTIONS
Processing
Do not expose KGD products to ultraviolet light or
process them at temperatures greater than 250°C.
Failure to adhere to these handling instructions will
result in irreparable damage to the devices. For best
yield, AMD recommends assembly in a Class 10K
clean room with 30% to 60% relative humidity.
Storage
Store at a maximum temperature of 30°C in a nitrogen-
purged cabinet or vacuum-sealed bag. Observe all
standard ESD handling procedures.
. . . . . . . . . . . . . . . . . . . . . . . . .and Penang, Malaysia