AM29F800B-1 AMD [Advanced Micro Devices], AM29F800B-1 Datasheet

no-image

AM29F800B-1

Manufacturer Part Number
AM29F800B-1
Description
8 Megabit (1 M x 8-Bit/512 K x 16-Bit) CMOS 5.0 Volt-only, Boot Sector Flash Memory-Die Revision 1
Manufacturer
AMD [Advanced Micro Devices]
Datasheet
Am29F800B Known Good Die
8 Megabit (1 M x 8-Bit/512 K x 16-Bit)
CMOS 5.0 Volt-only, Boot Sector Flash Memory—Die Revision 1
DISTINCTIVE CHARACTERISTICS
5/4/98
Single power supply operation
— 5.0 Volt-only operation for read, erase, and
— Minimizes system level requirements
Manufactured on 0.35 µm process technology
— Compatible with 0.5 µm Am29F800 device
High performance
— 90 or 120 ns access time
Low power consumption (typical values at 5
MHz)
— 1 A standby mode current
— 20 mA read current (byte mode)
— 28 mA read current (word mode)
— 30 mA program/erase current
Flexible sector architecture
— One 16 Kbyte, two 8 Kbyte, one 32 Kbyte, and
— One 8 Kword, two 4 Kword, one 16 Kword, and
— Supports full chip erase
— Sector Protection features:
program operations
fifteen 64 Kbyte sectors (byte mode)
fifteen 32 Kword sectors (word mode)
A hardware method of locking a sector to
prevent any program or erase operations within
that sector
Sectors can be locked via programming
equipment
Temporary Sector Unprotect feature allows code
changes in previously locked sectors
SUPPLEMENT
Top or bottom boot block configurations
available
Embedded Algorithms
— Embedded Erase algorithm automatically
— Embedded Program algorithm automatically
Minimum 1,000,000 write cycles per sector
guaranteed
Compatibility with JEDEC standards
— Pinout and software compatible with single-
— Superior inadvertent write protection
Data# Polling and toggle bits
— Provides a software method of detecting
Ready/Busy# pin (RY/BY#)
— Provides a hardware method of detecting
Erase Suspend/Erase Resume
— Suspends an erase operation to read data from,
Hardware reset pin (RESET#)
— Hardware method to reset the device to reading
preprograms and erases the entire chip or any
combination of designated sectors
writes and verifies data at specified addresses
power-supply Flash
program or erase operation completion
program or erase cycle completion
or program data to, a sector that is not being
erased, then resumes the erase operation
array data
Publication# 21631
Issue Date: April 1998
Rev: A Amendment/+2

Related parts for AM29F800B-1

AM29F800B-1 Summary of contents

Page 1

... SUPPLEMENT Am29F800B Known Good Die 8 Megabit ( 8-Bit/512 K x 16-Bit) CMOS 5.0 Volt-only, Boot Sector Flash Memory—Die Revision 1 DISTINCTIVE CHARACTERISTICS Single power supply operation — 5.0 Volt-only operation for read, erase, and program operations — Minimizes system level requirements Manufactured on 0.35 µm process technology — ...

Page 2

... programmed using hot electron injection. ELECTRICAL SPECIFICATIONS Refer to the Am29F800B data sheet, PID 21504, for full electrical specifications on the Am29F800B in KGD form. Am29F800B Known Good Die ...

Page 3

... DIE PAD LOCATIONS AMD logo location Gel-Pak Am29F800B Known Good Die Am29F800B KGD -90 -120 90 120 90 120 ...

Page 4

... Am29F800B Known Good Die Pad Center (millimeters 0.0000 0.0000 0.1835 0.0000 0.3417 0.0000 0.4977 0.0000 0.6559 0.0000 0.8119 0.0000 0.9701 0.0000 1.1261 0.0000 1.2843 0.0000 1.4887 –0.0361 1 ...

Page 5

... BOOT CODE SECTOR ARCHITECTURE T = Top sector B = Bottom sector DEVICE NUMBER/DESCRIPTION Am29F800B Known Good Die 8 Megabit ( 8-Bit/512 K x 16-Bit) CMOS Flash Memory—Die Revision 1 5.0 Volt-only Program and Erase Valid Combinations list configurations planned to be sup- ported in volume for this device. Consult the local AMD sales office to confirm availability of specific valid combinations and to check on newly released combinations ...

Page 6

... PRODUCT TEST FLOW Figure 1 provides an overview of AMD’s Known Good Die test flow. For more detailed information, refer to the Am29F800B product qualification database supple- ment for KGD. AMD implements quality assurance pro- cedures throughout the product test flow. In addition, Packaging for Shipment ...

Page 7

... AMD recommends assembly in a Class 10K clean room with 30% to 60% relative humidity. (max) = 130 C J Storage Store at a maximum temperature nitrogen- purged cabinet or vacuum-sealed bag. Observe all standard ESD handling procedures. Am29F800B Known Good Die (Bottom Boot .98924ABK 7 ...

Page 8

... Buyer’s use of AMD products for use in life support applications is at Buyer’s own risk and Buyer agrees to fully indem- nify AMD for any damages resulting in such use or sale. Am29F800B Known Good Die 5/4/98 ...

Page 9

... REVISION SUMMARY FOR AM29F800B KGD Revision A+1, A+2 Distinctive Characteristics Changed typical program/erase time match the CMOS DC Characteristics table in the Am29F400B full data sheet. The minimum guarante per sector is now 1 million cycles. Pad Description Corrected the following dimensions: X (mils): pads 15, 18 (mils): pads 10– ...

Related keywords