AM29LV400BB-120DPC1 AMD [Advanced Micro Devices], AM29LV400BB-120DPC1 Datasheet
AM29LV400BB-120DPC1
Related parts for AM29LV400BB-120DPC1
AM29LV400BB-120DPC1 Summary of contents
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Data Sheet July 2003 The following document specifies Spansion memory products that are now offered by both Advanced Micro Devices and Fujitsu. Although the document is marked with the name of the company that orig- inally developed the specification, these ...
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SUPPLEMENT Am29LV400B Known Good Die 4 Megabit (512 K x 8-Bit/256 K x 16-Bit) CMOS 3.0 Volt-only, Boot Sector Flash Memory DISTINCTIVE CHARACTERISTICS Single power supply operation — 2.7 to 3.6 V for read, program, and erase operations — Ideal ...
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GENERAL DESCRIPTION The Am29LV400B in Known Good Die (KGD) form Mbit, 3.0 volt-only Flash memory. AMD defines KGD as standard product in die form, tested for function- ality and speed. AMD KGD products have the same reli- ...
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PRODUCT SELECTOR GUIDE Family Part Number 3.0 – 3.6 V Speed Option & Voltage Operating Range 2.7 – 3.6 V Max Access Time, t (ns) ACC Max CE# Access, t (ns) CE Max OE# Access, t (ns) OE ...
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PAD DESCRIPTION Pad locations relative to die center. Pad Signal DQ4 3 DQ12 4 DQ5 5 DQ13 6 DQ6 7 DQ14 8 DQ7 9 DQ15/A– BYTE# 12 A16 13 A15 14 A14 ...
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PAD DESCRIPTION Pad locations relative Pad Signal DQ4 3 DQ12 4 DQ5 5 DQ13 6 DQ6 7 DQ14 8 DQ7 9 DQ15/A– BYTE# 12 A16 13 A15 14 ...
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... AM29LV400BT-80 AM29LV400BB-80 DPC 1, DPI 1, DPE 1 AM29LV400BT-90 DTC 1, DTI 1, DTE 1 AM29LV400BB-90 DWC 1, DWI 1, DWE 1 AM29LV400BT-120 AM29LV400BB-120 DIE REVISION This number refers to the specific AMD manufacturing process and product technology reflected in this document entered in the revision field of AMD standard product nomenclature. ...
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PACKAGING INFORMATION Surftape Packaging Direction of Feed Gel-Pak and Waffle Pack Packaging Orientation relative to top left corner of Gel-Pak and Waffle Pack cavity plate Am29LV400B Known Good Die Orientation ...
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PRODUCT TEST FLOW Figure 1 provides an overview of AMD’s Known Good Die test flow. For more detailed information, refer to the Am29LV400B product qualification database supple- ment for KGD. AMD implements quality assurance pro- cedures throughout the product test ...
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PHYSICAL SPECIFICATIONS Die dimensions . . . . . . . . . . . . . . 185 mils x 140 mils . . . . . . . . . . . . . . . . . ...
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TERMS AND CONDITIONS OF SALE FOR AMD NON-VOLATILE MEMORY DIE All transactions relating to unpackaged die under this agreement shall be subject to AMD’s standard terms and conditions of sale, or any revisions thereof, which revisions AMD reserves the right ...
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REVISION SUMMARY Revision A (December 10, 1999) Initial release. Revision B (December 10, 2001) Added 60R, 70 speed options. Added test conditions section. Revision B+1 (March 12, 2002) Pad Description Added table of pad locations relative to die center. Cor- ...
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Sales Offices and Representatives North America ALABAMA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...