IRLL024NTR International Rectifier Corp., IRLL024NTR Datasheet

no-image

IRLL024NTR

Manufacturer Part Number
IRLL024NTR
Description
Manufacturer
International Rectifier Corp.
Datasheet

Specifications of IRLL024NTR

Case
SOT-223
Date_code
08+

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
IRLL024NTR
Manufacturer:
IR
Quantity:
20 000
Part Number:
IRLL024NTRPBF
Manufacturer:
IR
Quantity:
20 000
Company:
Part Number:
IRLL024NTRPBF
Quantity:
9 000
Company:
Part Number:
IRLL024NTRPBF
Quantity:
20 550
Description
Fifth Generation HEXFETs from International Rectifier
utilize advanced processing techniques to achieve
extremely low on-resistance per silicon area. This benefit,
combined with the fast switching speed and ruggedized
device design that HEXFET Power MOSFETs are well
known for, provides the designer with an extremely efficient
and reliable device for use in a wide variety of applications.
The SOT-223 package is designed for surface-mount
using vapor phase, infra red, or wave soldering techniques.
Its unique package design allows for easy automatic pick-
and-place as with other SOT or SOIC packages but has
the added advantage of improved thermal performance
due to an enlarged tab for heatsinking. Power dissipation
of 1.0W is possible in a typical surface mount application.
l
l
l
l
l
l
Absolute Maximum Ratings
Thermal Resistance
* When mounted on FR-4 board using minimum recommended footprint.
** When mounted on 1 inch square copper board, for comparison with other SMD devices.
www.irf.com
I
I
I
I
P
P
V
E
I
E
dv/dt
T
R
R
D
D
D
DM
AR
J,
D
D
GS
AS
AR
@ T
@ T
@ T
JA
JA
Surface Mount
Advanced Process Technology
Ultra Low On-Resistance
Dynamic dv/dt Rating
Fast Switching
Fully Avalanche Rated
@T
@T
T
STG
A
A
A
A
A
= 25°C
= 25°C
= 70°C
= 25°C
= 25°C
Continuous Drain Current, V
Continuous Drain Current, V
Continuous Drain Current, V
Pulsed Drain Current 
Power Dissipation (PCB Mount)**
Power Dissipation (PCB Mount)*
Linear Derating Factor (PCB Mount)*
Gate-to-Source Voltage
Single Pulse Avalanche Energy‚
Avalanche Current
Repetitive Avalanche Energy*
Peak Diode Recovery dv/dt ƒ
Junction and Storage Temperature Range
Junction-to-Amb. (PCB Mount, steady state)*
Junction-to-Amb. (PCB Mount, steady state)**
Parameter
Parameter
GS
GS
GS
@ 10V**
@ 10V*
@ 10V*
G
Typ.
90
50
HEXFET
-55 to + 150
D
S
S O T -2 2 3
Max.
± 16
120
4.4
3.1
2.5
2.1
1.0
8.3
5.0
3.1
0.1
12
IRLL024N
®
R
Max.
DS(on)
Power MOSFET
120
60
V
I
DSS
D
= 3.1A
= 0.065
= 55V
PD - 91895
Units
mW/°C
Units
°C/W
V/ns
mJ
mJ
°C
W
W
A
V
A
1
6/15/99

Related parts for IRLL024NTR

Related keywords