HSMP-386F Agilent Technologies, Inc., HSMP-386F Datasheet
HSMP-386F
Manufacturer Part Number
HSMP-386F
Description
Manufacturer
Agilent Technologies, Inc.
Datasheet
1.HSMP-386E.pdf
(9 pages)
Specifications of HSMP-386F
Date_code
05+
Packing_info
SOT-323
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
HSMP-386F-BLKG
Manufacturer:
AVAGO
Quantity:
40 000
Company:
Part Number:
HSMP-386F-TR1
Manufacturer:
AVAGO
Quantity:
7 000
Company:
Part Number:
HSMP-386F-TR1G
Manufacturer:
AVAGO
Quantity:
31 000
Company:
Part Number:
HSMP-386F-TR2G
Manufacturer:
AVAGO
Quantity:
40 000
Surface Mount PIN Diodes
Technical Data
Features
• Unique Configurations in
• Switching
• Attenuating
• Matched Diodes for
• Better Thermal
• Low Failure in Time (FIT)
• Lead-free Option Available
Note:
1. For more information see the
Surface Mount Packages
– Add Flexibility
– Save Board Space
– Reduce Cost
– Low Distortion Switching
– Low Capacitance
– Low Current Attenuating for
Consistent Performance
Conductivity for Higher
Power Dissipation
Rate
Surface Mount PIN Reliability Data
Sheet.
Less Power Consumption
[1]
Notes:
1. Package marking provides
2. See “Electrical Specifications” for
Pin Connections and
Package Marking, SOT-363
orientation, identification, and
date code.
appropriate package marking.
1
2
3
6
5
4
Description/Applications
The HSMP-386x series of general
purpose PIN diodes are designed
for two classes of applications.
The first is attenuators where
current consumption is the most
important design consideration.
The second application for this
series of diodes is in switches
where low capacitance is the
driving issue for the designer.
The HSMP-386x series Total
Capacitance (C
Resistance (R
cations. For applications that
require guaranteed performance,
the general purpose HSMP-383x
series is recommended.
A SPICE model is not available
for PIN diodes as SPICE does not
provide for a key PIN diode
characteristic, carrier lifetime.
HSMP-386x Series
T
) are typical specifi-
T
) and Total
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