MC74HC138ANG ON Semiconductor, MC74HC138ANG Datasheet
MC74HC138ANG
Specifications of MC74HC138ANG
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MC74HC138ANG Summary of contents
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... Chip Complexity: 100 FETs or 29 Equivalent Gates • Pb−Free Packages are Available* *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2005 PDIP−16 16 ...
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... high level (steady state low level (steady state don’t care ORDERING INFORMATION Device MC74HC138AN MC74HC138ANG MC74HC138AD MC74HC138ADG MC74HC138ADR2 MC74HC138ADR2G MC74HC138ADTR2 MC74HC138ADTR2G MC74HC138AF MC74HC138AFG MC74HC138AFEL MC74HC138AFELG †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This package is inherently Pb− ...
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... Plastic DIP: – 10 mW/_C from 65_ to 125_C SOIC Package: – 7 mW/_C from 65_ to 125_C TSSOP Package: − 6.1 .W/_C from 65_ to 125_C For high frequency or heavy load considerations, see Chapter 2 of the ON Semiconductor High−Speed CMOS Data Book (DL129/D). RECOMMENDED OPERATING CONDITIONS Î Î Î Î ...
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... Current (per Package) Î Î Î Î Î Î Î Î Î Î Î Î NOTE: Information on typical parametric values can be found in Chapter 2 of the ON Semiconductor High−Speed CMOS Data Book (DL129/D). AC ELECTRICAL CHARACTERISTICS Î Î Î Î ...
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0.25 (0.010) M −A− −T− SEATING PLANE 0.25 (0.010 MC74HC138A PACKAGE DIMENSIONS PDIP−16 ...