C1206C106K8PAC Kemet, C1206C106K8PAC Datasheet
C1206C106K8PAC
Manufacturer Part Number
C1206C106K8PAC
Description
Manufacturer
Kemet
Datasheet
1.C1206C225Z4VAC.pdf
(4 pages)
Specifications of C1206C106K8PAC
Remarks
pb-free
Date_code
2009+
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
C1206C106K8PAC7800
Manufacturer:
KEMET/基美
Quantity:
20 000
C - Standard
Expressed in Picofarads (pF)
First two digits represent significant figures.
Third digit specifies number of zeros. (Use 9
for 1.0 through 9.9pF. Use 8 for 0.5 through 0.99pF)
(Example: 2.2pF = 229 or 0.50 pF = 508)
B – ±0.10pF
C – ±0.25pF
D – ±0.5pF
F – ±1%
G – ±2%
58
• C0G (NP0), X7R, X5R, Z5U and Y5V Dielectrics
• 10, 16, 25, 50, 100 and 200 Volts
• Standard End Metalization: Tin-plate over nickel
• Available Capacitance Tolerances: ±0.10 pF; ±0.25
* Note: Indicates EIA Preferred Case Sizes (Tightened tolerances apply for 0402, 0603, and 0805 packaged in bulk cassette, see page 82.)
† For extended value 1210 case size – solder reflow only.
barrier
pF; ±0.5 pF; ±1%; ±2%; ±5%; ±10%; ±20%; and
+80%-20%
0402*
0603*
0805*
1206*
1210*
1825*
1812
2220
2225
KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
1005
1608
2012
3216
3225
4532
4564
5650
5664
J – ±5%
K – ±10%
M – ±20%
P – (GMV) – special order only
Z – +80%, -20%
1.6 (.063) ± 0.15 (.006)
2.0 (.079) ± 0.2 (.008)
3.2 (.126) ± 0.2 (.008)
3.2 (.126) ± 0.2 (.008)
4.5 (.177) ± 0.3 (.012)
4.5 (.177) ± 0.3 (.012)
5.6 (.220) ± 0.4 (.016)
5.6 (.220) ± 0.4 (.016)
1.0 (.04) ± .05(.002)
CERAMIC CHIP CAPACITORS
0.8 (.032) ± 0.15 (.006)
1.25 (.049) ± 0.2 (.008)
1.6 (.063) ± 0.2 (.008)
2.5 (.098) ± 0.2 (.008)
3.2 (.126) ± 0.3 (.012)
6.4 (.252) ± 0.4 (.016)
5.0 (.197) ± 0.4 (.016)
6.3 (.248) ± 0.4 (.016)
0.5 (.02) ± .05 (.002)
See page 63
for thickness
dimensions.
ELECTRODES
• Tape and reel packaging per EIA481-1. (See page
• RoHS Compliant
63 for specific tape and reel information.) Bulk
Cassette packaging (0402, 0603, 0805 only) per
IEC60286-6 and EIAJ 7201.
0.20 (0.008)-0.40 (0.016)
0.35 (.014) ±0.15 (.006)
0.6 (.024) ±.35 (.014)
0.6 (.024) ±.35 (.014)
0.6 (.024) ±.35 (.014)
0.6 (.024) ±.35 (.014)
0.5 (.02) ±.25 (.010)
0.5 (.02) ±.25 (.010)
0.5 (.02) ±.25 (.010)
METALLIZATION
CONDUCTIVE
TIN PLATE
G – C0G (NP0) (±30 PPM/°C)
R – X7R (±15%) (-55°C + 125°C)
P– X5R (±15%) (-55°C + 85°C)
U – Z5U (+22%, -56%) (+10°C + 85°C)
V – Y5V (+22%, -82%) (-30°C + 85°C)
Change Over Temperature Range
NICKEL PLATE
(Tin-plated nickel barrier)
Designated by Capacitance
1 - 100V
2 - 200V
5 - 50V
0.75 (.030)
0.3 (.012)
0.7 (.028)
N/A
N/A
N/A
N/A
N/A
N/A
A- Not Applicable
C-Standard
3 - 25V
4 - 16V
8 - 10V
9 - 6.3V
Solder Wave †
Solder Reflow
Solder Reflow
Solder
Reflow
or
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