WS128K32V ETC1 [List of Unclassifed Manufacturers], WS128K32V Datasheet

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WS128K32V

Manufacturer Part Number
WS128K32V
Description
128Kx32 3.3V SRAM MULTICHIP PACKAGE
Manufacturer
ETC1 [List of Unclassifed Manufacturers]
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
WS128K32V-20G2UI
Quantity:
31
Part Number:
WS128K32V-25G1UI
Quantity:
2
128Kx32 3.3V SRAM MULTICHIP PACKAGE
FEATURES
April 2001 Rev. 2
FIG. 1
Access Times of 15 ** , 17, 20, 25, 35ns
Low Voltage Operation
Packaging
• 66-pin, PGA Type, 1.075 inch square Hermetic Ceramic
• 68 lead, Hermetic CQFP (G2T), 22.4mm (0.880 inch) square
• 68 lead, Hermetic CQFP (G1U), 23.8mm (0.940 inch)
Organized as 128Kx32; User Configurable as 256Kx16 or
512Kx8
Commercial, Industrial and Military Temperature Ranges
HIP (Package 400)
(Package 509), 4.57mm (0.180 inch) high. Designed to fit
JEDEC 68 lead 0.990" CQFJ footprint (Fig. 2)
square (Package 509), 3.56mm (0.140 inch) high.
11
1
I/O
I/O
I/O
A
A
A
A
NC
I/O
I/O
I/O
13
14
15
16
8
9
10
0
1
2
12
22
PIN CONFIGURATION FOR WS128K32NV-XH1X
WE
CS
GND
I/O
A
A
A
V
CS
NC
I/O
10
11
12
CC
2
11
1
3
2
23
33
I/O
I/O
I/O
I/O
OE
NC
WE
I/O
I/O
I/O
I/O
TOP VIEW
15
14
13
12
7
6
5
4
1
I/O
I/O
I/O
I/O
I/O
I/O
NC
A
A
A
A
24
25
26
16
17
18
6
7
8
9
44
34
GND
I/O
I/O
WE
WE
CS
CS
V
A
A
A
CC
27
19
4
4
3
4
5
3
3
45
55
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
A
A
A
31
30
29
28
23
22
21
20
0
1
2
56
66
A
0 - 1 6
O E
1
*
** Commercial and Industrial temperature ranges only.
128K x 8
I / O
8
WE
3.3 Volt Power Supply
Low Power CMOS
TTL Compatible Inputs and Outputs
Built-in Decoupling Caps and Multiple Ground Pins for Low
Noise Operation
WS128K32V-XG2TX - 8 grams typical
WS128K32V-XG1UX - 5 grams typical
WS128K32V-XH1X - 13 grams typical
This data sheet describes a product that is not fully qualified or
characterized and is subject ot change without notice.
Weight
0 - 7
1
CS
1
BLOCK DIAGRAM
PRELIMINARY*
128K x 8
I / O
8
WE
8 - 1 5
2
CS
White Microelectronics • (602) 437-1520 • www.whiteedc.com
2
128K x 8
I / O
8
WE
1 6 - 2 3
3
CS
3
PIN DESCRIPTION
I/O
WE
CS
A
GND
V
WS128K32V-XXX
NC
OE
0-16
I / O
CC
128K x 8
0-31
1-4
1-4
8
WE
2 4 - 3 1
4
CS
Data Inputs/Outputs
4
Address Inputs
Not Connected
Write Enables
Output Enable
Power Supply
Chip Selects
Ground
4

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WS128K32V Summary of contents

Page 1

... Built-in Decoupling Caps and Multiple Ground Pins for Low Noise Operation Weight WS128K32V-XG2TX - 8 grams typical WS128K32V-XG1UX - 5 grams typical WS128K32V-XH1X - 13 grams typical * This data sheet describes a product that is not fully qualified or characterized and is subject ot change without notice. ** Commercial and Industrial temperature ranges only. ...

Page 2

... FIG. 2 PIN CONFIGURATION FOR WS128K32V-XG2TX AND WS128K32V-XG1UX TOP VIEW I I GND I White Microelectronics • ...

Page 3

... 5MHz 5MHz 8mA -4.0mA WS128K32V-XXX TRUTH TABLE OE WE Mode Data I Standby High Read Data Out X L Write Data Out Disable High Z CAPACITANCE ( Symbol ...

Page 4

... V 1.5V Z (Bipolar Supply) NOTES programmable from -2V to +7V & Tester Impedance typically the midpoint & ATE tester includes jig capacitance. 4 WS128K32V-XXX -20 -25 -35 Min Max Min Max Min Max ...

Page 5

... WHZ DW DATA VALID WRITE CYCLE 1, WE CONTROLLED t WC WS32K32-XHX DATA VALID WRITE CYCLE 2, CS CONTROLLED 5 WS128K32V-XXX CHZ ACS t CLZ OHZ t OLZ DATA VALID HIGH IMPEDANCE READ CYCLE 2 ( ...

Page 6

... ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES White Microelectronics • Phoenix, AZ • (602) 437-1520 27.3 (1.075) 0.25 (0.010) SQ SQUARE PAD ON BOTTOM 4.34 (0.171) MAX 2.54 (0.100) 15.24 (0.600) TYP TYP 25.4 (1.0) TYP 6 WS128K32V-XXX 25.4 (1.0) TYP 1.42 (0.056) 0.13 (0.005) 0.76 (0.030) 0.13 (0.005) 1.27 (0.050) TYP DIA 0.46 (0.018) 0.05 (0.002) DIA ...

Page 7

... The White 68 lead G1U CQFP fills the same fit and function as the JEDEC 68 lead CQFJ or 68 PLCC. But the G1U has the TCE and lead inspection advantage of the CQFP form. 7 White Microelectronics • (602) 437-1520 • www.whiteedc.com WS128K32V-XXX 0.25 (0.010) REF 0.19 (0.007) 0.06 (0.002) 23.87 (0.940) REF 4 ...

Page 8

... H1 = Ceramic Hex-In-line Package, HIP (Package 400) G2T = 22.4mm CQFP (Package 509) G1U = 23.8mm Low Profile CQFP (Package 519) ACCESS TIME (ns) Low Voltage Supply 3.3V 10% IMPROVEMENT MARK Connect at pins 8, 21, 28 HIP for upgrade. ORGANIZATION, 128Kx32 User configurable as 256Kx16 or 512Kx8 SRAM WHITE ELECTRONIC DESIGNS CORP. 8 WS128K32V-XXX ...

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