LA45B-GH-PF LIGITEK [LIGITEK electronics co., ltd.], LA45B-GH-PF Datasheet
LA45B-GH-PF
Related parts for LA45B-GH-PF
LA45B-GH-PF Summary of contents
Page 1
... LED ARRAY DOC REV. DATE LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LA45B/GH-PF DATA SHEET QW0905-LA45B/GH- May - 2007 Pb Lead-Free Parts ...
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... PART NO. LA45B/GH-PF Package Dimensions 4.6 5.0 2.75 □ 0.5 TYP 2.54TYP + LH2640-1-PF LG2640-1-PF Note : 1.All dimension are in millimeter tolerance is ± 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 3.0 ± 0.5 ψ 2.9X2 G ψ 3.4X2 H 3.0 ± 0.5 6.0 ± 0.5 - 2.9 3.1 3.3 4.3 1.5MAX 25.0MIN □ ...
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... PART NO. LA45B/GH-PF Absolute Maximum Ratings at Ta=25 Parameter Forward Current Peak Forward Current Duty 1/10@10KHz Power Dissipation Reverse Current @5V Operating Temperature Storage Temperature Typical Electrical & Optical Characteristics (Ta=25 PART NO MATERIAL Emitted GaP Green LA45B/GH-PF GaP Red Note : 1.The forward voltage data did not including ± 0.1V testing tolerance. ...
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... PART NO. LA45B/GH-PF Typical Electro-Optical Characteristics Curve G CHIP Fig.1 Forward current vs. Forward Voltage 1000 100 10 1.0 0.1 1.0 2.0 3.0 Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature 1.2 1.1 1.0 0.9 0.8 -40 - Ambient Temperature( ℃ ) Fig.5 Relative Intensity vs. Wavelength 1.0 0.5 0.0 500 550 Wavelength (nm) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Fig.2 Relative Intensity vs. Forward Current 3 ...
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... PART NO. LA45B/GH-PF Typical Electro-Optical Characteristics Curve H CHIP Fig.1 Forward current vs. Forward Voltage 1000 100 10 1.0 0.1 1.0 2.0 3.0 Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature 1.2 1.1 1.0 0.9 0.8 -40 - Ambient Temperature( ℃ ) Fig.5 Relative Intensity vs. Wavelength 1.0 0.5 0.0 600 700 800 Wavelength (nm) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Fig.2 Relative Intensity vs. Forward Current 3 ...
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... PART NO. LA45B/GH-PF Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350 °C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to case) 2.Wave Soldering Profile Dip Soldering Preheat: 120° C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260° ...
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... PART NO. LA45B/GH-PF Reliability Test: Test Item 1.Under Room Temperature Operating Life Test 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) High Temperature 1.Ta=105 Storage Test 2.t=1000 hrs (-24hrs, +72hrs) Low Temperature 1.Ta=-40 Storage Test 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=65 High Temperature 2.RH=90 %~95 % High Humidity Test 3.t=240hrs 1.Ta=105 ...