ICX098 SONY [Sony Corporation], ICX098 Datasheet - Page 20

• Manufacturer Part Number: ICX098
• Description: Diagonal 4.5mm (Type 1/4) Progressive Scan CCD Image Sensor with Square Pixel for B/W Cameras
• Manufacturer: SONY [Sony Corporation]

5) Others
b) If a load is applied to the entire surface by a hard component, bending stress may be generated and the
c) The adhesive may cause the marking on the rear surface to disappear, especially in case the regulated
d) The notch of the package is used for directional index, and that can not be used for reference of fixing.
e) If the lead bend repeatedly and the metal, etc., clash or rub against the package, the dust may be
f) Acrylate anaerobic adhesives are generally used to attach CCD image sensors. In addition, cyano-
a) Do not expose to strong light (sun rays) for long periods. For continuous using under cruel condition
b) Exposure to high temperature or humidity will affect the characteristics. Accordingly avoid storage or
c) The brown stain may be seen on the bottom or side of the package. But this does not affect the CCD
d) This package has 2 kinds of internal structure. However, their package outline, optical size, and strength
The cross section of lead frame can be seen on the side of the package for structure A.
package may fracture, etc., depending on the flatness of the bottom of the package. Therefore, for
installation, use either an elastic load, such as a spring plate, or an adhesive.
voltage value is indicated on the rear surface. Therefore, the adhesive should not be applied to this area,
and indicated values should be transferred to the other locations as a precaution.
In addition, the cover glass and seal resin may overlap with the notch of the package.
generated by the fragments of resin.
acrylate instantaneous adhesives are sometimes used jointly with acrylate anaerobic adhesives. (reference)
exceeding the normal using condition, consult our company.
usage in such conditions.
characteristics.
are the same.
Cross section of
lead frame
Structure A
– 20 –
Package
Metal plate
(lead frame)
Chip
Structure B
ICX098AL