MAS9011A1BD08 MAS [Micro Analog systems], MAS9011A1BD08 Datasheet - Page 2

• Manufacturer Part Number: MAS9011A1BD08
• Description: Solar Cell System Manager
• Manufacturer: MAS [Micro Analog systems]

PAD LAYOUT
Note: Make sure that VDD is the first pad to be bonded. Pick-and-place and all component assembly are
recommended to be performed in ESD protected area.
Note: If the die is to be placed on metal plane, the metal plane should be connected to VDD or left floating. This
because the substrate of the die is internally connected to VDD.
Note: Coordinates are pad center points where origin has been located in bottom-left corner of the silicon die.
Pad Identification
Power Supply Ground
Power Supply Voltage
Full Battery Output
Power On Output
Low Battery Output
DIE size = 0.67 mm x 1.43 mm
GND
MAS
9011
PAD size = 80 x 80 µm
PO
670 µm
Name
GND
VDD
SOL
PO
LB
VDD
LB
SOL
X-coordinate
174 µm
334 µm
495 µm
211 µm
462 µm
Y-coordinate
1208 µm
1210 µm
1221 µm
221 µm
221 µm
DA9011.001
28 Jan 2004
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