MAS9188A1UC06 MAS [Micro Analog systems], MAS9188A1UC06 Datasheet - Page 7

• Manufacturer Part Number: MAS9188A1UC06
• Manufacturer: MAS [Micro Analog systems]

SOLDERING INFORMATION
◆ For For Eutectic Sn/Pb TSSOP-20
◆ For Green (Pb Free, RoHS Compliant) TSSOP-20
EMBOSSED TAPE SPECIFICATIONS
Resistance to Soldering Heat
Maximum Temperature
Maximum Number of Reflow Cycles
Reflow profile
Seating Plane Co-planarity
Lead Finish
Resistance to Soldering Heat
Maximum Temperature
Maximum Number of Reflow Cycles
Reflow profile
Seating Plane Co-planarity
Lead Finish
W
Pin1
User Direction of Feed
A
O
P
O
Thermal profile parameters stated in JESD22-A113 should not
Thermal profile parameters stated in IPC/JEDEC J-STD-020
Solder plate 7.62 - 25.4 µm, material Sn 85% Pb 15%
According to RSH test IEC 68-2-58/20 2*220°C
Solder plate 7.62 - 25.4 µm, material Matte Tin
P
should not be exceeded.
2
According to RSH test IEC 68-2-58/20
be exceeded.
P
1
max 0.08 mm
max 0.08 mm
Section X-X
240°C
http://www.jedec.org
260°C
3
3
B
O
D
http://www.jedec.org
O
K
T
O
23 February 2005
X
X
DA9188.002
E
7 (10)
F