AXK7L PANASONIC [Panasonic Semiconductor], AXK7L Datasheet - Page 7

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AXK7L

Manufacturer Part Number
AXK7L
Description
NARROW-PITCH CONNECTORS FOR BOARD-TO-FPC CONNECTION
Manufacturer
PANASONIC [Panasonic Semiconductor]
Datasheet

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NOTES
1. Removal by pulling up from an end
causes the entire connector removal
force to concentrate on the soldering
terminals and end terminals.
Therefore, please lift and remove from
the side. Doing so will also prevent
cracking of the soldered parts.
2. PC Boards and Recommended
Metal Mask Patterns
Connectors are mounted with high
density, with a pitch interval of 0.4 to 0.5
mm.
In order to reduce solder bridge and
other issues make sure the proper levels
of solder are used.
The figures to the right are recommended
metal mask patterns. Please use them as
a reference.
In particular, if a lot of solder is
used in the header retaining
soldering terminals, it might
interfere with and cause incomplete
socket mating. Therefore, please
follow the recommended
conditions give on the right.
Pull
NG
Socket
1.40±0.03
(Terminal portion opening area ratio: 53 %)
(Terminal portion opening area ratio: 66 %)
(Metal portion opening area ratio: 100 %)
(Metal portion opening area ratio: 100 %)
Recommended metal mask pattern
Recommended metal mask pattern
Recommended PC board pattern
(Mount pad arrangement pattern)
Metal mask thickness: Here, 150 µm
Metal mask thickness: Here, 120 µm
1.00±0.03
1.40±0.01
1.00±0.01
1.40±0.01
1.00±0.01
0.20±0.01
0.40±0.01
0.20±0.01
0.40±0.01
0.40±0.03
0.23±0.03
panasonic-electric-works.net/ac
Header
Relation between connector and mounting pad
1.40±0.03
For other details, please verify with
the product specification sheets.
(Terminal portion opening area ratio: 52 %)
(Terminal portion opening area ratio: 66 %)
(Metal portion opening area ratio: 100 %)
Recommended metal mask pattern
Recommended metal mask pattern
(Metal portion opening area ratio: 80 %)
Recommended PC board pattern
(Mount pad arrangement pattern)
Metal mask thickness: Here, 150 µm
Metal mask thickness: Here, 120 µm
(3.20±0.03)
(Max. 2.20)
(4.70±0.03)
: Insulation area
1.40±0.01
0.46±0.01
1.40±0.01
0.57±0.01
0.20±0.01
0.40±0.01
0.40±0.03
0.23±0.03
0.20±0.01
0.40±0.01
AXK7L, 8L
Mounting pad
: Insulation area
0.57±0.03

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