BSH-030-01-F-D-A-TR Samtec, BSH-030-01-F-D-A-TR Datasheet
BSH-030-01-F-D-A-TR
Manufacturer Part Number
BSH-030-01-F-D-A-TR
Description
Manufacturer
Samtec
Datasheet
1.BSH-030-01-F-D-A-TR.pdf
(1 pages)
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
BSH-030-01-F-D-A-TR
Manufacturer:
Samtec Inc.
Quantity:
353
Part Number:
BSH-030-01-F-D-A-TR
Manufacturer:
SAMTEC
Quantity:
20 000
For complete specifi cations and
recommended PCB layouts see
www.samtec.com?BSH
Insulator Material:
Black LCP
Contact Material:
Phosphor Bronze
Plating:
Au or Sn over 50µ" (1,27µm) Ni
Current Rating:
1.25A @ 80°C ambient
Flammability Rating:
UL 94 VO
Operating Temp Range:
-55°C to +125°C
Voltage Rating:
125 VAC
Max Cycles:
100
RoHS Compliant:
Yes
Processing:
Lead-Free Solderable:
Yes
SMT Lead Coplanarity:
(0,10mm) .004" max (030-090)
(0,15mm) .006" max (120-150)
Board Stacking:
For applications requiring
more than two connectors per
board or 90 positions or higher,
contact ipg@samtec.com
*Note: –C Plating passes
10 year MFG testing
Note: Some lengths, styles
and options are non-standard,
non-returnable.
BASIC BLADE & BEAM SOCKET
F-211-1
(0,50mm) .01969"
BSH SERIES
• 30µ" (0,76µm) Gold
• Edge Mount Capability
• 8mm, 11mm, 16mm,
Call Samtec.
SPECIFICATIONS
MATED HEIGHT
19mm and 22mm Stack
Height (Caution: Some
automatic placement/
inspection machines may
have component height
restrictions. Please consult
machinery specifi cations.)
(11mm, 16mm, 19mm and
22mm not available with 50
positions)
*Processing conditions will
affect mated height.
APPLICATION
STYLE
LEAD
–01
SPECIFIC
HEIGHT*
(5,00) .197
MATED
Mates with:
BTH
Mates with:
BTH
BSH
BSH
(6,22)
(3,05)
.120
.245
02
01
(1,32)
.052
No. of Positions x (0,50) .01969
–030, –060, –090
10 year Mixed Flowing Gas with 50µ" Gold
NO. OF POSITIONS
–030, –050, –060,
x
–090, –120, –150
No. of Positions x (0,50) .01969 + (10,88) .428
(1,10)
.043
EXTENDED LIFE PRODUCT
Call Samtec for maximum cycles
NO. OF POSITIONS
+ (6,27) .247
PER ROW
.01969
(0,50)
PER ROW
(0,15)
.006
WWW.SAMTEC.COM
(0,15)
.006
TM
(3,25)
.128
(3,81)
.150
BSH–060–01–F–D–A
01
(7,24)
.01969
.285
(0,50)
= 10µ" (0,25µm) Gold on contact, Matte Tin on tail
BSH–060–01–F–D–RA–WT
(0,89)
01
.035
DIA
= Gold Flash on contact, Matte Tin on tail
PLATING
OPTION
50µ" (1,27µm) min Au over 150µ" (3,81µm)
10µ" (0,25µm) min Au over 50µ" (1,27µm)
= Gold Flash on contact, Matte Tin on tail
02
Ni on Ground Plane in contact area,
Ni on Signal Pins in contact area,
(0,76)
= 10µ" (0,25µm) Gold on contact,
Matte Tin over 50µ" (1,27µm) min
.030
01
= Electro-Polished Selective
PLATING
OPTION
(7,24)
(13,59)
(13
(1,32)
.285
.052
DIA
.535
.5
–F
–L
Ni on all solder tails
Matte Tin on tail
D
–C*
BSH–090–01–L–D–A
–F
–L
ANALYZER TEST POINT
RA
(8,82)
.347
(0,64)
AGILENT LOGIC
.025
D
Specify: ASP-65067-01
SQ
CONNECTOR
BSH–030–01–L–D–RA–WT
WT
A
= Guide Post
(120 positions
= Tape & Reel
maximum)
–GP
OPTION
OTHER
OPTION
–TR
OTHER
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