IC RCVR/DRVR ECL DIFF 5V 8TSSOP

MC100EP16DTG

Manufacturer Part NumberMC100EP16DTG
DescriptionIC RCVR/DRVR ECL DIFF 5V 8TSSOP
ManufacturerON Semiconductor
Series100EP
MC100EP16DTG datasheet
 


Specifications of MC100EP16DTG

Logic TypeDifferential Receiver/DriverSupply Voltage3 V ~ 5.5 V
Operating Temperature-40°C ~ 85°CMounting TypeSurface Mount
Package / Case8-TSSOPLogic Family100EP
Maximum Operating Temperature+ 85 CFunctionLine Transmitter / Receiver
Minimum Operating Temperature- 40 CMounting StyleSMD/SMT
Lead Free Status / RoHS StatusLead free / RoHS CompliantNumber Of Bits-
Other namesMC100EP16DTGOS  
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K
8x
REF
0.10 (0.004)
0.15 (0.006) T
U
S
L/2
2X
8
5
B
L
−U−
1
4
PIN 1
IDENT
0.15 (0.006) T
U
S
A
−V−
C
0.10 (0.004)
D
−T−
G
SEATING
PLANE
PACKAGE DIMENSIONS
TSSOP−8
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948R−02
ISSUE A
T
U
V
M
S
S
0.25 (0.010)
M
F
DETAIL E
−W−
DETAIL E
http://onsemi.com
10
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
5. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
6. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE -W-.
MILLIMETERS
INCHES
DIM
MIN
MAX
MIN
MAX
A
2.90
3.10
0.114
0.122
B
2.90
3.10
0.114
0.122
C
0.80
1.10
0.031
0.043
D
0.05
0.15
0.002
0.006
F
0.40
0.70
0.016
0.028
G
0.65 BSC
0.026 BSC
K
0.25
0.40
0.010
0.016
L
4.90 BSC
0.193 BSC
_
_
_
_
M
0
6
0
6