MC10H330P ON Semiconductor, MC10H330P Datasheet - Page 5

• Manufacturer Part Number: MC10H330P
• Description: IC DRIVER/RCVR QUAD BUS 24-DIP
• Manufacturer: ON Semiconductor
• Series: 10Hr

Specifications of MC10H330P

• Logic Type: Driver/Receiver
• Number Of Bits: 4
• Operating Temperature: 0°C ~ 75°C
• Mounting Type: Through Hole
• Package / Case: 24-DIP (0.300", 7.62mm)
• Logic Family: 10H
• Supply Voltage (min): 8 V
• Maximum Operating Temperature: 5 C
• Mounting Style: Through Hole
• Minimum Operating Temperature: 0 C
• Supply Current: 157 mA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Supply Voltage: -
• Lead Free Status / Rohs Status: No

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D
SEATING
PLANE
ON Semiconductor and
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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−T−
24 PL
0.25 (0.010)
24
1
24
1
G
M
T A
E
G
M
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
−A−
−A−
F
D
F
24 PL
0.25 (0.010)
13
12
12
13
N
N
−B−
K
M
C
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Japan: ON Semiconductor, Japan Customer Focus Center
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
Phone: 81−3−5773−3850
T
PACKAGE DIMENSIONS
K
CERAMIC DIP PACKAGE
PLASTIC DIP PACKAGE
A
B
C
http://onsemi.com
M
CASE 758−02
CASE 724−03
J
L SUFFIX
−T−
P SUFFIX
CDIP−24
ISSUE A
PDIP−24
ISSUE D
24 PL
L
0.25 (0.010)
L
J
5
SEATING
PLANE
NOTE 1
M
M
T
B
P
M
NOTES:
1. CHAMFERED CONTOUR OPTIONAL.
2. DIMENSION L TO CENTER OF LEADS WHEN
3. DIMENSIONING AND TOLERANCING PER ANSI
4. CONTROLLING DIMENSION: INCH.
FORMED PARALLEL.
Y14.5M, 1982.
DIM
NOTES:
A
B
C
D
G
K
M
N
E
F
J
L
ON Semiconductor Website: http://onsemi.com
Order Literature: http://www.onsemi.com/litorder
For additional information, please contact your
local Sales Representative.
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
Y14.5M, 1982.
FORMED PARALLEL.
1.230
0.250
0.145
0.015
0.040
0.007
0.020
0.110
DIM
MIN
G
A
B
C
D
F
J
K
L
N
P
0.050 BSC
0.100 BSC
0.300 BSC
0
INCHES
_
1.240
0.285
0.160
0.015
0.045
0.008
0.100
0.300
0.020
0.360
MIN
1.265
0.270
0.175
0.020
0.060
0.012
0.140
0.040
0.100 BSC
MAX
INCHES
15
_
1.285
0.305
0.200
0.021
0.062
0.013
0.165
0.310
0.050
0.400
MAX
31.25
MILLIMETERS
MIN
6.35
3.69
0.38
1.02
0.18
2.80
0.51
1.27 BSC
2.54 BSC
7.62 BSC
0
_
31.50
MILLIMETERS
MIN
7.24
4.07
0.38
1.14
0.20
2.54
7.62
0.51
9.14
32.13
MAX
MC10H330/D
2.54 BSC
6.85
4.44
0.51
1.52
0.30
3.55
1.01
15
_
32.64
10.16
MAX
7.75
5.08
0.53
1.57
0.33
4.19
7.87
1.27