MAX1139LEEE-T Maxim Integrated, MAX1139LEEE-T Datasheet - Page 2

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MAX1139LEEE-T

Manufacturer Part Number
MAX1139LEEE-T
Description
Analog to Digital Converters - ADC
Manufacturer
Maxim Integrated
Datasheet

Specifications of MAX1139LEEE-T

Number Of Channels
12/6
Architecture
SAR
Conversion Rate
94.4 KSPs
Resolution
10 bit
Input Type
Single-Ended/Differential
Snr
Yes
Interface Type
I2C
Operating Supply Voltage
2.7 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Package / Case
QSOP-16
Maximum Power Dissipation
666.7 mW
Minimum Operating Temperature
- 40 C
Number Of Converters
1
Voltage Reference
Internal 2.048 V
ABSOLUTE MAXIMUM RATINGS
V
AIN0–AIN11,
SDA, SCL to GND.....................................................-0.3V to +6V
Maximum Current Into Any Pin .........................................±50mA
Continuous Power Dissipation (T
2.7V to 3.6V and 4.5V to 5.5V, Low-Power,
4-/12-Channel, 2-Wire Serial 10-Bit ADCs
ELECTRICAL CHARACTERISTICS
(V
4.096V (MAX1136/MAX1138), f
Tables 1–5 for programming notation.)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
2
DD
DC ACCURACY (Note 1)
Resolution
Relative Accuracy
Differential Nonlinearity
Offset Error
Offset-Error Temperature
Coefficient
Gain Error
Gain-Temperature Coefficient
Channel-to-Channel Offset
Matching
Channel-to-Channel Gain
Matching
DYNAMIC PERFORMANCE (f
Signal-to-Noise Plus Distortion
Total Harmonic Distortion
Spurious Free Dynamic Range
Full-Power Bandwidth
Full-Linear Bandwidth
CONVERSION RATE
Conversion Time (Note 4)
Throughput Rate
Track/Hold Acquisition Time
DD
REF to GND ............-0.3V to the lower of (V
8-Pin µMAX (derate 5.9mW/°C above +70°C) ..........470.6mW
16-Pin QSOP (derate 8.3mW/°C above +70°C)........666.7mW
_______________________________________________________________________________________
to GND ..............................................................-0.3V to +6V
= 2.7V to 3.6V (MAX1137/MAX1139), V
PARAMETER
SCL
IN(SINE-WAVE)
A
= +70°C)
= 1.7MHz, T
SYMBOL
f
SAMPLE
SINAD
t
SFDR
CONV
DNL
THD
INL
DD
DD
= 10kHz, V
+ 0.3V) and 6V
A
= 4.5V to 5.5V (MAX1136/MAX1138), V
(Note 2)
No missing codes over temperature
Relative to FSR
(Note 3)
Relative to FSR
Up to the 5th harmonic
SINAD > 57dB
-3dB point
Internal clock
External clock
Internal clock, SCAN[1:0] = 01
Internal clock, SCAN[1:0] = 00
CS[3:0] = 1011 (MAX1138/MAX1139)
External clock
= T
MIN
IN(P-P)
to T
MAX
= V
CONDITIONS
, unless otherwise noted. Typical values are at T
REF
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-60°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
, f
SAMPLE
= 94.4ksps)
REF
= 2.048V (MAX1137/MAX1139), V
MIN
10.6
800
10
±0.1
TYP
±0.1
94.4
0.3
0.3
-70
3.0
5.0
60
70
53
53
A
MAX
±1
±1
±1
6.8
±1
= +25°C. See
ppm/°C
ppm/°C
UNITS
MHz
MHz
ksps
LSB
LSB
LSB
LSB
LSB
LSB
Bits
dB
dB
REF
dB
µs
ns
=

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