STM32F050K6U6 STMicroelectronics, STM32F050K6U6 Datasheet - Page 31

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STM32F050K6U6

Manufacturer Part Number
STM32F050K6U6
Description
ARM Microcontrollers - MCU Entry-level ARM Cortex-M0 MCU 32Kb
Manufacturer
STMicroelectronics
Datasheet

Specifications of STM32F050K6U6

Rohs
yes

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1. Drawing is not to scale.
2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life.
3. There is an exposed die pad on the underside of the UFQFPN package. This pad is used for the device ground and must be
4. Dimensions are in millimeters.
STM32F050xx
Table 11.
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Figure 8.
connected. It is referred to as pin 0 in
Dim.
ddd
D2
A1
A3
E2
A
D
E
N
b
e
L
Seating plane
Pin # 1 ID
R = 0.30
C
E2
A3
UFQFPN32 - 32-lead ultra thin fine pitch quad flat no-lead package (5 x 5),
UFQFPN32 - 32-lead ultra thin fine pitch
quad flat no-lead package outline
(5 x 5)
package mechanical data
b
8
1
32
9
0.00
0.18
4.90
4.90
3.40
0.30
Min
0.5
(1)(2)(3)
e
Bottom view
D2
D
16
Table 6: Pin
0.152
0.500
L
0.55
0.02
0.23
5.00
3.50
5.00
3.50
0.40
0.08
mm
Typ
17
24
L
A1
E
A
Doc ID 022717 Rev 2
definitions.
ddd C
A0B8_ME
Max
0.05
0.28
5.10
5.10
3.60
0.50
0.6
Number of pins
32
Figure 9.
0.0197
0.0071
0.1929
0.1929
0.1339
0.0118
Min
0
UFQFPN32 recommended
footprint
inches
0.0217
0.0008
0.0091
0.1969
0.1378
0.1969
0.1378
0.0197
0.0157
0.0031
Package characteristics
0.006
Typ
(1)(4)
(1)
0.0110
0.0236
0.0020
0.2008
0.2008
0.1417
0.0197
Max
31/31

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