STM32L152C6U6 STMicroelectronics, STM32L152C6U6 Datasheet

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STM32L152C6U6

Manufacturer Part Number
STM32L152C6U6
Description
ARM Microcontrollers - MCU 32-Bit ARM Cortex 32kb LP LCD MCU
Manufacturer
STMicroelectronics
Datasheet

Specifications of STM32L152C6U6

Product Category
ARM Microcontrollers - MCU
Rohs
yes
Core
ARM Cortex M3
Data Bus Width
32 bit

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Features
February 2013
This is information on a product in full production.
128KB Flash, 16KB SRAM, 4KB EEPROM, LCD, USB, ADC, DAC
Ultra-low-power platform
– 1.65 V to 3.6 V power supply
– -40°C to 85°C/105°C temperature range
– 0.3 µA Standby mode (3 wakeup pins)
– 0.9 µA Standby mode + RTC
– 0.57 µA Stop mode (16 wakeup lines)
– 1.2 µA Stop mode + RTC
– 9 µA Low-power Run mode
– 214 µA/MHz Run mode
– 10 nA ultra-low I/O leakage
– < 8 µs wakeup time
Core: ARM 32-bit Cortex
– From 32 kHz up to 32 MHz max
– 33.3 DMIPS peak (Dhrystone 2.1)
– Memory protection unit
Reset and supply management
– Ultra-safe, low-power BOR (brownout
– Ultra-low-power POR/PDR
– Programmable voltage detector (PVD)
Clock sources
– 1 to 24 MHz crystal oscillator
– 32 kHz oscillator for RTC with calibration
– High Speed Internal 16 MHz factory-
– Internal Low Power 37 kHz RC
– Internal multispeed low power 65 kHz to
– PLL for CPU clock and USB (48 MHz)
Pre-programmed bootloader
– USART supported
Development support
– Serial wire debug supported
– JTAG and trace supported
Up to 83 fast I/Os (73 I/Os 5V tolerant), all
mappable on 16 external interrupt vectors
reset) with 5 selectable thresholds
trimmed RC (+/- 1%)
4.2 MHz
Ultra-low-power 32-bit MCU ARM-based Cortex-M3,
-M3 CPU
Doc ID 17659 Rev 8
Table 1.
STM32L151xx
STM32L152xx
Reference
LQFP100 14 × 14 mm
LQFP64 10 × 10 mm
LQFP48 7 × 7 mm
Memories
– Up to 128 KB Flash with ECC
– Up to 16 KB RAM
– Up to 4 KB of true EEPROM with ECC
– 80 Byte Backup Register
LCD Driver for up to 8x40 segments
– Support contrast adjustment
– Support blinking mode
– Step-up converter on board
Rich analog peripherals (down to 1.8 V)
– 12-bit ADC 1 Msps up to 24 channels
– 12-bit DAC 2 channels with output buffers
– 2x Ultra-low-power-comparators
DMA controller 7x channels
8x peripherals communication interface
– 1x USB 2.0 (internal 48 MHz PLL)
– 3x USART (ISO 7816, IrDA)
– 2x SPI 16 Mbits/s
– 2x I2C (SMBus/PMBus)
10x timers: 6x 16-bit with up to 4 IC/OC/PWM
channels, 2x 16-bit basic timer, 2x watchdog
timers (independent and window)
Up to 20 capacitive sensing channels
supporting touchkey, linear and rotary touch
sensors
CRC calculation unit, 96-bit unique ID
(window mode and wake up capability)
STM32L15xx6/8/B
Device summary
STM32L151CB, STM32L151C8, STM32L151C6,
STM32L151RB, STM32L151R8, STM32L151R6,
STM32L151VB, STM32L151V8
STM32L152CB, STM32L152C8, STM32L152C6,
STM32L152RB, STM32L152R8, STM32L152R6,
STM32L152VB, STM32L152V8
BGA100 7 × 7 mm
BGA64 5 × 5 mm
Datasheet
Part number
production data
UFQFPN48
7 × 7 mm
www.st.com
1/121
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STM32L152C6U6 Summary of contents

Page 1

Ultra-low-power 32-bit MCU ARM-based Cortex-M3, 128KB Flash, 16KB SRAM, 4KB EEPROM, LCD, USB, ADC, DAC Features ■ Ultra-low-power platform – 1. 3.6 V power supply – -40°C to 85°C/105°C temperature range – 0.3 µA Standby mode (3 wakeup ...

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Contents Contents 1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

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STM32L151x6/8/B, STM32L152x6/8/B 3.15.1 3.15.2 3.15.3 3.15.4 3.15.5 3.16 Communication interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

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Contents 6.3.10 6.3.11 6.3.12 6.3.13 6.3.14 6.3.15 6.3.16 6.3.17 6.3.18 6.3.19 6.3.20 7 Package characteristics . . . . . . . . . . . . . . . . . . . . . . . . . ...

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STM32L151x6/8/B, STM32L152x6/8/B List of tables Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

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List of tables Table 48. SCL frequency (f Table 49. SPI characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

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STM32L151x6/8/B, STM32L152x6/8/B List of figures Figure 1. Ultra-low-power STM32L15xxx block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

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... The document "Getting started with STM32L1xxx hardware development" AN3216 gives a hardware implementation overview. The both documents are available from the STMicroelectronics website www.st.com. For information on the Cortex™-M3 core please refer to the Cortex™-M3 Technical Reference Manual, available from the www.arm.com website at the following address: http://infocenter ...

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STM32L151x6/8/B, STM32L152x6/8/B 2 Description The ultra-low-power STM32L15xxx incorporates the connectivity power of the universal serial bus (USB) with the high-performance ARM Cortex a 32 MHz frequency, a memory protection unit (MPU), high-speed embedded memories (Flash memory up to 128 Kbytes ...

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Description 2.1 Device overview Table 2. Ultra-low-power STM32L15xxx device features and peripheral counts Peripheral Flash (Kbytes) Data EEPROM (Kbytes) RAM (Kbytes) General- purpose Timers Basic SPI Communication interfaces USART USB GPIOs 12-bit synchronized ADC Number of channels ...

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... STMicroelectronics microcontrollers ultra-low-power strategy which also includes STM8L101xx and STM8L15xx devices. The STM8L and STM32L families allow a continuum of performance, peripherals, system architecture and features. They are all based on STMicroelectronics ultralow leakage process. Note: The ultra-low-power STM32L and general-purpose STM32Fxxxx families are pin-to-pin compatible ...

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Functional overview 3 Functional overview Figure 1 shows the block diagrams. Figure 1. Ultra-low-power STM32L15xxx block diagram NJT CK/ S WCLK JTMS /S WDAT JTDO NRST UTPU T ...

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STM32L151x6/8/B, STM32L152x6/8/B 3.1 Low power modes The ultra-low-power STM32L15xxx supports dynamic voltage scaling to optimize its power consumption in run mode. The voltage from the internal low-drop regulator that supplies the logic can be adjusted according to the system’s maximum ...

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Functional overview Comparator 1 event or Comparator 2 event (if internal reference voltage is on). It can also be wakened by the USB wakeup. Stop mode consumption: refer to ● Standby mode with RTC Standby mode is used to achieve ...

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STM32L151x6/8/B, STM32L152x6/8/B Table 4. CPU frequency range depending on dynamic voltage scaling CPU frequency range 16 MHz to 32 MHz (1ws) 32 kHz to 16 MHz (0ws) 8 MHz to 16 MHz (1ws) 32 kHz to 8 MHz (0ws) 2.1 ...

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Functional overview Table 5. Functionalities depending on the working mode (from Run/active down to standby) Ips Run/Active CPU Y Flash Y RAM Y Backup Registers Y EEPROM Y Brown-out rest Y (BOR) DMA Y Programable Voltage Detector Y (PVD) Power ...

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STM32L151x6/8/B, STM32L152x6/8/B Table 5. Functionalities depending on the working mode (from Run/active down to standby) (continued) Ips Run/Active ADC Y DAC Y Tempsensor Y Comparators Y 16-bit and 32-bit Y Timers IWDG Y WWDG Y Touch sensing Y Systic Timer ...

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Functional overview Nested vectored interrupt controller (NVIC) The ultra-low-power STM32L15xxx embeds a nested vectored interrupt controller able to handle maskable interrupt channels (not including the 16 interrupt lines of Cortex™-M3) and 16 priority levels. ● Closely coupled ...

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STM32L151x6/8/B, STM32L152x6/8/B Five BOR thresholds are available through option bytes, starting from 1 reduce the power consumption in Stop mode possible to automatically switch off the internal reference voltage ( below ...

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Functional overview 3.4 Clock management The clock controller distributes the clocks coming from different oscillators to the core and the peripherals. It also manages clock gating for low power modes and ensures clock robustness. It features: ● Clock prescaler: to ...

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STM32L151x6/8/B, STM32L152x6/8/B Figure 2. Clock tree OSC_OUT 1-24 MHz HSE OSC OSC_IN OSC32_IN LSE OSC 32.768 kHz OSC32_OUT MCO 2. For the USB function to be available, both HSE and PLL must be enabled, with the CPU running at either ...

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Functional overview 3.5 Low power real-time clock and backup registers The real-time clock (RTC independent BCD timer/counter. Dedicated registers contain the second, minute, hour (12/24 hour), week day, date, month, year, in BCD (binary-coded decimal) format. Correction for ...

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STM32L151x6/8/B, STM32L152x6/8/B 3.7 Memories The STM32L15xxx devices have the following features: ● Kbyte of embedded RAM accessed (read/write) at CPU clock speed with 0 wait states. With the enhanced bus matrix, operating the RAM does not lead ...

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Functional overview 3.10 ADC (analog-to-digital converter) A 12-bit analog-to-digital converters is embedded into STM32L15xxx devices with external channels, performing conversions in single-shot or scan mode. In scan mode, automatic conversion is performed on a selected group of ...

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STM32L151x6/8/B, STM32L152x6/8/B 3.10.2 Internal voltage reference (V The internal voltage reference (V ADC and Comparators. V enables accurate monitoring of the V available for ADC). The precise voltage during production test and stored in the system memory ...

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Functional overview Both comparators can wake up from Stop mode, and be combined into a window comparator. The internal reference voltage is available externally via a low power / low current output buffer (driving current capability of 1 µA typical). ...

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STM32L151x6/8/B, STM32L152x6/8/B Table 8. Timer feature comparison Counter Timer resolution TIM10, 16-bit TIM11 TIM6, 16-bit TIM7 Counter Prescaler DMA request type factor generation Any integer Up between 1 No and 65536 Any integer Up between 1 Yes and 65536 Doc ...

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Functional overview 3.15.1 General-purpose timers (TIM2, TIM3, TIM4, TIM9, TIM10 and TIM11) There are six synchronizable general-purpose timers embedded in the STM32L15xxx devices (see Table 8 TIM2, TIM3, TIM4 These timers are based on a 16-bit auto-reload up/downcounter and a ...

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STM32L151x6/8/B, STM32L152x6/8/B 3.15.5 Window watchdog (WWDG) The window watchdog is based on a 7-bit downcounter that can be set as free-running. It can be used as a watchdog to reset the device when a problem occurs clocked from ...

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Functional overview 3.17 CRC (cyclic redundancy check) calculation unit The CRC (cyclic redundancy check) calculation unit is used to get a CRC code from a 32-bit data word and a fixed generator polynomial. Among other applications, CRC-based techniques are used ...

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STM32L151x6/8/B, STM32L152x6/8/B 4 Pin descriptions Figure 3. STM32L15xVx UFBGA100 ballout 1 PE3 A B PE4 C PC13 WKUP2 D PC14 OSC32_IN E PC15 OSC32_OUT F PH0 OSC_IN G PH1 OSC_OUT H PC0 J VSSA K VREF- L VREF+ M VDDA ...

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Pin descriptions Figure 4. STM32L15xVx LQFP100 pinout PE2 PE3 PE4 PE5 PE6-WKUP3 V LCD PC13-WKUP2 PC14-OSC32_IN PC15-OSC32_OUT VSS_5 VDD_5 PH0-OSC_IN PH1-OSC_OUT NRST PC0 PC1 PC2 PC3 VSSA VREF- VREF+ VDDA PA0-WKUP1 PA1 PA2 1. This figure shows the package top ...

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STM32L151x6/8/B, STM32L152x6/8/B Figure 5. STM32L15xRx TFBGA64 ballout 1 PC14- A OSC32_IN PC15- B OSC32_OUT PH0- C OSC_IN PH1- D OSC_OUT E NRST V SSA F V REF DDA 1. This figure shows the package top view. 2 ...

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Pin descriptions Figure 6. STM32L15xRx LQFP64 pinout PC14-OSC32_IN PC15-OSC32_OUT PH1- OSC_OUT 1. This figure shows the package top view. Figure 7. STM32L15xCx LQFP48 pinout PC14-OSC32_IN PC15-OSC32_OUT 1. This figure shows the package top view. 34/121 ...

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STM32L151x6/8/B, STM32L152x6/8/B Figure 8. STM32L15xCx UFQFPN48 pinout V LCD PC13-WKUP2 PC14-OSC32_IN PC15-OSC32_OUT PH0-OSC_IN PH1-OSC_OUT NRST V SSA V DDA PA0-WKUP1 PA1 PA2 1. This figure shows the package top view ...

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Pin descriptions Table 9. STM32L15xxx pin definitions Pins Pin name PE2 PE3 PE4 PE5 PE6-WKUP3 I ...

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STM32L151x6/8/B, STM32L152x6/8/B Table 9. STM32L15xxx pin definitions (continued) Pins Pin name PA2 PA3 SS_4 DD_4 ...

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Pin descriptions Table 9. STM32L15xxx pin definitions (continued) Pins Pin name F12 23 V SS_1 G12 24 V DD_1 L12 25 PB12 K12 26 PB13 ...

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STM32L151x6/8/B, STM32L152x6/8/B Table 9. STM32L15xxx pin definitions (continued) Pins Pin name G11 36 V DD_2 A10 37 PA14 PA15 B11 - PC10 C10 ...

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Pin descriptions Table 9. STM32L15xxx pin definitions (continued) Pins Pin name SS_3 100 DD_3 input output supply ...

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Table 10. Alternate function input/output AFIO0 AFIO1 AFIO2 AFIO3 Port name SYSTEM TIM2 TIM3/4 TIM9/10/11 BOOT0 BOOT0 NRST NRST TIM2_CH1_ PA0-WKUP1 WKUP1 ETR PA1 TIM2_CH2 PA2 TIM2_CH3 TIM9_CH1 PA3 TIM2_CH4 TIM9_CH2 PA4 TIM2_CH1_ PA5 ETR PA6 TIM3_CH1 TIM10_CH1 PA7 TIM3_CH2 ...

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Table 10. Alternate function input/output (continued) AFIO0 AFIO1 AFIO2 AFIO3 Port name SYSTEM TIM2 TIM3/4 TIM9/10/11 TIM2_CH1_ PA15 JTDI ETR PB0 TIM3_CH3 PB1 TIM3_CH4 PB2 BOOT1 PB3 JTDO TIM2_CH2 PB4 JTRST TIM3_CH1 PB5 TIM3_CH2 PB6 TIM4_CH1 PB7 TIM4_CH2 PB8 TIM4_CH3 ...

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Table 10. Alternate function input/output (continued) AFIO0 AFIO1 AFIO2 AFIO3 Port name SYSTEM TIM2 TIM3/4 TIM9/10/11 PC2 PC3 PC4 PC5 PC6 TIM3_CH1 PC7 TIM3_CH2 PC8 TIM3_CH3 PC9 TIM3_CH4 PC10 PC11 PC12 RTC_TAMP1/ PC13- RTC_TS/ WKUP2 RTC_OUT/ WKUP2 PC14- OSC32_IN OSC32_IN ...

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Table 10. Alternate function input/output (continued) AFIO0 AFIO1 AFIO2 AFIO3 Port name SYSTEM TIM2 TIM3/4 TIM9/10/11 PD2 TIM3_ETR PD3 PD4 PD5 PD6 PD7 TIM9_CH2 PD8 PD9 PD10 PD11 PD12 TIM4_CH1 PD13 TIM4_CH2 PD14 TIM4_CH3 PD15 TIM4_CH4 PE0 TIM4_ETR TIM10_CH1 PE1 ...

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Table 10. Alternate function input/output (continued) AFIO0 AFIO1 AFIO2 AFIO3 Port name SYSTEM TIM2 TIM3/4 TIM9/10/11 PE4 TRACED1 TIM3_CH2 PE5 TRACED2 TIM9_CH1* TRACED3 / PE6 TIM9_CH2* WKUP3 PE7 PE8 TIM2_CH1_ PE9 ETR PE10 TIM2_CH2 PE11 TIM2_CH3 PE12 TIM2_CH4 PE13 PE14 ...

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Memory mapping 5 Memory mapping The memory map is shown in the following figure. Figure 9. Memory map 0xFFFF FFFF 7 0xE010 0000 Cortex- M3 Internal Peripherals 0xE000 0000 6 0xC000 0000 5 0xA000 0000 4 0x8000 0000 3 0x6000 ...

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STM32L151x6/8/B, STM32L152x6/8/B 6 Electrical characteristics 6.1 Parameter conditions Unless otherwise specified, all voltages are referenced to V 6.1.1 Minimum and maximum values Unless otherwise specified the minimum and maximum values are guaranteed in the worst conditions of ambient temperature, supply ...

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Electrical characteristics 6.1.6 Power supply scheme Figure 12. Power supply scheme 11 × 100 × 4.7 µ µ µF 6.1.7 Current consumption measurement Figure 13. Current consumption measurement scheme ...

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STM32L151x6/8/B, STM32L152x6/8/B 6.2 Absolute maximum ratings Stresses above the absolute maximum ratings listed in Table 12: Current permanent damage to the device. These are stress ratings only and functional operation of the device at these conditions is not implied. Exposure ...

Page 50

Electrical characteristics Table 13. Thermal characteristics Symbol T STG T J 6.3 Operating conditions 6.3.1 General operating conditions Table 14. General operating conditions Symbol f Internal AHB clock frequency HCLK f Internal APB1 clock frequency PCLK1 f Internal APB2 clock ...

Page 51

STM32L151x6/8/B, STM32L152x6/8/B 6.3.2 Embedded reset and power control block characteristics The parameters given in the following table are derived from the tests performed under the ambient temperature condition summarized in Table 15. Embedded reset and power control block characteristics Symbol ...

Page 52

Electrical characteristics Table 15. Embedded reset and power control block characteristics (continued) Symbol Parameter V PVD threshold 6 PVD6 V Hysteresis voltage hyst 1. Guaranteed by characterisation, not tested in production. 2. Valid for device version without BOR at power ...

Page 53

STM32L151x6/8/B, STM32L152x6/8/B 6.3.3 Embedded internal reference voltage The parameters given in specified. Table 16. Embedded internal reference voltage Symbol Parameter (1) V Internal reference voltage REFINT out Internal reference current I REFINT consumption T Internal reference startup time VREFINT V ...

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Electrical characteristics 6.3.4 Supply current characteristics The current consumption is a function of several parameters and factors such as the operating voltage, ambient temperature, I/O pin loading, device software configuration, operating frequencies, I/O pin switching rate, program location in memory ...

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STM32L151x6/8/B, STM32L152x6/8/B Table 18. Current consumption in Run mode, code with data processing running from RAM Symbol Parameter HSE MHz, included HSE above 8 MHz (PLL ON) Supply current in Run ...

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Electrical characteristics Table 19. Current consumption in Sleep mode Symbol Parameter HSE HCLK 16 MHz included HSE HCLK above 16 MHz (PLL Supply (2) ON) current in Sleep mode, code executed from RAM, Flash ...

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STM32L151x6/8/B, STM32L152x6/8/B 1. Based on characterization, not tested in production, unless otherwise specified. 2. Oscillator bypassed (HSEBYP = 1 in RCC_CR register) 3. Tested in production Table 20. Current consumption in Low power run mode Symbol Parameter All peripherals OFF, ...

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Electrical characteristics Table 21. Current consumption in Low power sleep mode Symbol Parameter Supply current in I (LP DD Low power Sleep) sleep mode Max allowed I Max current in DD (LP Sleep) Low power Sleep mode 1. Based on ...

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STM32L151x6/8/B, STM32L152x6/8/B Table 22. Typical and maximum current consumptions in Stop mode Symbol Parameter Supply current (Stop Stop mode with with RTC) RTC enabled Conditions LCD OFF RTC clocked by LSI, regulator in LP mode, HSI and ...

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Electrical characteristics Table 22. Typical and maximum current consumptions in Stop mode Symbol Parameter Supply current in I Stop mode ( DD (Stop) RTC disabled) RMS (root mean square) supply I current during DD (WU wakeup time from Stop) when ...

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STM32L151x6/8/B, STM32L152x6/8/B Table 23. Typical and maximum current consumptions in Standby mode Symbol Parameter I DD Supply current in Standby (Standby mode with RTC enabled with RTC) I Supply current in Standby DD mode with RTC disabled (Standby) RMS supply ...

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Electrical characteristics Wakeup time from Low power mode The wakeup times given in the following table are measured with the MSI RC oscillator. The clock source used to wake up the device depends on the current operating mode: ● Sleep ...

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STM32L151x6/8/B, STM32L152x6/8/B On-chip peripheral current consumption The current consumption of the on-chip peripherals is given in the following table. The MCU is placed under the following conditions: ● all I/O pins are in input mode with a static value at ...

Page 64

Electrical characteristics Table 25. Peripheral current consumption Peripheral SYSCFG & RI TIM9 TIM10 APB2 TIM11 ADC SPI1 USART1 GPIOA GPIOB GPIOC GPIOD AHB GPIOE GPIOH CRC FLASH DMA1 All enabled I DD (RTC (LCD) ( (ADC) ...

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STM32L151x6/8/B, STM32L152x6/8/B 4. Data based on a differential I conversion Including supply current of internal reference voltage. 6.3.5 External clock source characteristics High-speed external user clock generated from an external source Table 26. High-speed external user ...

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Electrical characteristics Low-speed external user clock generated from an external source The characteristics given in the following table result from tests performed using a low- speed external clock source, and under ambient temperature and supply voltage conditions summarized in Table ...

Page 67

STM32L151x6/8/B, STM32L152x6/8/B Figure 15. High-speed external clock source AC timing diagram V HSEH 90% 10% V HSEL t r(HSE) EXTER NAL CLOCK SOURC E High-speed external clock generated from a crystal/ceramic resonator The high-speed external (HSE) clock can be supplied ...

Page 68

Electrical characteristics Table 28. HSE 1-24 MHz oscillator characteristics Symbol f Oscillator frequency OSC_IN R Feedback resistor F Recommended load capacitance versus C equivalent serial resistance of the crystal (R I HSE driving current HSE HSE oscillator power I DD(HSE) ...

Page 69

STM32L151x6/8/B, STM32L152x6/8/B Figure 16. HSE oscillator circuit diagram Resonator 1. R value depends on the crystal characteristics. EXT Low-speed external clock generated from a crystal/ceramic resonator The low-speed external (LSE) clock can ...

Page 70

Electrical characteristics Note: For C and recommended to use high-quality ceramic capacitors in the range selected to match the requirements of the crystal or resonator (see C and C ...

Page 71

STM32L151x6/8/B, STM32L152x6/8/B 6.3.6 Internal clock source characteristics The parameters given in temperature and V High-speed internal (HSI) RC oscillator Table 30. HSI oscillator characteristics Symbol Parameter f Frequency HSI HSI user-trimmed (1)(2) TRIM resolution Accuracy of the (2) ACC factory-calibrated ...

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Electrical characteristics Multi-speed internal (MSI) RC oscillator Table 32. MSI oscillator characteristics Symbol Frequency after factory calibration, done at f MSI V DD ACC Frequency error after factory calibration MSI MSI oscillator frequency drift (1) D TEMP(MSI) 0 °C ≤ ...

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STM32L151x6/8/B, STM32L152x6/8/B Table 32. MSI oscillator characteristics (continued) Symbol (2) t MSI oscillator stabilization time STAB(MSI) f MSI oscillator frequency overshoot OVER(MSI) 1. This is a deviation for an individual part, once the initial frequency has been measured. 2. Based ...

Page 74

Electrical characteristics 6.3.8 Memory characteristics The characteristics are given at T RAM memory Table 34. RAM and hardware registers Symbol Parameter VRM Data retention mode 1. Minimum supply voltage without losing data stored in RAM (in Stop mode or under ...

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STM32L151x6/8/B, STM32L152x6/8/B Table 36. Flash memory, data EEPROM endurance and data retention Symbol Cycling (erase / write ) Program memory (2) N CYC Cycling (erase / write ) EEPROM data memory Data retention (program memory) after 10 kcycles at T ...

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Electrical characteristics Designing hardened software to avoid noise problems EMC characterization and optimization are performed at component level with a typical application environment and simplified MCU software. It should be noted that good EMC performance is highly dependent on the ...

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STM32L151x6/8/B, STM32L152x6/8/B 6.3.10 Absolute maximum ratings (electrical sensitivity) Based on three different tests (ESD, LU) using specific measurement methods, the device is stressed in order to determine its performance in terms of electrical sensitivity. Electrostatic discharge (ESD) Electrostatic discharges (a ...

Page 78

Electrical characteristics Functional susceptibility to I/O current injection While a simple application is executed on the device, the device is stressed by injecting current into the I/O pins programmed in floating input mode. While current is injected into the I/O ...

Page 79

STM32L151x6/8/B, STM32L152x6/8/B 6.3.12 I/O port characteristics General input/output characteristics Unless otherwise specified, the parameters given in performed under conditions summarized in Table 42. I/O static characteristics Symbol Parameter V Input low level voltage IL Standard I/O input high level voltage ...

Page 80

Electrical characteristics 9. Pull-up and pull-down resistors are designed with a true resistance in series with a switchable PMOS/NMOS. This MOS/NMOS contribution to the series resistance is minimum (~10% order) Output driving current The GPIOs (general purpose input/outputs) can sink ...

Page 81

STM32L151x6/8/B, STM32L152x6/8/B Input/output AC characteristics The definition and values of input/output AC characteristics are given in Table 44, respectively. Unless otherwise specified, the parameters given in performed under ambient temperature and V Table 14. Table 44. I/O AC characteristics OSPEEDRx ...

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Electrical characteristics Figure 18. I/O AC characteristics definition Maximum frequency is achieved if (t 6.3.13 NRST pin characteristics The NRST pin input driver uses CMOS technology. Unless otherwise specified, the parameters given in performed under ambient temperature and V Table ...

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STM32L151x6/8/B, STM32L152x6/8/B Figure 19. Recommended NRST pin protection External reset circuit 1. The reset network protects the device against parasitic resets. 2. The user must ensure that the level on the NRST pin can go below the V Table 45. ...

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Electrical characteristics 6.3.15 Communications interfaces interface characteristics 2 The line I C interface meets the requirements of the standard I with the following restrictions: SDA and SCL are not “true” open-drain I/O pins. When configured as open-drain, ...

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STM32L151x6/8/B, STM32L152x6/8/B 2 Figure 20 bus AC waveforms and measurement circuit bus S TART SDA t f(SDA) t h(STA) SCL t w(SCKH) 1. Measurement points are done at CMOS levels: 0.3V Table 48. SCL frequency ...

Page 86

Electrical characteristics SPI characteristics Unless otherwise specified, the parameters given in the following table are derived from tests performed under ambient temperature, f conditions summarized in Refer to Section 6.3.11: I/O current injection characteristics input/output alternate function characteristics (NSS, SCK, ...

Page 87

STM32L151x6/8/B, STM32L152x6/8/B Figure 21. SPI timing diagram - slave mode and CPHA = 0 NSS input t SU(NSS) CPHA= 0 CPOL=0 t w(SCKH) CPHA w(SCKL) CPOL=1 t a(SO) MISO OUT su(SI) MOSI I NPUT Figure ...

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Electrical characteristics Figure 23. SPI timing diagram - master mode High NSS input CPHA= 0 CPOL=0 CPHA= 0 CPOL=1 CPHA=1 CPOL=0 CPHA=1 CPOL=1 t su(MI) MISO INP UT MOSI OUTPUT 1. Measurement points are done at CMOS levels: 0.3V USB ...

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STM32L151x6/8/B, STM32L152x6/8/B Table 51. USB DC electrical characteristics Symbol Input levels V USB operating voltage DD (3) V Differential input sensitivity DI (3) V Differential common mode range Includes V CM (3) V Single ended receiver threshold SE Output levels ...

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Electrical characteristics 6.3.16 12-bit ADC characteristics Unless otherwise specified, the parameters given in Table 53. ADC clock frequency Symbol Parameter ADC clock f ADC frequency Table 54. ADC characteristics Symbol V Power supply DDA V Positive reference voltage REF+ V ...

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STM32L151x6/8/B, STM32L152x6/8/B Table 54. ADC characteristics (continued) Symbol t Sampling time S Total conversion time t CONV (including sampling time) Internal sample and hold C ADC capacitor External trigger frequency f TRIG Regular sequencer External trigger frequency f TRIG Injected ...

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Electrical characteristics (1)(2) Table 55. ADC accuracy Symbol Parameter ET Total unadjusted error EO Offset error EG Gain error ED Differential linearity error EL Integral linearity error ENOB Effective number of bits Signal-to-noise and SINAD distorsion ratio SNR Signal-to-noise ratio ...

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STM32L151x6/8/B, STM32L152x6/8/B Figure 25. ADC accuracy characteristics [1LSB IDEAL 4095 4094 4093 SSA Figure 26. Typical connection diagram using the ADC VAIN 1. Refer to Table 56: ...

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Electrical characteristics Figure 27. Maximum dynamic current consumption on V conversion Sampling (n cycles) ADC clock I ref+ 700µA 300µA Table 56. R max for f AIN ADC Ts Ts (cycles) (µs) 2.4 V < V DDA 4 0.25 Not ...

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STM32L151x6/8/B, STM32L152x6/8/B Figure 28. Power supply and reference decoupling (V 1 μF // 100 and V REF+ REF– Figure 29. Power supply and reference decoupling ( and V REF+ REF– 1 μF // 100 nF ...

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Electrical characteristics 6.3.17 DAC electrical specifications Data guaranteed by design, not tested in production, unless otherwise specified. Table 57. DAC characteristics Symbol Parameter V Analog supply voltage DDA V Reference supply voltage REF+ V Lower reference voltage REF- Current consumption ...

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STM32L151x6/8/B, STM32L152x6/8/B Table 57. DAC characteristics (continued) Symbol Parameter Offset error temperature (1) dOffset/dT coefficient (code 0x800) (1) (7) Gain Gain error Gain error temperature (1) dGain/dT coefficient (1) TUE Total unadjusted error Settling time (full scale: for a 12-bit ...

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Electrical characteristics 4. Difference between measured value at Code i and the value at Code line drawn between Code 0 and last Code 4095. 5. Difference between the value measured at Code (0x800) and the ideal value ...

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STM32L151x6/8/B, STM32L152x6/8/B 6.3.19 Comparator Table 59. Comparator 1 characteristics Symbol V Analog supply voltage DDA R R 400K 400K R R 10K 10K Comparator 1 input V IN voltage range t Comparator startup time START td Propagation delay Voffset Comparator ...

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Electrical characteristics Table 60. Comparator 2 characteristics Symbol V Analog supply voltage DDA V Comparator 2 input voltage range IN t Comparator startup time START t Propagation delay d slow t Propagation delay d fast V Comparator offset error offset ...

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STM32L151x6/8/B, STM32L152x6/8/B 6.3.20 LCD controller (STM32L152xx only) The STM32L152xx embeds a built-in step-up converter to provide a constant LCD reference voltage independently from the V to the V pin to decouple this converter. LCD Table 61. LCD controller characteristics Symbol ...

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Package characteristics 7 Package characteristics 7.1 Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ® ECOPACK packages, depending on their level of environmental compliance. ECOPACK specification s, grade definitions and product ...

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STM32L151x6/8/B, STM32L152x6/8/B Figure 31. LQFP100 mm, 100-pin low-profile quad flat package outline SEATING PLANE C PIN 1 IDENTIFICATION 1. Drawing is not to scale. ccc 100 Doc ...

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Package characteristics Table 62. LQPF100 mm, 100-pin low-profile quad flat package mechanical data Symbol 15.800 D1 13.800 D3 E 15.800 E1 13.800 ccc 1. Values in ...

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STM32L151x6/8/B, STM32L152x6/8/B Figure 33. LQFP64 mm, 64-pin low-profile quad flat package outline SEATING PLANE C PIN 1 IDENTIFICATION 1. Drawing is not to scale. ccc Doc ID ...

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Package characteristics Table 63. LQFP64 64-pin low-profile quad flat package mechanical data Symbol 1.400 b 0.220 c D 12.000 D1 10.000 D3 7.500 E 12.000 E1 10.000 E3 7.500 e 0.500 L 0.600 ...

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STM32L151x6/8/B, STM32L152x6/8/B Figure 35. LQFP48 mm, 48-pin low-profile quad flat package outline SEATING PLANE C PIN 1 IDENTIFICATION 1. Drawing is not to scale. ccc ...

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Package characteristics Table 64. LQFP48 mm, 48-pin low-profile quad flat package mechanical data Symbol ccc 1. Values in inches are converted from ...

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STM32L151x6/8/B, STM32L152x6/8/B Figure 37. UFQFPN48 mm, 0.5 mm pitch, package outline Pin 1 indentifier laser marking area Exposed pad area Drawing is not to scale. 1. All leads/pads should also be soldered to ...

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Package characteristics Table 65. UFQFPN48 mm, 0.5 mm pitch, package mechanical data Symbol Values in inches are converted from mm and rounded to 4 decimal digits. Figure 38. ...

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STM32L151x6/8/B, STM32L152x6/8/B Figure 39. UFBGA100 - 0.6 mm, 0.5 mm pitch, package outline Z Seating plane Drawing is not to scale. Table 66. UFBGA100 - ...

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Package characteristics Figure 40. TFBGA64 - 8.0x8.0x1.2 mm, 0.5 mm pitch, package outline Z Seating plane Drawing is not to scale. Table 67. TFBGA64 - 8.0x8.0x1.2 mm, 0.5 mm pitch, package mechanical data Symbol A ...

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STM32L151x6/8/B, STM32L152x6/8/B Figure 41. Recommended PCB design rules for pads (0.5 mm pitch BGA) Dpad Dsm 1. Non solder mask defined (NSMD) pads are recommended mils solder paste screen printing process Pitch 0 pad ...

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Package characteristics 7.2 Thermal characteristics The maximum chip-junction temperature, T using the following equation: Where: max is the maximum ambient temperature in °C, ● Θ is the package junction-to-ambient thermal resistance, in °C/W, ● JA ● P max ...

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STM32L151x6/8/B, STM32L152x6/8/B Figure 42. Thermal resistance 3000.00 2500.00 2000.00 PD (mW) 1500.00 1000.00 500.00 0.00 7.2.1 Reference document JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air). Available from www.jedec.org. 100 Temperature(°C) Doc ...

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Ordering information scheme 8 Ordering information scheme Table 69. Ordering information scheme Example: Device family STM32 = ARM-based 32-bit microcontroller Product type L = Low power Device subfamily 151: Devices without LCD 152: Devices with LCD Pin count C = ...

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STM32L151x6/8/B, STM32L152x6/8/B 9 Revision history on Table 70. Document revision history Date Revision 02-Jul-2010 01-Oct-2010 16-Dec-2010 25-Feb-2011 1 Initial release. Removed 5 V tolerance (FT) from PA3, PB0 and PC3 in STM32L15xxx pin definitions on page 36 Updated Table 15: ...

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Revision history Table 70. Document revision history (continued) Date Revision 25-Feb-2011 118/121 Updated Table 23: Typical and maximum current consumptions in Standby mode on page 61 from Stop). Table 24: Typical and maximum timings in Low power modes on page ...

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STM32L151x6/8/B, STM32L152x6/8/B Table 70. Document revision history (continued) Date Revision 17-June-2011 25-Jan-2012 Modified 1st page (low power features) Added STM32L15xC6 and STM32L15xR6 devices (32 Kbytes of Flash memory). Modified Section 3.6: GPIOs (general-purpose inputs/outputs page 22 Modified Section ...

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Revision history Table 70. Document revision history (continued) Date Revision 26-Oct-2012 07-Feb-2013 120/121 Updated cover page Updated Section 3.10: ADC (analog-to-digital converter) Updated Table 3: Functionalities depending on the operating power supply range, added Table 4: CPU frequency range depending ...

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... STM32L151x6/8/B, STM32L152x6/8/B Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...

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