MC100EP91MNR2G ON Semiconductor, MC100EP91MNR2G Datasheet - Page 4

• Manufacturer Part Number: MC100EP91MNR2G
• Description: TRANSLATOR NECL OUTPUT 24-QFN
• Manufacturer: ON Semiconductor
• Series: 100EPr

Specifications of MC100EP91MNR2G

• Logic Function: Translator
• Number Of Bits: 3
• Input Type: AnyLevel™
• Output Type: NECL
• Number Of Channels: 3
• Number Of Outputs/channel: 1
• Differential - Input:output: Yes/Yes
• Propagation Delay (max): 0.675ns
• Voltage - Supply: 2.375 V ~ 3.8 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 24-TFQFN Exposed Pad
• Supply Voltage: 2.375 V ~ 3.8 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Data Rate: -
• Lead Free Status / Rohs Status: Compliant
• Other names: MC100EP91MNR2G; MC100EP91MNR2GOSTR

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
3. Input parameters vary 1:1 with V
4. V
Table 3. MAXIMUM RATINGS
Symbol
Table 4. DC CHARACTERISTICS POSITIVE INPUTS
Symbol
V
V
V
V
I
I
T
T
q
q
q
T
I
V
V
V
I
I
out
BB
CC
IH
IL
A
stg
JA
JA
JC
sol
CC
EE
I
OP
IH
IL
IHCMR
IHCMR
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
min varies 1:1 with GND. V
Positive Power Supply
Negative Power Supply
Positive Input Voltage
Operating Voltage
Output Current
PECL V
Operating Temperature Range
Storage Temperature Range
Thermal Resistance (Junction−to−Ambient)
JESD 51−3 (1S−Single Layer Test Board)
Thermal Resistance (Junction−to−Ambient)
JESD 51−6 (2S2P Multilayer Test Board) with Filled Thermal Vias
Thermal Resistance (Junction−to−Case)
Wave Solder
Positive Power Supply Current
Input HIGH Voltage (Single−Ended)
Input LOW Voltage (Single−Ended)
Input HIGH Voltage Common Mode Range
(Differential Configuration) (Note 4)
Input HIGH Current (@ V
Input LOW Current (@ V
BB
Sink/Source
Characteristic
CC
IL
IH
Parameter
)
. V
IHCMR
)
CC
can vary +1.3 V / −0.125 V.
max varies 1:1 with V
http://onsemi.com
D
D
V
CC
1335
GND
−150
Min
0.5
10
0
CC
Pb−Free
= 2.5 V, V
4
.
−40°C
Typ
Pb
14
EE
GND = 0 V
GND = 0 V
GND = 0 V
GND = 0 V
Continuous
Surge
0 lfpm
500 lfpm
0 lfpm
500 lfpm
Standard Board
Max
V
875
150
= −3.0 V to −5.5 V, GND = 0 V (Note 3)
2.5
20
CC
Condition 1
1335
GND
−150
Min
0.5
10
0
25°C
Typ
14
Condition 2
V
Max
V
V
SOIC−20
SOIC−20
SOIC−20
875
150
2.5
QFN−24
QFN−24
QFN−24
20
CC
I
CC
 V
− V
CC
EE
1335
GND
−150
Min
0.5
10
0
−65 to +150
85°C
−40 to +85
30 to 35
3.8 to 0
3.8 to 0
Typ
Rating
14
± 0.5
100
225
225
9.8
−6
50
90
60
37
32
11
Max
V
875
150
2.5
20
CC
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
Unit
mA
mA
mA
mA
mV
mV
°C
°C
°C
mA
mA
V
V
V
V
V