TCM0806S-350-2P TDK, TCM0806S-350-2P Datasheet - Page 2

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TCM0806S-350-2P

Manufacturer Part Number
TCM0806S-350-2P
Description
EMI Filters 35ohms 1.5ohms 7.0GHz 0.1A
Manufacturer
TDK
Series
TCMr
Datasheet

Specifications of TCM0806S-350-2P

Rohs
yes
Maximum Dc Current
0.1 A
Maximum Dc Resistance
1.5 Ohms
Voltage Rating
10 V
Termination Style
SMD/SMT
Operating Temperature Range
- 25 C to + 85 C
Case Height
0.4 mm
Case Length
0.85 mm
Case Width
0.65 mm
Dimensions
0.65 mm W x 0.85 mm L x 0.4 mm H
Impedance
35 Ohms
Package / Case
0806
Product
Common Mode Filters
Test Frequency
100 MHz
Common Mode Filters
For High-speed Differential Signal Line
(USB2.0, LVDS, etc.)
TCM Series TCM0605G
FEATURES
• Smallest thin-film common mode filter in the industry at
• Effectively suppresses radiated noise due to common mode
• This product contains no lead and supports lead-free soldering.
APPLICATIONS
• High speed interface(USB2.0, MIPI, LVDS, IEEE1394 and
• Portable audio, digital cellular phones, DVC, DSC, notebook
TEMPERATURE RANGES
Operating
Storage(After mount)
PACKAGING STYLE AND QUANTITIES
Packaging style
Taping
SHAPES AND DIMENSIONS/CIRCUIT DIAGRAM
RECOMMENDED PC BOARD PATTERN
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
• All specifications are subject to change without notice.
0.2±0.05
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
L0.65W0.5T0.3mm.
noise without affecting the transmission of high-speed
differential signals.
HDMI, etc.) in electronics devices.
PCs, PDP/LCD/DLP/PJ TVs, DVD players, amusement
machines, etc.
0.25
0.65±0.05
0.45±0.05
4
1
0.71
2
3
0.23
Dimensions in mm
Dimensions in mm
–25 to +85°C
–25 to +85°C
Quantity
10000 pieces/reel
Weight: 1mg
・No polarity
4 3
1
2
PRODUCT IDENTIFICATION
(1) Series name
(2) Dimensions LW
(3) Product identification number
(4) Impedance[at 100MHz]
(5) Number of line
(6) Packaging style
RECOMMENDED SOLDERING CONDITIONS
RECOMMENDED TEMPERATURE PROFILE
FOR LEAD-FREE SOLDER
REFLOW PROFILE FOR SOLDER HEAT RESISTANCE
230˚C
180˚C
150˚C
230˚C
180˚C
150˚C
TCM
(1)
900: 90
2P: 2-line
T: ø180mm reel taping
Peak 260˚C max.
Peak 245˚C max.
0605
(2)
(3)
G - 900 - 2P - T
60 to 120s
60 to 120s
(4)
Time ( s )
Time ( s )
(5)
001-03 / 20130401 / e9712_tcm_g
40s max.
10 to 30s
(6)
Conformity to RoHS Directive
Natural
cooling
Natural
cooling
(1/6)

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