SZMMBZ5234BLT1G ON Semiconductor, SZMMBZ5234BLT1G Datasheet

SZMMBZ5234BLT1G

Manufacturer Part Number

SZMMBZ5234BLT1G

Description

Zener Diodes ZEN REG .225W 6.2V

Manufacturer

ON Semiconductor

Datasheet

1.SZMMBZ5234BLT1G.pdf (6 pages)

Specifications of SZMMBZ5234BLT1G

Zener Voltage

6.2 V

Zener Current

20 mA

Power Dissipation

225 mW

Maximum Reverse Leakage Current

5 uA

Maximum Zener Impedance

7 Ohms

Maximum Operating Temperature

+ 150 C

Mounting Style

SMD/SMT

Package / Case

SOT-23

Configuration

Single

Forward Voltage Drop

0.9 V at 10 mA

Minimum Operating Temperature

- 65 C

Available stocks

Company

Part Number

Manufacturer

Quantity

Price

Company:

H&T Electronics

Part Number:

SZMMBZ5234BLT1G

Quantity:

4 500

Current page: 1 of 6
Download datasheet (119Kb)

MMBZ52xxBLT1G Series,

SZMMBZ52xxBLT1G Series

Zener Voltage Regulators

225 mW SOT−23 Surface Mount

mount plastic SOT−23 package. These devices are designed to provide

voltage regulation with minimum space requirement. They are well

suited for applications such as cellular phones, hand held portables,

and high density PC boards.

Features

•

Mechanical Characteristics

CASE:

FINISH:

MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:

POLARITY:

FLAMMABILITY RATING:

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

1. FR−5 = 1.0 X 0.75 X 0.62 in.

2. Alumina = 0.4 X 0.3 X 0.024 in, 99.5% alumina.

*For additional information on our Pb−Free strategy and soldering details, please

MAXIMUM RATINGS

March, 2013 − Rev. 12

download the ON Semiconductor Soldering and Mounting Techniques

Reference Manual, SOLDERRM/D.

Total Power Dissipation on FR−5 Board,

Thermal Resistance,

Total Power Dissipation on Alumina

Thermal Resistance,

Junction and Storage

This series of Zener diodes is offered in the convenient, surface

260°C for 10 Seconds

Site and Control Change Requirements; AEC−Q101 Qualified and

PPAP Capable

Compliant*

225 mW Rating on FR−4 or FR−5 Board

Zener Voltage Range − 2.4 V to 91 V

Package Designed for Optimal Automated Board Assembly

Small Package Size for High Density Applications

ESD Rating of Class 3 (> 16 KV) per Human Body Model

SZ Prefix for Automotive and Other Applications Requiring Unique

These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS

(Note 1) @ T

Derated above 25°C

Junction−to−Ambient

Substrate, (Note 2) @ T

Derated above 25°C

Junction−to−Ambient

Temperature Range

Void-free, transfer-molded, thermosetting plastic case

Corrosion resistant finish, easily solderable

Cathode indicated by polarity band

Rating

= 25°C

UL 94 V−0

Symbol

, T

qJA

stg

−65 to +150

Max

225

556

300

417

1.8

2.4

mW/°C

Units

°C/W

°C

MMBZ52xxBLT1G

SZMMBZ52xxBLT1G SOT−23

MMBZ52xxBLT3G

SZMMBZ52xxBLT3G SOT−23

†For information on tape and reel specifications,

See specific marking information in the device marking

column of the Electrical Characteristics table on page 3 of

this data sheet.

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

(Note: Microdot may be in either location)

DEVICE MARKING INFORMATION

Device

xxx

ORDERING INFORMATION

Cathode

MARKING DIAGRAM

http://onsemi.com

= Specific Device Code

= Date Code

= Pb−Free Package

CASE 318

STYLE 8

SOT−23

xxx

(Pb−Free)

Package

SOT−23

Publication Order Number:

MMBZ5221BLT1/D

Anode

Tape & Reel

Shipping

10,000 /

3,000 /

†

Related parts for SZMMBZ5234BLT1G

SZMMBZ5234BLT1G Summary of contents

Page 1

... Recommended Operating Conditions may affect device reliability. 1. FR−5 = 1.0 X 0.75 X 0.62 in. 2. Alumina = 0.4 X 0.3 X 0.024 in, 99.5% alumina. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2013 March, 2013 − Rev. 12 ...

Page 2

ELECTRICAL CHARACTERISTICS (Pinout: 1-Anode, 2-No Connection, 3-Cathode) (T unless otherwise noted 0.95 V Max Symbol Parameter V Reverse Zener Voltage @ Reverse Current ZT Z Maximum Zener Impedance @ I ZT ...

Page 3

ELECTRICAL CHARACTERISTICS Device Marking Min Device* MMBZ5221BLT1G 18A 2.28 MMBZ5222BLT1G 18B 2.37 MMBZ5223BLT1G 18C 2.56 MMBZ5224BLT1G 18D 2.66 MMBZ5225BLT1G 18E 2.85 MMBZ5226BLT1G 8A 3.13 MMBZ5227BLT1G 8B 3.42 MMBZ5228BLT1G 8C 3.70 MMBZ5229BLT1G 8D 4.08 MMBZ5230BLT1G 8E 4.46 MMBZ5231BLT1G/T3G 8F 4.84 MMBZ5232BLT1G/T3G ...

Page 4

TYPICAL T VALUES C FOR MMBZ52xxBLT1G SERIES NOMINAL ZENER VOLTAGE (V) Z Figure 1. Temperature Coefficients (Temperature ...

Page 5

V BIAS 1 V BIAS 100 BIAS AT 50 NOM NOMINAL ZENER VOLTAGE (V) Z Figure 5. Typical Capacitance 100 10 1 0.1 0. ...

Page 6

... A A1 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “ ...

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