SZMMSZ5258BT1G ON Semiconductor, SZMMSZ5258BT1G Datasheet

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SZMMSZ5258BT1G

Manufacturer Part Number
SZMMSZ5258BT1G
Description
Zener Diodes ZEN REG 0.5W 36V
Manufacturer
ON Semiconductor
Datasheet

Specifications of SZMMSZ5258BT1G

Zener Voltage
36 V
Voltage Tolerance
5 %
Zener Current
3.4 mA
Power Dissipation
500 mW
Maximum Reverse Leakage Current
0.1 uA
Maximum Zener Impedance
70 Ohms
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Package / Case
SOD-123
Configuration
Single
Forward Voltage Drop
0.9 V at 10 mA
Minimum Operating Temperature
- 55 C
MMSZ52xxxT1G Series,
SZMMSZ52xxxT1G Series
Zener Voltage Regulators
500 mW SOD−123 Surface Mount
surface mount plastic SOD−123 package. These devices provide a
convenient alternative to the leadless 34−package style.
Features
Mechanical Characteristics:
CASE:
FINISH:
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
POLARITY:
FLAMMABILITY RATING:
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−5 = 3.5 X 1.5 inches, using the minimum recommended footprint.
2. Thermal Resistance measurement obtained via infrared Scan Method.
*For additional information on our Pb−Free strategy and soldering details, please
MAXIMUM RATINGS
© Semiconductor Components Industries, LLC, 2012
October, 2012 − Rev. 12
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Total Power Dissipation on FR−5 Board,
Thermal Resistance, Junction−to−Ambient
(Note 2)
Thermal Resistance, Junction−to−Lead
(Note 2)
Junction and Storage Temperature Range
Three complete series of Zener diodes are offered in the convenient,
260°C for 10 Seconds
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
500 mW Rating on FR−4 or FR−5 Board
Wide Zener Reverse Voltage Range − 2.4 V to 110 V
Package Designed for Optimal Automated Board Assembly
Small Package Size for High Density Applications
General Purpose, Medium Current
ESD Rating of Class 3 (> 16 kV) per Human Body Model
SZ Prefix for Automotive and Other Applications Requiring Unique
These are Pb−Free Devices*
(Note 1) @ T
Derated above 75°C
Void-free, transfer-molded, thermosetting plastic case
Corrosion resistant finish, easily solderable
Cathode indicated by polarity band
L
= 75°C
Rating
UL 94 V−0
Symbol
T
R
R
J
P
, T
qJA
qJL
D
stg
−55 to +150
Max
500
340
150
6.7
1
mW/°C
Units
°C/W
°C/W
mW
°C
MMSZ52xxBT1G,
SZMMSZ52xxBT1G
MMSZ52xxCT1G,
SZMMSZ52xxCT1G
MMSZ52xxBT3G,
SZMMSZ52xxBT3G
MMSZ52xxCT3G,
SZMMSZ52xxCT3G
†For information on tape and reel specifications,
See specific marking information in the device marking
column of the Electrical Characteristics table on page 3 of
this data sheet.
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
DEVICE MARKING INFORMATION
Device
(Note: Microdot may be in either location)
xx
M
G
ORDERING INFORMATION
Cathode
MARKING DIAGRAM
= Device Code (Refer to page 3)
= Date Code
= Pb−Free Package
http://onsemi.com
1
1
CASE 425
SOD−123
STYLE 1
(Pb−Free)
(Pb−Free)
(Pb−Free)
(Pb−Free)
SOD−123
SOD−123
SOD−123
SOD−123
Package
Publication Order Number:
xx MG
G
Anode
MMSZ5221BT1/D
2
Tape & Reel
Tape & Reel
Tape & Reel
Tape & Reel
Shipping
10,000 /
10,000 /
3,000 /
3,000 /

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SZMMSZ5258BT1G Summary of contents

Page 1

... FR−5 = 3.5 X 1.5 inches, using the minimum recommended footprint. 2. Thermal Resistance measurement obtained via infrared Scan Method. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2012 October, 2012 − ...

Page 2

ELECTRICAL CHARACTERISTICS otherwise noted 0.95 V Max mA Symbol Parameter V Reverse Zener Voltage @ Reverse Current ZT Z Maximum Zener Impedance @ Reverse Current ...

Page 3

TOLERANCE FG ELECTRICAL CHARACTERISTICS Device Marking Device* MMSZ5221BT1G C1 MMSZ5222BT1G C2 MMSZ5223BT1G C3 MMSZ5224BT1G C4 MMSZ5225BT1G C5 MMSZ5226BT1G D1 MMSZ5227BT1G D2 MMSZ5228BT1G D3 MMSZ5229BT1G D4 MMSZ5230BT1G D5 MMSZ5231BT1G E1 MMSZ5232BT1G E2 MMSZ5233BT1G E3 MMSZ5234BT1G E4 MMSZ5235BT1G E5 MMSZ5236BT1G F1 ...

Page 4

TOLERANCE FG ELECTRICAL CHARACTERISTICS Device Marking Device* MMSZ5226CT1G TD MMSZ5231CT1G TG MMSZ5232CT1G TH MMSZ5245CT1G TK MMSZ5248CT1G TL MMSZ5250CT1G TN MMSZ5252CT1G TQ MMSZ5256CT1G TW 6. “C” Suffix Type numbers shown have a standard tolerance of ±2% on the nominal Zener ...

Page 5

TYPICAL T VALUES C 6 FOR MMSZ52xxBT1G SERIES, SZMMSZ52xxBT1G SERIES −1 −2 − NOMINAL ZENER VOLTAGE (V) Z Figure 1. Temperature Coefficients (Temperature ...

Page 6

V BIAS 1 V BIAS 100 BIAS AT 50 NOM NOMINAL ZENER VOLTAGE (V) Z Figure 7. Typical Capacitance 100 10 1 0.1 0. ...

Page 7

... *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “ ...

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