AT24C02B-PU Atmel, AT24C02B-PU Datasheet - Page 13

• Manufacturer Part Number: AT24C02B-PU
• Description: IC EEPROM 2KBIT 1MHZ 8DIP
• Manufacturer: Atmel

Specifications of AT24C02B-PU

• Format - Memory: EEPROMs - Serial
• Memory Type: EEPROM
• Memory Size: 2K (256 x 8)
• Speed: 400kHz, 1MHz
• Interface: I²C, 2-Wire Serial
• Voltage - Supply: 1.8 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-DIP (0.300", 7.62mm)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: AT24C02B-10PU-1.8; AT24C02B-10PU-1.8

AT24C02B Ordering Information
Notes:
5126H–SEEPR–8/07
Ordering Code
AT24C02B-PU (Bulk form only)
AT24C02BN-SH-B
AT24C02BN-SH-T
AT24C02B-TH-B
AT24C02B-TH-T
AT24C02BY6-YH-T
AT24C02B-TSU-T
AT24C02BU3-UU-T
AT24C02B-W-11
8P3
8S1
8A2
8Y6
5TS1
8U3-1
–1.8
1. “-B” denotes bulk.
2. “-T” denotes tape and reel. SOIC = 4K per reel. TSSOP, Ultra Thin Mini-MAP, SOT23, and dBGA2 = 5K per reel.
3. Available in tape and reel and wafer form; order as SL788 for inkless wafer form. Please contact Serial Interface Marketing.
8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)
8-lead, 2.00 mm x 3.00 mm Body, 0.50 mm Pitch, Ultra Thin Mini-MAP, Dual No Lead Package (DFN), (MLP 2x3 mm)
5-lead, 2.90 mm x 1.60 mm Body, Plastic Thin Shrink Small Outline Package (SOT23)
8-ball, die Ball Grid Array Package (dBGA2)
Low-voltage (1.8V to 5.5V)
(2)
(1)
(3)
(2)
(2)
(1)
(NiPdAu Lead Finish)
(NiPdAu Lead Finish)
(2)
(2)
(NiPdAu Lead Finish)
(NiPdAu Lead Finish)
(NiPdAu Lead Finish)
Package Type
Voltage
Options
1.8
1.8
1.8
1.8
1.8
1.8
1.8
1.8
1.8
Package
Die Sale
8U3-1
5TS1
8P3
8S1
8S1
8A2
8A2
8Y6
Lead-free/Halogen-free/
Industrial Temperature
Industrial Temperature
Operation Range
(–40C to 85C)
(–40C to 85C)
AT24C02B
13