BC847BDW1T3 ON Semiconductor, BC847BDW1T3 Datasheet
BC847BDW1T3
Specifications of BC847BDW1T3
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BC847BDW1T3 Summary of contents
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... Junction to Ambient Junction and Storage Temperature Range 1. FR−5 = 1.0 x 0.75 x 0.062 in *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2012 September, 2012 − Rev. 9 BC846 ...
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NSVBC847BDW1T2G, BC848CDW1T1G ELECTRICAL CHARACTERISTICS Characteristic OFF CHARACTERISTICS Collector −Emitter Breakdown Voltage ( mA) C BC846, SBC846 Series BC847, SBC847 Series, NSVBC847 BC848 Series Collector −Emitter Breakdown Voltage ( mA BC846, SBC846 ...
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NSVBC847BDW1T2G, BC848CDW1T1G TYPICAL CHARACTERISTICS − BC846BDW1T1G, SBC846BDW1T1G 600 500 150°C 400 25°C 300 200 −55°C 100 0 0.001 0. COLLECTOR CURRENT (A) C Figure 1. DC Current Gain 0.20 ...
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NSVBC847BDW1T2G, BC848CDW1T1G TYPICAL CHARACTERISTICS − BC846BDW1T1G, SBC846BDW1T1G 1. 1.10 1.00 0.90 −55°C 0.80 25°C 0.70 0.60 150°C 0.50 0.40 0.30 0.20 0.0001 0.001 I , COLLECTOR CURRENT (A) C Figure BE(on) ...
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NSVBC847BDW1T2G, BC848CDW1T1G TYPICAL CHARACTERISTICS − BC847BDW1T1G, SBC847BDW1T1G, NSVBC847BDW1T2G 600 150°C 500 400 25°C 300 −55°C 200 100 0 0.0001 0.001 0. COLLECTOR CURRENT (A) C Figure 12. DC Current Gain ...
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NSVBC847BDW1T2G, BC848CDW1T1G TYPICAL CHARACTERISTICS − BC847BDW1T1G, SBC847BDW1T1G, NSVBC847BDW1T2G 1. 1.10 1.00 0.90 −55°C 0.80 0.70 25°C 0.60 0.50 150°C 0.40 0.30 0.20 0.0001 0.001 I , COLLECTOR CURRENT (A) C Figure 18 ...
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NSVBC847BDW1T2G, BC848CDW1T1G TYPICAL CHARACTERISTICS − BC848CDW1T1G, SBC848CDW1T1G 1000 150°C 900 800 700 600 25°C 500 400 −55°C 300 200 100 0 0.0001 0.001 0. COLLECTOR CURRENT (A) C Figure 23. DC Current Gain ...
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NSVBC847BDW1T2G, BC848CDW1T1G TYPICAL CHARACTERISTICS − BC848CDW1T1G, SBC848CDW1T1G 1 0.9 −55°C 0.8 25°C 0.7 0.6 0.5 0.4 150°C 0.3 0.2 0.1 0.0 0.0001 0.001 0. COLLECTOR CURRENT (A) C Figure 29 ...
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NSVBC847BDW1T2G, BC848CDW1T1G 1 0.5 0.2 0.1 0.1 0.05 0.02 0.01 0.01 SINGLE PULSE 0.001 0 1.0 -200 1 s -100 T = 25° 25°C - BC558 BC557 -10 BC556 -5.0 BONDING WIRE LIMIT THERMAL ...
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... ORDERING INFORMATION Device BC846BDW1T1G SBC846BDW1T1G* BC847BDW1T1G SBC847BDW1T1G* BC847BDW1T3G SBC847BDW1T3G* NSVBC847BDW1T2G* BC847CDW1T1G SBC847CDW1T1G* BC848CDW1T1G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *S and NSV Prefixes for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable ...
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... A1 0.40 0.0157 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “ ...