M93C46-WBN6P STMicroelectronics, M93C46-WBN6P Datasheet - Page 35

• Manufacturer Part Number: M93C46-WBN6P
• Description: IC EEPROM 1KBIT 2MHZ 8DIP
• Manufacturer: STMicroelectronics

Specifications of M93C46-WBN6P

• Format - Memory: EEPROMs - Serial
• Memory Type: EEPROM
• Memory Size: 1K (128 x 8 or 64 x 16)
• Speed: 2MHz
• Interface: Microwire, 3-Wire Serial
• Voltage - Supply: 2.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-DIP (0.300", 7.62mm)
• Organization: 128 K x 8
• Interface Type: Microwire
• Maximum Clock Frequency: 2 MHz
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 2.5 V
• Maximum Operating Current: 2 mA
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• Minimum Operating Temperature: - 40 C
• Operating Supply Voltage: 2.5 V, 5.5 V
• Memory Configuration: 128 X 8, 64 X 16
• Clock Frequency: 2MHz
• Supply Voltage Range: 2.5V To 5.5V
• Memory Case Style: DIP
• No. Of Pins: 8
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 497-8589-5; M93C46-WBN6P

M93C86, M93C76, M93C66, M93C56, M93C46
Table 29.
29-Jan-2008
01-Apr-2010
29-Apr-2010
12-Apr-2011
31-Jul-2007
Date
Document revision history (continued)
Revision
10
11
7
8
9
Document reformatted. TSSOP8 3 × 3 mm (DS) package removed.
Erase/Write Enable (EWEN) instruction replaced by Write Enable
(WEN). Erase/Write Disable (EWDS) instruction replaced by Write
Disable (WDS).
Section 7: Initial delivery state
STANDBY POWER MODES section removed.
I
and
t
Table
SO8 narrow and UFDFPN8 package specifications updated (see
Section 12: Package mechanical
Table
Blank option removed under Plating technology in
8 lead thin shrink small outline, package mechanical
Section 2: Connecting to the serial bus
Small text changes.
M93C76-R root part number added.
Section 2: Connecting to the serial bus
added to
and paragraph added).
Section 3.1.2: Power-up conditions
T
V
16,
M93C56-R is also offered in TSSOP8 package (see
Package mechanical inch values calculated from mm and rounded to 4
decimal digits in
TSSOP8 (DW) package specifications updated.
Modified footnote in
Updated
flat package no lead 2 x 3 mm, outline
8-lead ultra thin fine pitch dual flat package no lead 2 x 3 mm, data
Updated
range, temperature grade)
Updated
Section 12: Package mechanical data
Clock pulse
Deleted
range, temperature
(package, voltage range, temperature
M93C66-x products (package, voltage range, temperature
Table 32: Available M93C76-x products (package, voltage range,
temperature grade)
(package, voltage range, temperature
CC1
W
LEAD
OH
parameter description modified in
17
Table
min guaranteed at a higher value in DC characteristics tables 15,
Doc ID 4997 Rev 11
test conditions modified in
23.
29,
modified in
and 18.
Table 29: Available M93C46-x products (package, voltage
Figure 14: UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual
Figure 31: Available M93C66-x products (package, voltage
Table 8: Absolute maximum
Figure 3: Bus master and memory devices on the serial bus
Table
19. Note 1 added to
counter.
30,
Section 12: Package mechanical data
Table 8: Absolute maximum
Table
grade),
and
Table 15
Table 33: Available M93C86-x products
31,
UFDFPN option.
Table 30: Available M93C56-x products
Table 32
and
modified, ACTIVE POWER AND
Table
Changes
Table
data).
Table 16 on page 23
corrected.
15.
Table
15,
ratings, MLP8 package data in
grade),
grade).
and
and process data in
and
added. Device grade 7 removed.
modified (pull-down resistor
Table
Table 33
20,
Table 26: UFDFPN8 (MLP8)
Table 31: Available
ratings.
Table
16,
Table 27: TSSOP8 –
Table
added.
Table
21,
data.
Revision history
Table 22
17,
30).
grade),
Section 9:
Table 18
and
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