M27C2001-15F1 STMicroelectronics, M27C2001-15F1 Datasheet - Page 5

• Manufacturer Part Number: M27C2001-15F1
• Description: IC EPROM 2MBIT 150NS 32CDIP
• Manufacturer: STMicroelectronics

Specifications of M27C2001-15F1

• Format - Memory: EPROMs
• Memory Type: UV EPROM
• Memory Size: 2M (256K x 8)
• Speed: 150ns
• Interface: Parallel
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 32-CDIP (0.600", 15.24mm) Window
• Capacitance, Input: 6 pF
• Capacitance, Output: 12 pF
• Current, Input, Leakage: ±10 μA (Read)
• Current, Operating: 30 mA (Read)
• Current, Output, Leakage: ±10 μA (Read)
• Current, Supply: 30 mA
• Density: 2M
• Organization: 256K×8
• Package Type: FDIP32W
• Temperature, Operating: 0 to +70 °C
• Temperature, Operating, Maximum: 70 °C
• Temperature, Operating, Minimum: 0 °C
• Time, Access: 150 ns
• Time, Fall: ≤20 ns
• Time, Programmable: 100 μs
• Time, Rise: ≤20 ns
• Voltage, Input, High: 6 V (Read)
• Voltage, Input, High Level: 2 V (Min.)
• Voltage, Input, Low: 0.8 V (Read)
• Voltage, Input, Low Level: -0.3 V (Min.)
• Voltage, Output, High: 4.3 V (Read)
• Voltage, Output, Low: 0.4 V (Read)
• Voltage, Programmable: 11.5 V (Min.)
• Voltage, Supply: 5 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Summary description
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Summary description
The M27C2001 is a high speed 2 Mbit EPROM offered in the two ranges UV (ultra violet
erase) and OTP (one time programmable). It is ideally suited for microprocessor systems
requiring large programs and is organized as 262,144 by 8 bits.
The FDIP32W (window ceramic frit-seal package) has a transparent lids which allow the
user to expose the chip to ultraviolet light to erase the bit pattern. A new pattern can then be
written to the device by following the programming procedure.
For applications where the content is programmed only one time and erasure is not
required, the M27C2001 is offered in PDIP32, PLCC32 and TSOP32 (8 x 20 mm) packages.
In order to meet environmental requirements, ST offers the M27C2001 in ECOPACK
packages.
ECOPACK packages are Lead-free. The category of second Level Interconnect is marked
on the package and on the inner box label, in compliance with JEDEC Standard JESD97.
The maximum ratings related to soldering conditions are also marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Figure 1.
Table 1.
A0-A17
Q0-Q7
E
G
P
V
V
V
PP
CC
SS
Logic Diagram
Signal Names
A0-A17
G
P
E
18
V CC
M27C2001
V SS
Data Outputs
Chip Enable
Output Enable
Program
Program Supply
Supply Voltage
Ground
Address Inputs
V PP
8
Q0-Q7
AI00716B
M27C2001
®