CAT93C57LI-G ON Semiconductor, CAT93C57LI-G Datasheet - Page 5

• Manufacturer Part Number: CAT93C57LI-G
• Description: IC EEPROM 2KBIT 2MHZ 8DIP
• Manufacturer: ON Semiconductor

Specifications of CAT93C57LI-G

• Format - Memory: EEPROMs - Serial
• Memory Type: EEPROM
• Memory Size: 2K (256 x 8 or 128 x 16)
• Speed: 2MHz
• Interface: Microwire, 3-Wire Serial
• Voltage - Supply: 1.8 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-DIP (0.300", 7.62mm)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Device Operation
intended for use with industry standard microprocessors.
The CAT93C56/57 can be organized as either registers of 16
bits or 8 bits. When organized as X16, seven 10−bit
instructions for 93C57 or seven 11−bit instructions for
93C56 control the reading, writing and erase operations of
the device. When organized as X8, seven 11−bit instructions
for 93C57 or seven 12−bit instructions for 93C56 control the
reading, writing and erase operations of the device. The
CAT93C56/57 operates on a single power supply and will
generate on chip, the high voltage required during any write
operation.
DI pin on the rising edge of the clock (SK). The DO pin is
normally in a high impedance state except when reading data
Table 9. A.C. TEST CONDITIONS
Input Rise and Fall Times
Input Pulse Voltages
Timing Reference Voltages
Input Pulse Voltages
Timing Reference Voltages
Output Load
The CAT93C56/57 is a 2048−bit nonvolatile memory
Instructions, addresses, and write data are clocked into the
DO
CS
SK
DI
t
CSS
VALID
t
DIS
t
Figure 2. Synchronous Data Timing
SKHI
http://onsemi.com
t
DIS
t
SKLOW
5
from the device, or when checking the ready/busy status
after a write operation. The serial communication protocol
follows the timing shown in Figure 2.
internal write cycle by selecting the device (CS high) and
polling the DO pin; DO low indicates that the write
operation is not completed, while DO high indicates that the
device is ready for the next instruction. If necessary, the DO
pin may be placed back into a high impedance state during
chip select by shifting a dummy “1” into the DI pin. The DO
pin will enter the high impedance state on the rising edge of
the clock (SK). Placing the DO pin into the high impedance
state is recommended in applications where the DI pin and
the DO pin are to be tied together to form a common DI/O
pin.
The ready/busy status can be determined after the start of
VALID
≤ 50 ns
0.4 V to 2.4 V
0.8 V, 2.0 V
0.2 V
0.5 V
Current Source I
CC
CC
to 0.7 V
t
t
PD0
DIH
DATA VALID
, t
PD1
CC
OLmax
/I
OHmax
t
CSH
4.5 V v V
4.5 V v V
1.8 V v V
1.8 V v V
; CL=100 pF
t
CSMN
CC
CC
CC
CC
v 5.5 V
v 5.5 V
v 4.5 V
v 4.5 V