AT24C01A-10PC Atmel, AT24C01A-10PC Datasheet

IC EEPROM 1KBIT 400KHZ 8DIP

AT24C01A-10PC

Manufacturer Part Number
AT24C01A-10PC
Description
IC EEPROM 1KBIT 400KHZ 8DIP
Manufacturer
Atmel
Datasheet

Specifications of AT24C01A-10PC

Format - Memory
EEPROMs - Serial
Memory Type
EEPROM
Memory Size
1K (128 x 8)
Speed
400kHz
Interface
I²C, 2-Wire Serial
Voltage - Supply
4.5 V ~ 5.5 V
Operating Temperature
0°C ~ 70°C
Package / Case
8-DIP (0.300", 7.62mm)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant

Available stocks

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Price
Part Number:
AT24C01A-10PC
Quantity:
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Manufacturer:
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Quantity:
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Part Number:
AT24C01A-10PC-2.7
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Quantity:
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Features
Description
The AT24C01A/02/04/08/16 provides 1024/2048/4096/8192/16384 bits of serial elec-
trically erasable and programmable read-only memory (EEPROM) organized as
128/256/512/1024/2048 words of 8 bits each. The device is optimized for use in many
industrial and commercial applications where low-power and low-voltage operation
are essential. The AT24C01A/02/04/08/16 is available in space-saving 8-lead PDIP,
8-lead JEDEC SOIC, 8-lead MAP, 5-lead SOT23 (AT24C01A/AT24C02/AT24C04), 8-
lead TSSOP, and 8-ball dBGA2 packages and is accessed via a Two-wire serial inter-
face. In addition, the entire family is available in 2.7V (2.7V to 5.5V) and 1.8V (1.8V to
5.5V) versions.
Table 1. Pin Configuration
Pin Name
A0 - A2
SDA
SCL
WP
NC
GND
VCC
Low-voltage and Standard-voltage Operation
Internally Organized 128 x 8 (1K), 256 x 8 (2K), 512 x 8 (4K),
1024 x 8 (8K) or 2048 x 8 (16K)
Two-wire Serial Interface
Schmitt Trigger, Filtered Inputs for Noise Suppression
Bidirectional Data Transfer Protocol
100 kHz (1.8V) and 400 kHz (2.5V, 2.7V, 5V) Compatibility
Write Protect Pin for Hardware Data Protection
8-byte Page (1K, 2K), 16-byte Page (4K, 8K, 16K) Write Modes
Partial Page Writes Allowed
Self-timed Write Cycle (5 ms max)
High-reliability
Automotive Grade, Extended Temperature and Lead-free/Halogen-free Devices
Available
8-lead PDIP, 8-lead JEDEC SOIC, 8-lead MAP, 5-lead SOT23,
8-lead TSSOP and 8-ball dBGA2 Packages
Die Sales: Wafer Form, Waffle Pack and Bumped Wafers
– 2.7 (V
– 1.8 (V
– Endurance: 1 Million Write Cycles
– Data Retention: 100 Years
CC
CC
Function
Address Inputs
Serial Data
Serial Clock Input
Write Protect
No Connect
Ground
Power Supply
= 2.7V to 5.5V)
= 1.8V to 5.5V)
GND
GND
A0
A1
A2
A0
A1
A2
VCC
SDA
SCL
WP
8-lead PDIP
8-ball dBGA2
Bottom View
1
2
3
4
8-lead TSSOP
1
2
3
4
8
7
6
5
8
7
6
5
1
2
3
4
8
7
6
5
VCC
WP
SCL
SDA
A0
A1
A2
GND
VCC
WP
SCL
SDA
GND
GND
SDA
SCL
VCC
SDA
SCL
A0
A1
A2
WP
5-lead SOT23
Bottom View
8
7
6
5
8-lead MAP
1
2
3
8-lead SOIC
1
2
3
4
1
2
3
4
5
4
8
7
6
5
A0
A1
A2
GND
WP
VCC
VCC
WP
SCL
SDA
Note: 1. This device is not recom-
Two-wire
Serial EEPROM
1K (128 x 8)
2K (256 x 8)
4K (512 x 8)
8K (1024 x 8)
16K (2048 x 8)
AT24C01A
AT24C02
AT24C04
AT24C08
AT24C16
2. This device is not recom-
mended for new designs.
Please refer to AT24C08A.
mended for new designs.
Please refer to AT24C16A.
0180T–SEEPR–12/04
(1)
(2)
1

Related parts for AT24C01A-10PC

AT24C01A-10PC Summary of contents

Page 1

... The device is optimized for use in many industrial and commercial applications where low-power and low-voltage operation are essential. The AT24C01A/02/04/08/16 is available in space-saving 8-lead PDIP, 8-lead JEDEC SOIC, 8-lead MAP, 5-lead SOT23 (AT24C01A/AT24C02/AT24C04), 8- lead TSSOP, and 8-ball dBGA2 packages and is accessed via a Two-wire serial inter- face ...

Page 2

... Voltage on Any Pin with Respect to Ground .................................... –1.0V to +7.0V Maximum Operating Voltage .......................................... 6.25V DC Output Current........................................................ 5.0 mA Figure 1. Block Diagram AT24C01A/02/04/08/16 2 *NOTICE: Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent dam- age to the device. This is a stress rating only and ...

Page 3

... DEVICE/PAGE ADDRESSES (A2, A1, A0): The A2, A1 and A0 pins are device address inputs that are hard wired for the AT24C01A and the AT24C02. As many as eight 1K/2K devices may be addressed on a single bus system (device addressing is discussed in detail under the Device Addressing section). ...

Page 4

... Input High Level IH V Output Low Level V = 3.0V OL2 CC V Output Low Level V = 1.8V OL1 CC Note min and V max are reference only and are not tested AT24C01A/02/04/08/ 25° 1.0 MHz SCL 40°C to +85°C, V – AI Test Condition READ at 100 kHz WRITE at 100 kHz ...

Page 5

... The 24C01A/02/04 bearing the process letter “D” on the package (the mark is located in the lower right corner on the top side of the package), guarantees 400 kHz (2.5 – 5.0V). 2. This parameter is characterized and is not 100% tested. 0180T–SEEPR–12/04 = 40°C to +85°C, V – AI (1) (1) AT24C01A/02/04/08/16 = +1.8V to +5.5V +2.7V to +5.5V 1.8-volt 2.5, 2.7, 5.0-volt Min Max Min ...

Page 6

... EEPROM in 8-bit words. The EEPROM sends a zero to acknowledge that it has received each word. This happens during the ninth clock cycle. STANDBY MODE: The AT24C01A/02/04/08/16 features a low-power standby mode which is enabled: (a) upon power-up and (b) after the receipt of the STOP bit and the completion of any internal operations ...

Page 7

... Figure 3. SCL: Serial Clock, SDA: Serial Data I/O SCL SDA 8th BIT WORDn Note: 1. The write cycle time t is the time from a valid stop condition of a write sequence to the end of the internal clear/write cycle. WR Figure 4. Data Validity 0180T–SEEPR–12/04 ACK t wr STOP CONDITION AT24C01A/02/04/08/16 (1) START CONDITION 7 ...

Page 8

... Figure 5. Start and Stop Definition Figure 6. Output Acknowledge AT24C01A/02/04/08/16 8 0180T–SEEPR–12/04 ...

Page 9

... If more than eight (1K/2K) or sixteen (4K, 8K, 16K) data words are transmitted to the EEPROM, the data word address will “roll over” and previ- ous data will be overwritten. AT24C01A/02/04/08/ the 9 ...

Page 10

... The sequential read operation is terminated when the microcontroller does not respond with a zero but does generate a following stop condition (see Figure 12 on page 12). AT24C01A/02/04/08/16 10 0180T–SEEPR–12/04 ...

Page 11

... Figure 7. Device Address Notes: Figure 8. Byte Write Figure 9. Page Write (* = DON’T CARE bit for 1K) 0180T–SEEPR–12/04 (1) 8K (2) 16K 1. This device is not recommended for new designs. Please refer to AT24C08A. 2. This device is not recommended for new designs. Please refer to AT24C16A. AT24C01A/02/04/08/16 11 ...

Page 12

... Figure 10. Current Address Read Figure 11. Random Read (* = DON’T CARE bit for 1K) Figure 12. Sequential Read AT24C01A/02/04/08/16 12 0180T–SEEPR–12/04 ...

Page 13

... AT24C01A Ordering Information Ordering Code AT24C01A-10PI-2.7 AT24C01A-10SI-2.7 AT24C01A-10TI-2.7 AT24C01A-10PI-1.8 AT24C01A-10SI-1.8 AT24C01A-10TI-1.8 AT24C01A-10PU-2.7 AT24C01A-10PU-1.8 AT24C01A-10SU-2.7 AT24C01A-10SU-1.8 AT24C01A-10TU-2.7 AT24C01A-10TU-1.8 AT24C01A-10TSU-2.7 AT24C01A-10TSU-1.8 AT24C01AU3-10UU-2.7 AT24C01AU3-10UU-1.8 AT24C01AY1-10YU-2.7 AT24C01AY1-10YU-1.8 (2) AT24C01A-W2.7-11 (2) AT24C01A-W1.8-11 Notes: 1. For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the AC and DC characteristics table. ...

Page 14

... Body, Dual Footprint, Non-leaded, Miniature Array Package (MAP) 5TS1 5-lead, 2. 1.60 mm Body, Plastic Thin Shrink Small Outline Package (SOT23) 8U3-1 8-ball, die Ball Grid Away Package (dBGA2) –2.7 Low-voltage (2.7V to 5.5V) –1.8 Low-voltage (1.8V to 5.5V) AT24C01A/02/04/08/16 14 (1) Package 8P3 8S1 8A2 8P3 8S1 ...

Page 15

... Body, Dual Footprint, Non-leaded, Miniature Array Package (MAP) 5TS1 5-lead, 2. 1.60 mm Body, Plastic Thin Shrink Small Outline Package (SOT23) 8U3-1 8-ball, die Ball Grid Away Package (dBGA2) –2.7 Low-voltage (2.7V to 5.5V) –1.8 Low-voltage (1.8V to 5.5V) 0180T–SEEPR–12/04 AT24C01A/02/04/08/16 (1) Package 8P3 8S1 8A2 8P3 8S1 8A2 8P3 ...

Page 16

... Wide, Plastic Dual Inline Package (PDIP) 8S1 8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC) 8A2 8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP) –2.7 Low-voltage (2.7V to 5.5V) –1.8 Low-voltage (1.8V to 5.5V) AT24C01A/02/04/08/16 16 Package 8P3 8S1 8A2 8P3 8S1 8A2 ...

Page 17

... Wide, Plastic Gull Wing Small Outline (JEDEC SOIC) 8A2 8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP) –2.7 Low-voltage (2.7V to 5.5V) –1.8 Low-voltage (1.8V to 5.5V) 0180T–SEEPR–12/04 AT24C01A/02/04/08/16 Package 8P3 8S1 8A2 8P3 8S1 8A2 Package Type ...

Page 18

... D, D1 and E1 dimensions do not include mold Flash or protrusions. Mold Flash or protrusions shall not exceed 0.010 inch and eA measured with the leads constrained to be perpendicular to datum. 5. Pointed or rounded lead tips are preferred to ease insertion and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed 0.010 (0.25 mm). 2325 Orchard Parkway San Jose, CA 95131 R AT24C01A/02/04/08/ ...

Page 19

... These drawings are for general information only. Refer to JEDEC Drawing MS-012, Variation AA for proper dimensions, tolerances, datums, etc. 1150 E. Cheyenne Mtn. Blvd. Colorado Springs, CO 80906 R 0180T–SEEPR–12/ Top View TITLE 8S1, 8-lead (0.150" Wide Body), Plastic Gull Wing Small Outline (JEDEC SOIC) AT24C01A/02/04/08/ ∅ End View COMMON DIMENSIONS (Unit of Measure = mm) MIN MAX SYMBOL NOM A 1.35 – 1. ...

Page 20

... Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess of the b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum space between protrusion and adjacent lead is 0.07 mm. 5. Dimension D and determined at Datum Plane H. 2325 Orchard Parkway San Jose, CA 95131 R AT24C01A/02/04/08/ TITLE 8A2, 8-lead, 4 ...

Page 21

... Top View Side View 2325 Orchard Parkway San Jose, CA 95131 R 0180T–SEEPR–12/ End View A SYMBOL TITLE 8Y1, 8-lead (4.90 x 3.00 mm Body) MSOP Array Package (MAP) Y1 AT24C01A/02/04/08/ PIN 1 INDEX AREA Bottom View COMMON DIMENSIONS (Unit of Measure = mm) MIN MAX NOM NOTE – ...

Page 22

... The Dambar cannot be located on the lower radius of the foot. Minimum space between protrusion and an adjacent lead shall not be less than 0.07 mm. 1150 E. Cheyenne Mtn. Blvd. Colorado Springs, CO 80906 R AT24C01A/02/04/08/ Top View ...

Page 23

... This drawing is for general information only. 1150 E. Cheyenne Mtn. Blvd. Colorado Springs, CO 80906 R 0180T–SEEPR–12/ TITLE 8U3-1, 8-ball, 1.50 x 2.00 mm Body, 0.50 mm pitch, Small Die Ball Grid Array Package (dBGA2) AT24C01A/02/04/08/ Side View COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL MIN NOM MAX A 0 ...

Page 24

... Disclaimer: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any intellectual property right is granted by this document or in connection with the sale of Atmel products. EXCEPT AS SET FORTH IN ATMEL’S TERMS AND CONDI- TIONS OF SALE LOCATED ON ATMEL’S WEB SITE, ATMEL ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT ...

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