AT25256AW-10SI-1.8 SL383 Atmel, AT25256AW-10SI-1.8 SL383 Datasheet - Page 15

• Manufacturer Part Number: AT25256AW-10SI-1.8 SL383
• Description: IC EEPROM 256KBIT 20MHZ 8SOIC
• Manufacturer: Atmel

Specifications of AT25256AW-10SI-1.8 SL383

• Format - Memory: EEPROMs - Serial
• Memory Type: EEPROM
• Memory Size: 256K (32K x 8)
• Speed: 5MHz, 10MHz, 20MHz
• Interface: SPI, 3-Wire Serial
• Voltage - Supply: 1.8 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-SOIC (5.3mm Width), 8-SOP, 8-SOEIAJ
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Other names: AT25256AW10SI18SL

5. AT25128A Ordering Information
Notes:
3368J–SEEPR–06/07
AT25128A-W1.8-11
8P3
8S1
8S2
8U2-1
8A2
8Y7


2.7
1.8
Ordering Code
AT25128A-10PU-2.7
AT25128A-10PU-1.8
AT25128AN-10SU-2.7
AT25128AN-10SU-1.8
AT25128AW-10SU-2.7
AT25128AW-10SU-1.8
AT25128A-10TU-2.7
AT25128A-10TU-1.8
AT25128AU2-10UU-1.8
AT25128AY7-10YH-1.8
1. For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the AC and DC Characteristics
2. “U” designates Green package + RoHS compliant.
3. Available in waffle pack and wafer form; order as SL788 for wafer form. Bumped die available upon request. Please Contact
tables.
Serial Interface Marketing.
8-lead, 0.300" Wide, Plastic Dual In-line Package (PDIP)
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline Package (JEDEC SOIC)
8-lead, 0.200" Wide, Plastic Gull Wing Small Outline Package (EIAJ SOIC)
8-ball, die Ball Grid Array Package (dBGA2)
8-lead, 4.4 mm Body, Thin Shrink Small Outline Package (TSSOP)
8-lead, 6.00 mm x 4.90 mm Body, Ultra Thin, Dual Footprint, Non-leaded, Small Array Package (SAP)
Low-voltage (2.7V to 5.5V)
Low-voltage (1.8V to 5.5V)
(3)
(2)
(2)
(2)
(2)
(2)
(2)
(2)
(2)
(2)
(2)
(1)
Package Type
Options
Package
Die Sale
8U2-1
8P3
8P3
8S1
8S1
8S2
8S2
8A2
8A2
8Y7
AT25128A_256A
Lead-free/Halogen-free/
Industrial Temperature
Industrial Temperature
Operation Range
(40C to 85C)
(40C to 85C)
15