MD2533-D8G-X-P/Y SanDisk, MD2533-D8G-X-P/Y Datasheet - Page 6

• Manufacturer Part Number: MD2533-D8G-X-P/Y
• Description: IC MDOC H3 8GB FBGA
• Manufacturer: SanDisk
• Type: Flash Disk Moduler

Specifications of MD2533-D8G-X-P/Y

• Format - Memory: FLASH
• Memory Type: FLASH - Nand
• Memory Size: 8G (1G x 8)
• Interface: Parallel
• Voltage - Supply: 1.65 V ~ 1.95 V, 2.5 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 115-LFBGA
• Density: 1GByte
• Operating Supply Voltage (typ): 1.8/3.3V
• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Package Type: FBGA
• Mounting: Surface Mount
• Pin Count: 115
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 1.65/2.7V
• Operating Supply Voltage (max): 1.95/3.6V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Speed: -
• Lead Free Status / Rohs Status: Compliant

T
1. Introduction..............................................................................................................................10
2. Product Overview ....................................................................................................................11
3. Theory of Operation ................................................................................................................25
4. Data Protection and Security-Enabling features ..................................................................29
5. mDOC H3 Modes of Operation ...............................................................................................31
6
ABLE OF
2.1
2.2
2.3
3.1
3.2
3.3
3.4
3.5
3.6
5.1
5.2
5.3
5.4
Product Description ..........................................................................................................11
Standard Interface ............................................................................................................13
2.2.1
2.2.2
2.2.3
Multiplexed Interface.........................................................................................................19
2.3.1
2.3.2
2.3.3
Overview...........................................................................................................................25
Host Interface ...................................................................................................................26
3.2.1
3.2.2
3.2.3
Host Agent ........................................................................................................................27
3.3.1
3.3.2
Boot Agent ........................................................................................................................27
Error Detection Code / Error Correction Code (EDC/ECC) ..............................................28
Block Device Management ...............................................................................................28
4.1.1
4.1.2
4.1.3
4.1.4
4.1.5
Reset State .......................................................................................................................32
Turbo Mode ......................................................................................................................32
Power Save Mode ............................................................................................................32
Standby Mode...................................................................................................................32
C
ONTENTS
9x12/12x18 FBGA Ball Diagrams .......................................................................................13
9x12/12x18 FBGA Signal Description.................................................................................15
System Interface .................................................................................................................18
9x12/12x18 FBGA Ball Diagram .........................................................................................19
9x12/12x18 FBGA Signal Description.................................................................................21
System Interface .................................................................................................................24
Standard (NOR-Like) Interface ...........................................................................................26
Multiplexed Interface ...........................................................................................................26
Serial Interface ....................................................................................................................27
Host Protocol.......................................................................................................................27
Boot Block (XIP)..................................................................................................................27
Read/Write-Protected partitions ..........................................................................................29
LOCK# signal ......................................................................................................................29
Sticky Lock (SLOCK) ..........................................................................................................29
Unique Identification (UID) Number ....................................................................................29
One-Time Programmable (OTP) Partitions.........................................................................30
Data Sheet (Preliminary) Rev. 0.2
mDOC H3 Embedded Flash Drive
92-DS-1205-10