IC OFFLINE SWIT OCP 8DIP

LNK306PN

Manufacturer Part NumberLNK306PN
DescriptionIC OFFLINE SWIT OCP 8DIP
ManufacturerPower Integrations
SeriesLinkSwitch®-TN
TypeOff Line Switcher
LNK306PN datasheet
 


Specifications of LNK306PN

Output IsolationNon-IsolatedFrequency Range62 ~ 70kHz
Voltage - Output700VPower (watts)12mW
Operating Temperature-40°C ~ 150°CPackage / Case8-DIP (0.300", 7.62mm), 7 Leads
Output Voltage12 VInput / Supply Voltage (max)265 VAC
Input / Supply Voltage (min)85 VACDuty Cycle (max)72 %
Switching Frequency66 KHzSupply Current250 uA
Operating Temperature Range- 40 C to + 150 CMounting StyleThrough Hole
Lead Free Status / RoHS StatusLead free / RoHS CompliantOther names596-1027-5
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D S .004 (.10)
-E-
.240 (6.10)
.260 (6.60)
Pin 1
.367 (9.32)
-D-
.387 (9.83)
.125 (3.18)
.145 (3.68)
-T-
SEATING
PLANE
.100 (2.54) BSC
.048 (1.22)
.053 (1.35)
.014 (.36)
T E D S .010 (.25) M
.022 (.56)
D S .004 (.10)
-E-
.240 (6.10)
.260 (6.60)
Pin 1
.100 (2.54) (BSC)
.367 (9.32)
-D-
.387 (9.83)
.125 (3.18)
.145 (3.68)
.032 (.81)
.048 (1.22)
.037 (.94)
.053 (1.35)
DIP-8B
Notes:
.137 (3.48)
1. Package dimensions conform to JEDEC specification
MINIMUM
MS-001-AB (Issue B 7/85) for standard dual-in-line (DIP)
package with .300 inch row spacing.
2. Controlling dimensions are inches. Millimeter sizes are
shown in parentheses.
3. Dimensions shown do not include mold flash or other
protrusions. Mold flash or protrusions shall not exceed
.006 (.15) on any side.
4. Pin locations start with Pin 1, and continue counter-clock-
wise to Pin 8 when viewed from the top. The notch and/or
dimple are aids in locating Pin 1. Pin 6 is omitted.
5. Minimum metal to metal spacing at the package body for
the omitted lead location is .137 inch (3.48 mm).
6. Lead width measured at package body.
7. Lead spacing measured with the leads constrained to be
.057 (1.45)
perpendicular to plane T.
.068 (1.73)
(NOTE 6)
.015 (.38)
MINIMUM
.008 (.20)
.120 (3.05)
.015 (.38)
.140 (3.56)
.300 (7.62) BSC
.300 (7.62)
.390 (9.91)
SMD-8B
.137 (3.48)
MINIMUM
.372 (9.45)
.388 (9.86)
.010 (.25)
E S
.046 .060
Pin 1
.086
.186
Solder Pad Dimensions
.057 (1.45)
.068 (1.73)
(NOTE 5)
.004 (.10)
.009 (.23)
.004 (.10)
.036 (0.91)
.012 (.30)
.044 (1.12)
LNK302/304-306
(NOTE 7)
PI-2551-121504
Notes:
1. Controlling dimensions are
inches. Millimeter sizes are
shown in parentheses.
2. Dimensions shown do not
include mold flash or other
protrusions. Mold flash or
protrusions shall not exceed
.006 (.15) on any side.
.420
3. Pin locations start with Pin 1,
and continue counter-clock-
.060 .046
wise to Pin 8 when viewed
from the top. Pin 6 is omitted.
4. Minimum metal to metal
.080
spacing at the package body
for the omitted lead location
is .137 inch (3.48 mm).
5. Lead width measured at
package body.
.286
6. D and E are referenced
datums on the package
body.
°
°
0 -
8
G08B
PI-2546-121504
P08B
2-15
15
Rev. I 11/08