NCP1835MN20R2G ON Semiconductor, NCP1835MN20R2G Datasheet - Page 16

• Manufacturer Part Number: NCP1835MN20R2G
• Description: IC BATT CHRGR LI-ION 4.2V 10-DFN
• Manufacturer: ON Semiconductor
• Type: Battery Chargerr

Specifications of NCP1835MN20R2G

• Function: Charge Management
• Battery Type: Lithium-Ion (Li-Ion)
• Voltage - Supply: 2.8 V ~ 6.5 V
• Operating Temperature: -20°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 10-VFDFN Exposed Pad
• Output Voltage: 4.2 V
• Output Current: 1000 mA
• Operating Supply Voltage: 2.8 V to 6.5 V
• Maximum Operating Temperature: + 70 C
• Minimum Operating Temperature: - 20 C
• Mounting Style: SMD/SMT
• Operating Supply Voltage (min): 2.8V
• Operating Supply Voltage (max): 6.5V
• Operating Temp Range: -20C to 70C
• Package Type: DFN
• Mounting: Surface Mount
• Pin Count: 10
• Operating Temperature Classification: Commercial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: NCP1835MN20R2G; NCP1835MN20R2GOSTR

PUBLICATION ORDERING INFORMATION
10X
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [e-mail]
ON Semiconductor and
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any
liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental
damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over
time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under
its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body,
or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death
may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees,
subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of
personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part.
SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
2X
2X
REFERENCE
0.10 C
0.05 C
10X
10X
0.10 C
0.08 C
0.15 C
L
K
PIN 1
0.15 C
NOTE 3
A B
10X
Ç Ç Ç
Ç Ç Ç
Ç Ç Ç
Ç Ç Ç
DETAIL B
b
10
BOTTOM VIEW
1
SIDE VIEW
TOP VIEW
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
e
D2
D
5
6
(A3)
A1
DETAIL A
A
B
E
E2
A
N. American Technical Support: 800−282−9855 Toll Free
Europe, Middle East and Africa Technical Support:
Japan Customer Focus Center
PACKAGE DIMENSIONS
C
USA/Canada
Phone: [phone]
Phone: 81−3−5773−3850
*For additional information on our Pb−Free strategy and soldering
SEATING
PLANE
MOLD CMPD
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
L1
DFN10, 3x3, 0.5P
0.5651
CASE 485C−01
10X
A1
ISSUE B
Bottom View
2.1746
(Optional)
DETAIL A
0.3008
16
É É É
É É É
É É É
10X
Side View
(Optional)
DETAIL B
SOLDERING FOOTPRINT*
EDGE OF PACKAGE
EXPOSED Cu
2.6016
A3
DIMENSIONS: MILLIMETERS
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
4. COPLANARITY APPLIES TO THE EXPOSED
5. TERMINAL b MAY HAVE MOLD COMPOUND
6. DETAILS A AND B SHOW OPTIONAL VIEWS
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your loca
Sales Representative
0.5000 PITCH
ASME Y14.5M, 1994.
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
PAD AS WELL AS THE TERMINALS.
MATERIAL ALONG SIDE EDGE. MOLD
FLASHING MAY NOT EXCEED 30 MICRONS
ONTO BOTTOM SURFACE OF TERMINAL b.
FOR END OF TERMINAL LEAD AT EDGE OF
PACKAGE.
1.8508
DIM
A1
A3
D2
E2
L1
A
D
E
K
b
e
L
MILLIMETERS
0.80
0.00
0.18
2.40
1.70
0.35
0.00
MIN
0.20 REF
3.00 BSC
3.00 BSC
0.50 BSC
0.19 TYP
MAX
3.3048
1.00
0.05
0.30
2.60
1.90
0.45
0.03
NCP1835/D