LTC4151CMS-1#PBF Linear Technology, LTC4151CMS-1#PBF Datasheet - Page 14

• Manufacturer Part Number: LTC4151CMS-1#PBF
• Description: IC CURRENT MONITOR(12BIT) 10MSOP
• Manufacturer: Linear Technology

Specifications of LTC4151CMS-1#PBF

• Function: Current Monitor (12 Bit)
• Sensing Method: High-Side
• Accuracy: ±1%
• Voltage - Input: 7 ~ 80 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 10-MSOP, Micro10™, 10-uMAX, 10-uSOP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Output: -

PACKAGE DESCRIPTION
LTC4151
TYPICAL APPLICATION
3.55 ±0.05
14
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
2.15 ±0.05
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
0.25 ± 0.05
1.65 ±0.05
(2 SIDES)
2.38 ±0.05
(2 SIDES)
48V
V
IN
VISHAY
2381 615 4.104
0.50
BSC
Temperature Monitoring with an NTC Thermistor While
Measuring Load Current and LTC4151 Supply Current
0.70 ±0.05
T(°C) = 58.82 • (N
N
ADC AT THE ADIN AND V
PACKAGE
OUTLINE
ADIN
40.2k
1%
1.5k
1%
(Reference LTC DWG # 05-08-1699 Rev C)
100k AT
1%
10-Lead Plastic DFN (3mm × 3mm)
AND N
(SEE NOTE 6)
TOP MARK
25°C
VIN
PIN 1
ARE DIGITAL CODES MEASURED BY THE
0.200 REF
ADIN
ADIN
DD Package
SENSE
/N
VIN
IN
0.2
+
PINS, RESPECTIVELY.
LTC4151
– 0.1066), 20°C < T < 60°C.
SENSE
GND
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
TOP AND BOTTOM OF PACKAGE
–
V
ADR1
ADR0
IN
4151 TA02
SDA
SCL
3.00 ±0.10
0.75 ±0.05
(4 SIDES)
I
0.00 – 0.05
2
C
1.65 ± 0.10
(2 SIDES)
250mA
LOAD
BOTTOM VIEW—EXPOSED PAD
5
R = 0.125
6
2.38 ±0.10
(2 SIDES)
TYP
10
1
0.50 BSC
0.25 ± 0.05
0.40 ± 0.10
(DD) DFN REV C 0310
PIN 1 NOTCH
R = 0.20 OR
0.35 × 45°
CHAMFER
4151fc