NIS5132MN2TXG ON Semiconductor, NIS5132MN2TXG Datasheet - Page 2

• Manufacturer Part Number: NIS5132MN2TXG
• Description: IC ELECTRONIC FUSE 12V 10DFN
• Manufacturer: ON Semiconductor

Specifications of NIS5132MN2TXG

• Function: Electronic Fuse
• Voltage - Input: 9 ~ 18 V
• Current - Output: 3.6A
• Operating Temperature: -40°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: 10-VFDFN Exposed Pad
• Product: Power Distribution
• Supply Voltage (max): 25 V
• Supply Voltage (min): - 0.6 V
• Power Dissipation: 1.3 W
• Operating Temperature Range: - 40 C to + 150 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Accuracy: -
• Sensing Method: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Negative voltage will not damage device provided that the power dissipation is limited to the rated allowable power for the package.
2. 1 oz. copper, double−sided FR4.
3. Thermal limit is set above the maximum thermal rating. It is not recommended to operate this device at temperatures greater than the
Table 1. FUNCTIONAL PIN DESCRIPTION
MAXIMUM RATINGS
Input Voltage, operating, steady−state (V
Thermal Resistance, Junction−to−Air
Thermal Resistance, Junction−to−Lead (Pin 1)
Thermal Resistance, Junction−to−Case
Total Power Dissipation @ T
Derate above 25°C
Operating Temperature Range (Note 3)
Nonoperating Temperature Range
Lead Temperature, Soldering (10 Sec)
11 (belly pad)
maximum ratings for extended periods of time.
6−10
Pin
1
2
3
4
Transient (100 ms)
0.1 in
0.5 in
2
2
copper (Note 2)
copper (Note 2)
Enable/Fault
ENABLE/
Function
Ground
Source
FAULT
dv/dt
I
V
Limit
CC
A
= 25°C
Rating
Shutdown
Thermal
Enable
UVLO
Negative input voltage to the device. This is used as the internal reference for the IC.
The internal dv/dt circuit controls the slew rate of the output voltage at turn on. It has an internal
capacitor that allows it to ramp up over a period of 2 ms. An external capacitor can be added to
this pin to increase the ramp time. If an additional time delay is not required, this pin should be left
open.
The enable/fault pin is a tri−state, bidirectional interface. It can be used to enable or disable the
output of the device by pulling it to ground using an open drain or open collector device. If a
thermal fault occurs, the voltage on this pin will go to an intermediate state to signal a monitoring
circuit that the device is in thermal shutdown. It can also be connected to another device in this
family to cause a simultaneous shutdown during thermal events.
A resistor between this pin and the source pin sets the overload and short circuit current limit
levels.
This pin is the source of the internal power FET and the output terminal of the fuse.
Positive input voltage to the device.
CC
to GND, Note 1)
Figure 1. Block Diagram
http://onsemi.com
Charge
Pump
Voltage
Clamp
2
Current
Limit
VCC
Control
dv/dt
Description
Symbol
P
V
q
q
q
T
T
T
max
JA
JC
JL
IN
L
J
J
GND
SOURCE
I
dv/dt
LIMIT
−40 to 150
−55 to 155
−0.6 to 18
−0.6 to 25
Value
10.4
227
260
1.3
95
27
20
mW/°C
°C/W
°C/W
°C/W
Unit
°C
°C
°C
W
V