LTC4307IMS8-1#TRPBF Linear Technology, LTC4307IMS8-1#TRPBF Datasheet - Page 11

• Manufacturer Part Number: LTC4307IMS8-1#TRPBF
• Description: IC BUFFER 2-WIRE BUS 8-MSOP
• Manufacturer: Linear Technology
• Type: Hot-Swap Switchr

Specifications of LTC4307IMS8-1#TRPBF

• Applications: General Purpose, Buffer/Bus Extender
• Internal Switch(s): Yes
• Voltage - Supply: 2.3 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

PACKAGE DESCRIPTION
3.5 ±0.05
(.0165 ± .0015)
0.42 ± 0.038
2.15 ±0.05
TYP
RECOMMENDED SOLDER PAD LAYOUT
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
(.206)
5.23
MIN
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
1.65 ±0.05
ON TOP AND BOTTOM OF PACKAGE
(2 SIDES)
0.25 ± 0.05
2.38 ±0.05
(2 SIDES)
(.0256)
0.889 ± 0.127
(.035 ± .005)
(.126 – .136)
3.20 – 3.45
0.65
BSC
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
0.50
BSC
0.675 ±0.05
PACKAGE
OUTLINE
GAUGE PLANE
(.007)
0.18
(Reference LTC DWG # 05-08-1660 Rev F)
8-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1698)
TOP MARK
8-Lead Plastic MSOP
(.010)
0.254
(NOTE 6)
DD Package
PIN 1
MS8 Package
0.200 REF
DETAIL “A”
DETAIL “A”
0° – 6° TYP
(.021 ± .006)
0.53 ± 0.152
SEATING
PLANE
3.00 ±0.10
0.75 ±0.05
(4 SIDES)
(.193 ± .006)
(.118 ± .004)
4.90 ± 0.152
3.00 ± 0.102
(.009 – .015)
0.22 – 0.38
(NOTE 3)
0.00 – 0.05
TYP
(.043)
1.65 ± 0.10
MAX
1.10
(2 SIDES)
(.0256)
0.65
BSC
1
8
BOTTOM VIEW—EXPOSED PAD
0.25 ± 0.05
R = 0.115
7 6 5
2 3
LTC4307-1
TYP
4
5
4
2.38 ±0.10
(2 SIDES)
(.118 ± .004)
3.00 ± 0.102
(.0205)
(.034)
(NOTE 4)
0.52
0.86
REF
REF
0.1016 ± 0.0508
MSOP (MS8) 0307 REV F
(.004 ± .002)
8
1
0.50 BSC
11
0.38 ± 0.10
43071fa
(DD8) DFN 1203