MAX5054BATA+T Maxim Integrated Products, MAX5054BATA+T Datasheet - Page 12

• Manufacturer Part Number: MAX5054BATA+T
• Description: IC MOSFET DRVR DUAL 8-TDFN
• Manufacturer: Maxim Integrated Products
• Type: Low Sider

Specifications of MAX5054BATA+T

• Configuration: Low-Side
• Input Type: Differential
• Delay Time: 20ns
• Current - Peak: 4A
• Number Of Configurations: 2
• Number Of Outputs: 2
• Voltage - Supply: 4 V ~ 15 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-TDFN Exposed Pad
• Rise Time: 85 ns
• Fall Time: 75 ns
• Supply Voltage (min): 4 V
• Supply Current: 2.4 mA
• Maximum Power Dissipation: 1454 mW
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Maximum Turn-off Delay Time: 35 ns
• Maximum Turn-on Delay Time: 35 ns
• Minimum Operating Temperature: - 40 C
• Number Of Drivers: 2
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• High Side Voltage - Max (bootstrap): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: MAX5054BATA+T; MAX5054BATA+TTR

Both the SO-EP and TDFN-EP packages have an
exposed pad on the bottom of their package. These
pads are internally connected to GND. For the best
thermal conductivity, solder the exposed pad to the
4A, 20ns, Dual MOSFET Drivers
Figure 5. Push-Pull Converter with Synchronous Rectification Drive Using MAX5054
12
PWM IN
PWM IN
______________________________________________________________________________________
INA+
INA-
INB+
INB-
MAX5054
V
IN
OUTA
OUTB
GND
V
DD
V
DD
Exposed Pad
PWM IN
ground plane to dissipate 1.5W and 1.9W in SO-EP and
TDFN-EP packages, respectively. Do not use the
ground-connected pads as the only electrical ground
connection or ground return. Use GND (pin 3) as the
primary electrical ground connection.
Additional Application Circuits
INA+
INA-
INB+
INB-
MAX5054
OUTA
OUTB
GND
V
DD
V
OUT