TC4425AVOA Microchip Technology, TC4425AVOA Datasheet - Page 14

• Manufacturer Part Number: TC4425AVOA
• Description: IC MOSFET DVR 3A DUAL HS 8SOIC
• Manufacturer: Microchip Technology
• Type: Low Sider

Specifications of TC4425AVOA

• Configuration: Low-Side
• Input Type: Inverting and Non-Inverting
• Delay Time: 33ns
• Current - Peak: 3A
• Number Of Configurations: 2
• Number Of Outputs: 2
• Voltage - Supply: 4.5 V ~ 18 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Device Type: MOSFET
• Module Configuration: Low Side
• Peak Output Current: 4.5A
• Output Resistance: 2.2ohm
• Input Delay: 40ns
• Output Delay: 41ns
• Supply Voltage Range: 4.5V To 18V
• Driver Case Style: SOIC
• Rise Time: 21 ns
• Fall Time: 21 ns
• Supply Voltage (min): 4.5 V
• Supply Current: 2 mA
• Maximum Power Dissipation: 610 mW
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Number Of Drivers: 2
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• High Side Voltage - Max (bootstrap): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

TC4423A/TC4424A/TC4425A
DS21998B-page 14
8-Lead Plastic Small Outline (OA) – Narrow, 3.90 mm Body [SOIC]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Chamfer (optional)
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
NOTE 1
A
A1
§
N
1
2
D
b
3
e
Dimension Limits
A2
E1
E
Units
φ
A2
A1
E1
L1
N
D
e
A
E
h
L
b
α
β
φ
c
1.25
0.10
0.25
0.40
0.17
0.31
MIN
L1
0°
5°
5°
h
L
–
MILLIMETERS
h
1.27 BSC
6.00 BSC
3.90 BSC
4.90 BSC
1.04 REF
NOM
8
–
–
–
–
–
–
–
–
–
–
Microchip Technology Drawing C04-057B
α
β
© 2007 Microchip Technology Inc.
MAX
1.75
0.25
0.50
1.27
0.25
0.51
15°
15°
8°
–
c