IXDD604SIA Clare, IXDD604SIA Datasheet - Page 11

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IXDD604SIA

Manufacturer Part Number
IXDD604SIA
Description
IC GATE DVR 4A DUAL ENABLE 8SOIC
Manufacturer
Clare
Type
Dual Low-Side Ultrafast MOSFET Driversr
Datasheet

Specifications of IXDD604SIA

Configuration
Low-Side
Input Type
Non-Inverting
Delay Time
29ns
Current - Peak
4A
Number Of Configurations
2
Number Of Outputs
2
Voltage - Supply
4.5 V ~ 35 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
8-SOIC (3.9mm Width)
Product
MOSFET Gate Drivers
Rise Time
9 ns
Fall Time
8 ns
Propagation Delay Time
29 ns
Supply Voltage (max)
35 V
Supply Voltage (min)
4.5 V
Supply Current
10 uA
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Number Of Drivers
2
Output Current
4 A
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
High Side Voltage - Max (bootstrap)
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
CLA333

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
IXDD604SIA
Manufacturer:
IXYS/艾赛斯
Quantity:
20 000
Part Number:
IXDD604SIATR
Manufacturer:
IXYS/艾赛斯
Quantity:
20 000
Part Number:
IXDD604SIATR
0
5.4 Mechanical Dimensions
R02
5.4.1 SIA (8-
5.4.2 SI (8-
(0.228 / 0.244)
(0.228 / 0.244)
(0.090 / 0.110)
(0.130 / 0.150)
(0.012 / 0.020)
(0.012 / 0.020)
5.80 / 6.20
5.80 / 6.20
0.31 / 0.51
2.29 / 2.79
3.30 / 3.81
0.31 / 0.51
Pin
Pin
Power SOIC with Exposed Metal Back)
PIN 1
PIN 1
SOIC)
(0.190 / 0.197)
(0.190 / 0.197)
4.80 / 5.00
4.80 / 5.00
(0.05 BSC)
(0.05 BSC)
(0.150 / 0.157)
(0.150 / 0.157)
1.27 BSC
1.27 BSC
3.80 / 4.00
3.80 / 4.00
(0.051 / 0.069)
(0.051 / 0.069)
1.30 / 1.75
1.30 / 1.75
(0.001 / 0.004)
(0.004 / 0.010)
0.03 / 0.10
0.10 / 0.25
(0.010 / 0.020 x45º)
(0.010 / 0.020 x45º)
0.25 / 0.50 x45º
0.25 / 0.50 x45º
(0.004 / 0.010)
www.clare.com
(0.004 / 0.010)
0.10 / 0.25
0.10 / 0.25
0º / 8º
0º / 8º
(inches MIN / inches MAX)
NOTES:
1. Molded package conforms to JEDEC standard configuration
2. The exposed metal pad on the back of the SI package may be
NOTE: Molded package conforms to JEDEC standard configuration
(0.016 / 0.050)
(0.016 / 0.050)
(inches MIN / inches MAX)
MS-012 variation BA.
left floating or connected to GND. It is not suitable for carrying
current.
0.40 / 1.27
0.40 / 1.27
mm MIN / mm MAX
mm MIN / mm MAX
Dimensions
MS-012 variation AA.
Dimensions
Recommended PCB Land Pattern
Recommended PCB Land Pattern
(0.209)
5.40
(0.050)
(0.108)
1.27
(0.213)
2.75
5.40
(0.150)
(0.024)
3.80
0.60
(0.061)
(0.061)
1.55
(0.024)
(0.050)
1.55
0.60
1.27
IXD_604
11

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