MX877R IXYS, MX877R Datasheet - Page 93

• Manufacturer Part Number: MX877R
• Description: IC DVR RELAY/LOAD 8CH 60V 28-QFN
• Manufacturer: IXYS

Specifications of MX877R

• Input Type: Parallel/Serial
• Number Of Outputs: 8
• Current - Output / Channel: 80mA
• Voltage - Supply: 6 V ~ 60 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 28-QFN
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• On-state Resistance: -
• Current - Peak Output: -

ISOPLUS Family
ISOPLUS220™
Isolated Discrete Packages
ISOPLUS247™ is the DCB isolated
version of the PLUS247™ package
(TO-247 without a mounting hole). The
design of this new patented package is
revolutionary: the silicon chip is soft sol-
dered onto a Direct Copper Bond (DCB)
substrate instead of the usual copper
lead frame. The DCB ceramic, the same
substrate material as used in the high
power modules, not only provides high
isolation capability (2500 V
unbeatable low thermal resistance com-
pared to conventional, external mounted
isolation materials.
Package cross section
While the junction-to-case thermal re-
sistance is higher than an equivalent,
non-isolated device, what really mat-
ters is the total thermal resistance from
junction-to-heatsink (R
device in ISOPLUS247™ to its compa-
nion in the non-isolated package with an
external isolation foil, one can see that
the overall R
in the already isolated package (see ex-
ample).
Example: ISOPLUS247™ compared to conventional isolated device
IXFR 180N10 ISOPLUS247™ internal DCB
IXFX 180N10 PLUS247™
Type
Leads
Mould
th
is now lower for the part
Package
thJH
ISOPLUS247™
Mould
). Comparing a
RMS
) but also
external foil
Isolation
Copper
Advantages:
• Isolation capability from leads to back-
• Thermal resistance from Junction to
• Increased power- and temperature
• DCB can be patterned like printed cir-
Due to the matched thermal expansion
coefficients of silicon and DCB ceramic,
mechanical stress to the die and solder
caused by power- and temperature cyc-
ling is reduced so that reliability is impro-
ved. Mounting is done with clips, which
not only saves time but also guarantees
constant pressure force over the whole
lifetime of the assembly.
Ceramic
side 2500 V
foil needed
Case only slightly higher as for non-
isolated version
cycling capability
cuit boards – allowing special functions
to be realized
ISOPLUS264™
DCB
R
K/W
0.22
0.3
thJC
Copper
RMS
R
K/W
0.15
1.02
thCK
– no external isolation
Total
K/W
0.45
1.24
ISOPLUS i4-PAC™
Solder
Factor
2.8
1
Chip
Parts in the ISOPLUS247™ housing can
be identified by the letter “R” in the IXYS
part number. Potentially all devices now
encapsulated in TO-247, TO-264 and
PLUS247™ housings can be molded in
the ISOPLUS247™. There are already
more than 100 different ISOPLUS247™
types available.
Another interesting feature is the capa-
bility to pattern the DCB substrate like
a printed circuit board. Now additional
special functions can be realized, e.g.
the series connection of single diode
chips within one package.
ISOPLUS220™, ISOPLUS247™ and
ISOPLUS264™ are the DCB sustitu-
tes for the corresponding standard pa-
ckages.
A larger version of this packaging tech-
nology is named ISOPLUS i4-PAC™.
It has up to five terminal pins, making
it possible to build up full diode bridges,
phase-leg transistor configurations, buck
and boost converters and much more
within one isolated discrete package.
ISOPLUS-DIL™ is the latest member
of IXYS ISOPLUS family. 37.5 mm long
and 25 mm wide, plane power pins for
300 A RMS on one side and 12 control
pins on the oposite side enables IXYS
to provide the user with high current six-
pack configuration in one package.
ISOPLUS-DIL™ features the highest
power density and reliability and is the-
refore ideally suited for automotive de-
signs.
ISOPLUS-DIL™
71