MX877RTR IXYS, MX877RTR Datasheet
MX877RTR
Specifications of MX877RTR
Related parts for MX877RTR
MX877RTR Summary of contents
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... Outputs can be paralleled for increased drive current device total of 400mA, sink or source. The MX877 is designed to operate over a temperature range of -40°C to +85°C, and is available in a 28-lead QFN Package. Ordering Information e 3 Part MX877R MX877RTR Latch I/O Driver Register Parallel Translator In & ...
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Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...
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Specifications 1.1 Package Pinout BOT TOM V IEW R00B 1.2 Pin Description Pin# Name 1 OUT7 2 N/C 3 GND PWR ...
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MX877 1.3 Absolute Maximum Ratings Parameter Symbol V Supply Voltage V PWR PWR V Logic Supply Voltage CC Input Pin Voltage VIN Continuous Output Current I OUTn OUT0 - OUT7 T Operating Junction Temperature J Thermal Resistance R θJA (Junction ...
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Dynamic Electrical Characteristics V =5V, V =42V, T =25°C, unless otherwise specified. CC PWR A Parameter SCK Period SCK High Time SCK Low Time CS* High Time CS* Falling to SCK Rising CS* Low Time INx to CS Falling ...
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MX877 1.6 Serial Timing INx tINs CS* tCSs SCK tSDIs SDI SDO OUTx 1.7 Parallel Timing INx tINs CS* tCSwl OUTx tOUTf 6 tINh tSDIh tSDO tINh tOUTr www.clare.com tCSwh tSDOz tOUTr tOUTf R00B ...
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Functional Description The MX877 channel high voltage driver with 8-bit input control. The MX877 interfaces to a microprocessor through a standard 3 wire serial interface and an active-low chip select, or can be used in a ...
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MX877 3 Application Examples 3.1 Parallel In / Parallel Out Application IN 8 CS* OE 3.2 Serial Cascade Application MASTER IN SDO IN 8 SCK CS* OE SDI SDO IN 8 SCK CS* OE SDI MASTER OUT 8 OUT 8 ...
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Control System Application System sensors actuators Type 1 timing: capture N CS* µC SDI output N SCK µC SDO input N Type 2 timing: capture N CS* SDI don't care SCK µC SDO input N R00B MX877 capture IN ...
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MX877 4 Manufacturing Information 4.1 Mechanical Dimensions 4.1.1 QFN-28 Package & Recommended PCB Land Pattern Pin 1 REF 5.00 BSC (0.197 BSC) 0.80 / 1.00 (0.031 / 0.039) 0.200 REF (0.008 REF) 0.00 / 0.05 (0.000 / 0.002) 4.1.2 Tape ...
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Soldering For proper assembly, the component must be processed in accordance with the current revision of IPC/JEDEC standard J-STD-020. Failure to follow the recommended guidelines may cause permanent damage to the device resulting in impaired performance and/or a reduced ...