IR3082AMTRPBF International Rectifier, IR3082AMTRPBF Datasheet

IC XPHASE CONTROL 9.6V 20-MLPQ

IR3082AMTRPBF

Manufacturer Part Number
IR3082AMTRPBF
Description
IC XPHASE CONTROL 9.6V 20-MLPQ
Manufacturer
International Rectifier
Series
XPhase™r
Datasheet

Specifications of IR3082AMTRPBF

Applications
Processor
Current - Supply
12mA
Voltage - Supply
8.05 V ~ 16 V
Operating Temperature
0°C ~ 100°C
Mounting Type
Surface Mount
Package / Case
20-MLPQ
Ic Function
Control IC
Supply Voltage Range
8.05V To 16V
Operating Temperature Range
0°C To +100°C
Digital Ic Case Style
MLPQ
No. Of Pins
20
Filter Terminals
SMD
Supply Voltage Min
9.6V
Rohs Compliant
Yes
Controller Type
PWM
Frequency
1MHz
Package
20-Lead MLPQ
Circuit
X-Phase Control IC
Switch Freq (khz)
150kHz to 1.0MHz
Pbf
PbF Option Available
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
IR3082AMTRPBFTR
DESCRIPTION
FEATURES
APPLICATION CIRCUIT
POWERGOOD
The IR3082A Control IC combined with an IR XPhase
to implement a power solution. The “Control” IC provides overall system control and interfaces with any
number of “Phase ICs” which each drive and monitor a single phase of a multiphase converter. With
simple 5 bit voltage programming and a few external components, the IR3082A is also well suited for
general purpose multiphase applications. The XPhase
smaller, less expensive, and easier to design while providing higher efficiency than conventional
approaches.
x
x
x
x
x
x
x
x
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Page 1 of 33
ENABLE
VID0
VID1
VID2
VID3
VID4
5 bit VID with 1% overall system set point accuracy
Programmable Dynamic VID Slew Rate
+/-300mV Differential Remote Sense
Programmable 150kHz to 1MHz oscillator
Programmable VID Offset and Load Line output impedance
Programmable Softstart
Programmable Hiccup Over-Current Protection with Delay to prevent false triggering
Simplified Power Good output provides indication of proper operation and avoids false triggering
Operates from 12V input with 8.25V Under-Voltage Lockout
6.3V/1mA Bias Regulator provides System Reference Voltage
Small thermally enhanced 20L MLPQ package
12V
1
2
3
4
5
VID0
VID1
VID2
VID3
VID4
RVCC1
10 ohm
IR3082A
CONTROL
IC
ROSC
CVCC1
0.1uF
ROCSET
RVDAC
CVDAC
EAOUT
VBIAS
VDRP
VCC
FB
15
14
13
12
11
RDRP1
0.1uF
RDRP
CFB
RFB1
CDRP
TM
9.6V AMD XPHASE
TM
Phase IC provides a full featured and flexible way
RFB
architecture results in a power supply that is
RCP
CCP1
CCP
RMPOUT
VBIAS
EA
ISHARE
VDAC
VOSENSE+
VOSENSE-
TM
5 Wire Analog Bus
to Phase ICs
Remote Sense
05/02/2006
DATA SHEET
CONTROL IC
IR3082A

Related parts for IR3082AMTRPBF

IR3082AMTRPBF Summary of contents

Page 1

DESCRIPTION The IR3082A Control IC combined with an IR XPhase to implement a power solution. The “Control” IC provides overall system control and interfaces with any number of “Phase ICs” which each drive and monitor a single phase of a ...

Page 2

... ORDERING INFORAMATION Device IR3082AMTRPbF * IR3082AMPbF * Samples only ABSOLUTE MAXIMUM RATINGS Stresses beyond those listed below may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications are not implied. ...

Page 3

RECOMMENDED OPERATING CONDITIONS FOR RELIABLE OPERATION WITH MARGIN 8.05V V 16V, -0.3V VOSNS- CC ELECTRICAL CHARACTERISTICS The electrical characteristics involve the spread of values guaranteed within the recommended operating conditions. Typical values represent the median values, which are related to ...

Page 4

PARAMETER Soft Start and Delay Start Delay (See Fig 10) Soft Start Time (See Fig 10) VID = 1.3V (VID4-0 = 01010) PWRGD Delay (See Fig 10) VID = 1.3V (VID4-0 = 01010) OC Delay Time SS/DEL to FB Input ...

Page 5

IR3082 + "FAST" VDAC - PIN DESCRIPTION PIN# PIN SYMBOL PIN DESCRIPTION 1-5 VID4-0 Inputs to VID Converter. 6 VOSNS- Remote Sense Input. Connect to ground at the Load. 7 ROSC Connect a resistor to VOSNS- to ...

Page 6

SYSTEM THEORY OF OPERATION TM XPhase Architecture TM The XPhase architecture is designed for multiphase interleaved buck converters which are used in applications requiring small size, design flexibility, low voltage, high current, and fast transient response. The architecture can be ...

Page 7

PWM Control Method The PWM block diagram of the XPhase trailing edge modulation is used. A high-gain wide-bandwidth voltage type error amplifier in the Control IC is used for the voltage control loop. An external RC circuit connected to the ...

Page 8

VPEAK (5.0V) VPHASE4&5 (4.5V) VPHASE3&6 (3.5V) VPHASE2&7 (2.5V) VPHASE1&8 (1.5V) VVALLEY (1.00V) CLK1 CLK2 CLK3 CLK4 CLK5 CLK6 CLK7 CLK8 PWM Operation The PWM comparator is located in the Phase IC. Upon receiving a clock pulse, the PWM latch is ...

Page 9

TM Body Braking In a conventional synchronous buck converter, the minimum time required to reduce the current in the inductor in response to a load step decrease is; The slew rate of the inductor current can be significantly increased by ...

Page 10

The advantage of sensing the inductor current versus high side or low side sensing is that actual output current being delivered to the load is obtained rather than peak or sampled information about the switch currents. The output voltage can ...

Page 11

IR3082A THEORY OF OPERATION Block Diagram The Block diagram of the IR3082A is shown in figure 7 and discussed in the following sections. VCC - + + VCC UVLO 8.25V COMPARATOR 7.70V - ENABLE ENABLE COMPARATOR - + + + ...

Page 12

Adaptive Voltage Positioning Adaptive voltage positioning is needed to reduce the output voltage deviations during load transients and the power dissipation of the load when it is drawing maximum current. The circuitry related to voltage positioning is shown in Figure ...

Page 13

The voltage at the VDRP pin is a buffered version of the share bus and represents the sum of the DAC voltage and the average inductor current of all the phases. The VDRP pin is connected to the FB pin ...

Page 14

Remote Voltage Sensing To compensate for impedance in the ground plane, the VOSNS- pin is used for remote sensing and connects directly to the load. The VDAC voltage is referenced to VOSNS- to avoid additional error terms or delay related ...

Page 15

Over Current Protection (OCP) The current limit threshold is set by a resistor connected between the OCSET and VDAC pins. If the IIN pin voltage, which is proportional to the average current plus DAC voltage, exceeds the OCSET voltage, the ...

Page 16

VCC (12V) 1.27V ENABLE (VTT) 3.83V SS/DEL 1.3V VOUT PWRGD START START DELAY (ENABLE ENDS 1.9ms FAULT MODE) VCC (12V) ENABLE 3.83V SS/DEL 1.3V VOUT PWRGD OCP THRESHOLD IOUT START-UP NORMAL OPERATION (ENABLE GATES (VOUT CHANGES DUE TO FAULT MODE) ...

Page 17

APPLICATIONS INFORMATION 12V RVCC QGATE 10 ohm RGATE CVCC 0.1uF ENABLE 0.1uF VID0 1 15 VID0 VCC RCP VID1 2 IR3082A 14 VID1 VBIAS VID2 3 CONTROL 13 VID2 EAOUT VID3 CCP1 VID3 FB VID4 5 11 ...

Page 18

PERFORMANCE CHARACTERISTICS Figure 13 - Oscillator Frequency vs. ROSC 1050 950 850 750 650 550 450 350 250 150 ROSC (KOhm) Figure 15 - VDAC Source and Sink Currents vs. ROSC 250 230 210 190 ...

Page 19

DESIGN PROCEDURES – IR3082A AND IR3086A CHIPSET IR3082A EXTERNAL COMPONENTS Oscillator Resistor Rosc The oscillator of IR3082A generates a triangle waveform to synchronize the phase ICs, and the switching frequency of the each phase converter equals the oscillator frequency, which ...

Page 20

VDAC Slew Rate Programming Capacitor C The slew rate of VDAC down-slope SR Equation (7), where I is the sink current of VDAC pin as shown in Figure 15. The resistor R SINK compensate VDAC circuit and is determined by ...

Page 21

No Load Output Voltage Setting Resistor R A resistor between FB pin and the converter output is used to create output voltage offset V difference between V voltage and output voltage at no load condition. Adaptive voltage positioning lowers the ...

Page 22

not used, R should be chosen so that the offset voltage is small enough. Usually R CS- CS+ than 2 k CS+ Over Temperature Setting Resistors R The threshold voltage of VRHOT comparator is proportional to the ...

Page 23

RA PHASEx R PHASEx HOTSET R ˜  PHASEx BIAS If the over temperature setting voltage is higher than the phase delay setting voltage, VBIAS times RA connect HOTSET pin between R ...

Page 24

Type II Compensation Determine the compensation at no load, the worst case condition. Choose the crossover frequency fc between 1/10 and 1/5 of the switching frequency per phase. Assume the time constant of the resistor and capacitor across the output ...

Page 25

OPTERON CONVERTER SPECIFICATIONS Input Voltage DAC Voltage: V =1.3 V DAC No Load Output Voltage Offset: V O_NLOFST Maximum Output Current: I =100 ADC OMAX Output Impedance: R =0. Soft Start Time: t ...

Page 26

From Figure 15, the source current of VDAC pin is 170uA. The VDAC up-slope slew rate is ˜ 170 10 SOURCE ˜ VDAC Over Current Setting Resistor ...

Page 27

IR3086A EXTERNAL COMPONENTS PWM Ramp Resistor R and Capacitor C RAMP Set PWM ramp magnitude V PWMRMP resistor R , PWMRMP R ˜ ˜ ˜  PWMRMP [ln PWMRMP ˜ ...

Page 28

VOLTAGE LOOP COMPENSATION All ceramic output capacitors are used in the design, type III compensation as shown in Figure 18(b) is used here. Choose the desired crossover frequency fc =80 kHz and determine Rcp and C ˜ ˜ ˜ ˜ ...

Page 29

LAYOUT GUIDELINES The following layout guidelines are recommended to reduce the parasitic inductance and resistance of the PCB layout, therefore minimizing the noise coupled to the IC. x Dedicate at least one middle layer for a ground plane LGND. x ...

Page 30

METAL AND SOLDER RESIST x The solder resist should be pulled away from the metal lead lands by a minimum of 0.06mm. The solder resist mis-alignment is a maximum of 0.05mm and it is recommended that the lead lands are ...

Page 31

PCB METAL AND COMPONENT PLACEMENT x Lead land width should be equal to nominal part lead width. The minimum lead to lead spacing should be x Lead land length should be equal to maximum part lead length + 0.2 mm ...

Page 32

STENCIL DESIGN x The stencil apertures for the lead lands should be approximately 80% of the area of the lead lands. Reducing the amount of solder deposited will minimize the occurrence of lead shorts. Since for 0.5mm pitch devices the ...

Page 33

PACKAGE INFORMATION 20L MLPQ ( Body) – IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 www.irf.com Page C Note 2: ...

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