LTC3588EDD-1#TRPBF Linear Technology, LTC3588EDD-1#TRPBF Datasheet - Page 18

• Manufacturer Part Number: LTC3588EDD-1#TRPBF
• Description: IC ENERGY HARVESTING PSU 10DFN
• Manufacturer: Linear Technology

Specifications of LTC3588EDD-1#TRPBF

• Applications: Energy Harvesting
• Voltage - Supply: 2.7 V ~ 20 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 10-DFN
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Supply: -

LTC3588-1
PACKAGE DESCRIPTION
18
(.0120 .0015)
0.305 0.038
TYP
GAUGE PLANE
(.206)
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
6. EXPOSED PAD DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH ON E-PAD
5.23
MIN
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
SHALL NOT EXCEED 0.254mm (.010") PER SIDE.
(.007)
RECOMMENDED SOLDER PAD LAYOUT
0.18
(.010)
0.254
(.074 .004)
1.88 0.102
DETAIL “A”
DETAIL “A”
0 – 6 TYP
(.0197)
(.066 .004)
1.68 0.102
10-Lead Plastic eMSOP , Exposed Die Pad
0.50
BSC
(Reference LTC DWG # 05-08-1664 Rev E)
(.021 .006)
0.53 0.152
SEATING
0.889 0.127
(.035 .005)
(.126 – .136)
PLANE
3.20 – 3.45
MSE Package
(.118 .004)
3.00 0.102
(.007 – .011)
(.193 .006)
4.90 0.152
0.17 – 0.27
(NOTE 3)
TYP
(.043)
MAX
1.10
EXPOSED PAD OPTION
BOTTOM VIEW OF
(.0197)
0.50
BSC
10
10
1
1 2 3 4 5
9
8
7 6
DETAIL “B”
(.074)
1.88
(.118 .004)
3.00 0.102
(.0196 .003)
0.497 0.076
(.034)
(NOTE 4)
0.86
REF
0.1016 0.0508
(.066)
1.68
eMSOP (MSE) 0510 REV E
(.004 .002)
REF
NO MEASUREMENT PURPOSE
THE LEADFRAME FEATURE.
CORNER TAIL IS PART OF
FOR REFERENCE ONLY
DETAIL “B”
0.05 REF
0.29
REF
35881fa