IR3087M International Rectifier, IR3087M Datasheet - Page 34

IC XPHASE W/OVP/TM CTRL 20-MLPQ

IR3087M

Manufacturer Part Number
IR3087M
Description
IC XPHASE W/OVP/TM CTRL 20-MLPQ
Manufacturer
International Rectifier
Series
XPhase™r
Datasheet

Specifications of IR3087M

Applications
Processor
Current - Supply
10mA
Voltage - Supply
8.4 V ~ 21 V
Operating Temperature
0°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
20-MLPQ
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
*IR3087M
Stencil Design
• The stencil apertures for the lead lands should be approximately 80% of the area of the lead lands.
• The stencil lead land apertures should therefore be shortened in length by 80% and centered on the lead
• The land pad aperture should be striped with 0.25mm wide openings and spaces to deposit approximately
• The maximum length and width of the land pad stencil aperture should be equal to the solder resist opening
Page 34 of 35
Reducing the amount of solder deposited will minimize the occurrence of lead shorts. Since for 0.5mm pitch
devices the leads are only 0.25mm wide, the stencil apertures should not be made narrower; openings in
stencils < 0.25mm wide are difficult to maintain repeatable solder release.
land.
50% area of solder on the center pad. If too much solder is deposited on the center pad the part will float
and the lead lands will be open.
minus an annular 0.2mm pull back to decrease the incidence of shorting the center land to the lead lands
when the part is pushed into the solder paste.
1/31/05
IR3087

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