IR3510MPBF International Rectifier, IR3510MPBF Datasheet - Page 35

• Manufacturer Part Number: IR3510MPBF
• Description: IC XPHASE CONTROL 32-MLPQ
• Manufacturer: International Rectifier
• Series: XPhase™r

Specifications of IR3510MPBF

• Applications: Processor
• Mounting Type: Surface Mount
• Package / Case: 32-MLPQ
• Package: 32-Lead MLPQ
• Circuit: X-Phase Control IC
• Pbf: PbF Option Available
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Supply: -
• Voltage - Supply: -
• Operating Temperature: -

STENCIL DESIGN
• The stencil apertures for the lead lands should be approximately 80% of the area of the lead lands. Reducing the
• The stencil lead land apertures should therefore be shortened in length by 80% and centered on the lead land.
• The land pad aperture should be striped with 0.25mm wide openings and spaces to deposit approximately 50% area
• The maximum length and width of the land pad stencil aperture should be equal to the solder resist opening minus
amount of solder deposited will minimize the occurrence of lead shorts. Since for 0.5mm pitch devices the leads
are only 0.25mm wide, the stencil apertures should not be made narrower; openings in stencils < 0.25mm wide are
difficult to maintain repeatable solder release.
of solder on the center pad. If too much solder is deposited on the center pad the part will float and the lead lands
will be open.
an annular 0.2mm pull back to decrease the incidence of shorting the center land to the lead lands when the part is
pushed into the solder paste.
Page 35 of 36
IR Confidential
May 18, 2009
IR3510