UC3844BNG ON Semiconductor, UC3844BNG Datasheet - Page 7

• Manufacturer Part Number: UC3844BNG
• Description: IC CTLR CURRENT MODE 8-DIP
• Manufacturer: ON Semiconductor
• Type: Pulse Width Modulator Controllerr

Specifications of UC3844BNG

• Pwm Type: Current Mode
• Number Of Outputs: 1
• Frequency - Max: 275kHz
• Duty Cycle: 50%
• Voltage - Supply: 11.5 V ~ 25 V
• Buck: No
• Boost: Yes
• Flyback: Yes
• Inverting: Yes
• Doubler: No
• Divider: No
• Cuk: No
• Isolated: Yes
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 8-DIP (0.300", 7.62mm)
• Frequency-max: 275kHz
• Number Of Pwm Outputs: 1
• On/off Pin: No
• Adjustable Output: No
• Topology: Boost/Flyback
• Switching Freq: 500KHz
• Operating Supply Voltage (max): 30V
• Output Current: 1000A
• Synchronous Pin: No
• Rise Time: 50ns
• Fall Time: 50ns
• Operating Temperature Classification: Commercial
• Mounting: Through Hole
• Pin Count: 8
• Package Type: PDIP
• Duty Cycle (max): 48 % (Typ)
• Output Voltage: 4.9 V to 5.1 V
• Mounting Style: Through Hole
• Switching Frequency: 500 KHz
• Operating Supply Voltage: 30 V
• Maximum Operating Temperature: 70 C
• Minimum Operating Temperature: 0 C
• Current, Input Bias: -2 μA
• Current, Output: +12 mA (Sink), -1 mA (Source)
• Current, Supply: 30 mA
• Frequency, Oscillator: 250 kHz
• Power Dissipation: 1.25 W
• Regulation, Line: 2 mV
• Regulation, Load: 3 mV
• Regulator Type: DC-DC
• Temperature, Operating, Range: 0 to +70 °C
• Time, Fall: 50 ns
• Time, Rise: 50 ns
• Voltage, Gain: 3 V/V
• Voltage, Input: -0.3 to +5.5 V
• Voltage, Noise: 50 μV
• Voltage, Output: 5 V
• Voltage, Output, High: 13.5 V
• Voltage, Output, Low: 1.6 V
• Voltage, Supply: 36 V
• Voltage, Supply, Rejection Ratio: 70 dB
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: UC3844BNGOS

−Z−
−Y−
B
H
−X−
8
1
0.25 (0.010)
G
A
D
5
4
M
Z
S
*For additional information on our Pb−Free strategy and soldering
Y
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
S
C
0.25 (0.010)
X
SEATING
PLANE
S
0.024
0.6
0.10 (0.004)
0.275
7.0
PACKAGE DIMENSIONS
SOLDERING FOOTPRINT*
M
Y
M
N
CASE 751−07
SOIC−8 NB
X 45
ISSUE AH
_
M
19
K
SCALE 6:1
0.060
0.155
1.52
4.0
1.270
0.050
J
inches
mm
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
5. DIMENSION D DOES NOT INCLUDE DAMBAR
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
ANSI Y14.5M, 1982.
MOLD PROTRUSION.
PER SIDE.
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
STANDARD IS 751−07.
DIM
M
A
B
C
D
G
H
K
N
S
J
MILLIMETERS
MIN
4.80
3.80
1.35
0.33
0.10
0.19
0.40
0.25
5.80
0
1.27 BSC
_
MAX
5.00
4.00
1.75
0.51
0.25
0.25
1.27
0.50
6.20
8
_
0.189
0.150
0.053
0.013
0.004
0.007
0.016
0.010
0.228
MIN
0
0.050 BSC
INCHES
_
UC3844B/D
0.197
0.157
0.069
0.020
0.010
0.010
0.050
0.020
0.244
MAX
8
_