BD9007F-E2 Rohm Semiconductor, BD9007F-E2 Datasheet - Page 16

• Manufacturer Part Number: BD9007F-E2
• Description: IC REG SW 2A FLEX STEPDOWN 8-SOP
• Manufacturer: Rohm Semiconductor
• Type: Step-Down (Buck)r

Specifications of BD9007F-E2

• Internal Switch(s): Yes
• Synchronous Rectifier: No
• Number Of Outputs: 1
• Voltage - Output: 1 ~ 35 V
• Current - Output: 2A
• Frequency - Switching: 50kHz ~ 500kHz
• Voltage - Input: 7 ~ 35 V
• Operating Temperature: -40°C ~ 105°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOP
• Power - Output: 690mW
• Output Voltage: 2. 6 V
• Output Current: 2 A
• Input Voltage: 7 V to 35 V
• Operating Temperature Range: - 40 C to + 105 C
• Mounting Style: SMD/SMT
• Duty Cycle (max): 100 %
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: BD9007F-E2TR

●Thermal reduction characteristics
BD9006F, BD9006HFP, BD9007F, BD9007HFP
© 2009 ROHM Co., Ltd. All rights reserved.
www.rohm.com
8. GND wiring pattern
9. Temperature protection (thermal shut down) circuit
10. On the application shown below, if there is a mode in which V
① Single piece of IC
PCB Size: 70×70×1.6mm
Copper foil area on the front side of PCB: 10.5×10.5mm
② 2-layer PCB
③ 2-layer PCB
④ 4-layer PCB
It is recommended to separate the large-current GND pattern from the small-signal GND pattern and establish a single
ground at the reference point of the set PCB, so that resistance to the wiring pattern and voltage fluctuations due to a
large current will cause on fluctuations in voltages of the small-signal GND. Prevent fluctuations in the GND wiring pattern
of external parts.
This IC has a built-in temperature protection circuit to prevent the thermal destruction of the IC. As described above, be
sure to use this IC within the power dissipation range. Should a condition exceeding the power dissipation range continue,
the chip temperature Tj will rise to activate the temperature protection circuit, thus turning OFF the output power element.
Then, when the tip temperature Tj falls, the circuit will be automatically reset. Furthermore, if the temperature protection
circuit is activated under the condition exceeding the absolute maximum ratings, do not attempt to use the temperature
protection circuit for set design.
V
recommended to insert a backflow prevention diode in the series with V
IN
10
6
9
8
7
5
4
3
2
1
0
is short-circuited to the Ground with external diode charged, internal circuits may be damaged. To avoid damage, it is
HRP7
④ 7.3W
③ 5.5W
② 2.3W
① 1.4W
25
AMBIENT TEMPERATURE ： Ta [ ℃ ]
(Copper foil area on the reverse side of PCB: 70×70mm
(Copper foil area on the reverse side of PCB: 15×15mm
(Copper foil area on the reverse side of PCB: 70×70mm
50
3
(PCB incorporates thermal via)
Fig.31
75
100
Backflow prevention diode
125
Bypass diode
150
2
Fig.30
16/17
Vcc
2
2
2
)
)
)
IN
Pin
and each pin potential are inverted, for example, if the
0.6
0.8
0.5
0.4
0.3
0.2
0.1
0
0.7
① Single piece of IC
② When mounted on ROHM standard PCB
(Glass epoxy PCB of 70mm×70mm×1.6mm)
SOP8
②
①
IN
or a bypass diode between each pin and V
25
AMBIENT TEMPERATURE ： Ta [ ℃ ]
50
Fig.32
75
100
Technical Note
2009.05 - Rev.A
125
150
IN
.