LM3671MF-1.6 National Semiconductor, LM3671MF-1.6 Datasheet - Page 20

• Manufacturer Part Number: LM3671MF-1.6
• Description: IC CONV DC/DC STEP-DOWN SOT23-5
• Manufacturer: National Semiconductor
• Series: PowerWise®r
• Type: Step-Down (Buck)r

Specifications of LM3671MF-1.6

• Internal Switch(s): Yes
• Synchronous Rectifier: Yes
• Number Of Outputs: 1
• Voltage - Output: 1.6V
• Current - Output: 600mA
• Frequency - Switching: 2MHz
• Voltage - Input: 2.7 ~ 5.5 V
• Operating Temperature: -30°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: SOT-23-5, SC-74A, SOT-25
• Power - Output: 770mW
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: LM3671MF-1.6; LM3671MF-1.6TR

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are typically connected to large copper planes, inadequate
thermal relief can result in late or inadequate re-flow of these
bumps.
The Micro SMD package is optimized for the smallest possi-
ble size in applications with red or infrared opaque cases.
Because the Micro SMD package lacks the plastic encapsu-
lation characteristic of larger devices, it is vulnerable to light.
Backside metallization and/or epoxy coating, along with front-
side shading by the printed circuit board, reduce this sensi-
tivity. However, the package has exposed die edges. In
particular, Micro SMD devices are sensitive to light, in the red
and infrared range, shining on the package’s exposed die
edges.
BOARD LAYOUT CONSIDERATIONS
PC board layout is an important part of DC-DC converter de-
sign. Poor board layout can disrupt the performance of a DC-
DC converter and surrounding circuitry by contributing to EMI,
ground bounce, and resistive voltage loss in the traces. These
can send erroneous signals to the DC-DC converter IC, re-
sulting in poor regulation or instability.
Good layout for the LM3671 can be implemented by following
a few simple design rules below. Refer to Figure 9 for top layer
board layout.
1.
2.
Place the LM3671, inductor and filter capacitors close
together and make the traces short. The traces between
these components carry relatively high switching
currents and act as antennas. Following this rule reduces
radiated noise. Special care must be given to place the
input filter capacitor very close to the V
Arrange the components so that the switching current
loops curl in the same direction. During the first half of
each cycle, current flows from the input filter capacitor
through the LM3671 and inductor to the output filter
capacitor and back through ground, forming a current
loop. In the second half of each cycle, current is pulled
up from ground through the LM3671 by the inductor to
the output filter capacitor and then back through ground
forming a second current loop. Routing these loops so
the current curls in the same direction prevents magnetic
FIGURE 10. Top layer board layout for SOT23-5
IN
and GND pin.
20
3.
4.
5.
6.
In mobile phones, for example, a common practice is to place
the DC-DC converter on one corner of the board, arrange the
CMOS digital circuitry around it (since this also generates
noise), and then place sensitive preamplifiers and IF stages
on the diagonally opposing corner. Often, the sensitive cir-
cuitry is shielded with a metal pan and power to it is post-
regulated to reduce conducted noise, using low-dropout
linear regulators.
field reversal between the two half-cycles and reduces
radiated noise.
Connect the ground pins of the LM3671 and filter
capacitors together using generous component-side
copper fill as a pseudo-ground plane. Then, connect this
to the ground-plane (if one is used) with several vias. This
reduces ground-plane noise by preventing the switching
currents from circulating through the ground plane. It also
reduces ground bounce at the LM3671 by giving it a low-
impedance ground connection.
Use wide traces between the power components and for
power connections to the DC-DC converter circuit. This
reduces voltage errors caused by resistive losses across
the traces.
Route noise sensitive traces, such as the voltage
feedback path, away from noisy traces between the
power components. The voltage feedback trace must
remain close to the LM3671 circuit and should be direct
but should be routed opposite to noisy components. This
reduces EMI radiated onto the DC-DC converter’s own
voltage feedback trace. A good approach is to route the
feedback trace on another layer and to have a ground
plane between the top layer and layer on which the
feedback trace is routed. In the same manner for the
adjustable part it is desired to have the feedback dividers
on the bottom layer.
Place noise sensitive circuitry, such as radio IF blocks,
away from the DC-DC converter, CMOS digital blocks
and other noisy circuitry. Interference with noise-
sensitive circuitry in the system can be reduced through
distance.
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