LT3991EMSE#PBF Linear Technology, LT3991EMSE#PBF Datasheet - Page 22

• Manufacturer Part Number: LT3991EMSE#PBF
• Description: IC BUCK SYNC ADJ 1.2A 10MSOP
• Manufacturer: Linear Technology
• Type: Step-Down (Buck)r

Specifications of LT3991EMSE#PBF

• Internal Switch(s): Yes
• Synchronous Rectifier: No
• Number Of Outputs: 1
• Voltage - Output: 1.19 ~ 30 V
• Current - Output: 1.2A
• Frequency - Switching: 200kHz ~ 2MHz
• Voltage - Input: 4.3 ~ 55 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 10-MSOP Exposed Pad, 10-HMSOP, 10-eMSOP
• Primary Input Voltage: 12V
• No. Of Outputs: 1
• Output Voltage: 30V
• Output Current: 1.2A
• No. Of Pins: 10
• Operating Temperature Range: -40°C To +125°C
• Msl: MSL 1 - Unlimited
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power - Output: -

PACKAGE DESCRIPTION
LT3991/LT3991-3.3/LT3991-5
22
3.55 ±0.05
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
2.15 ±0.05
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
0.25 ± 0.05
1.65 ±0.05
(2 SIDES)
(.0120 ± .0015)
0.305 ± 0.038
GAUGE PLANE
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
6. EXPOSED PAD DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH ON E-PAD
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
SHALL NOT EXCEED 0.254mm (.010") PER SIDE.
TYP
(.007)
RECOMMENDED SOLDER PAD LAYOUT
0.18
2.38 ±0.05
(2 SIDES)
(.206)
5.23
MIN
(.010)
0.254
1.88 ± 0.102
(.074 ± .004)
0.50
BSC
0.70 ±0.05
DETAIL “A”
DETAIL “A”
PACKAGE
OUTLINE
10-Lead Plastic MSOP , Exposed Die Pad
(.066 ± .004)
1.68 ± 0.102
(.0197)
(Reference LTC DWG # 05-08-1699 Rev C)
(Reference LTC DWG # 05-08-1664 Rev G)
0.50
BSC
10-Lead Plastic DFN (3mm × 3mm)
0° – 6° TYP
(SEE NOTE 6)
(.021 ± .006)
0.53 ± 0.152
TOP MARK
0.889 ± 0.127
(.035 ± .005)
(.126 – .136)
3.20 – 3.45
PIN 1
0.200 REF
SEATING
MSE Package
DD Package
PLANE
(.118 ± .004)
3.00 ± 0.102
(.007 – .011)
4.90 ± 0.152
(.193 ± .006)
0.17 – 0.27
(NOTE 3)
TYP
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
(.043)
MAX
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
1.10
TOP AND BOTTOM OF PACKAGE
EXPOSED PAD OPTION
BOTTOM VIEW OF
(.0197)
0.50
10
10
BSC
1
1 2 3 4 5
9
3.00 ±0.10
0.75 ±0.05
(4 SIDES)
8
7 6
0.00 – 0.05
DETAIL “B”
(.074)
1.88
(.118 ± .004)
3.00 ± 0.102
1.65 ± 0.10
0.497 ± 0.076
(.0196 ± .003)
(2 SIDES)
(NOTE 4)
(.034)
0.86
REF
0.1016 ± 0.0508
(.066)
1.68
MSOP (MSE) 0910 REV G
(.004 ± .002)
REF
NO MEASUREMENT PURPOSE
THE LEADFRAME FEATURE.
BOTTOM VIEW—EXPOSED PAD
CORNER TAIL IS PART OF
FOR REFERENCE ONLY
DETAIL “B”
5
R = 0.125
6
0.05 REF
2.38 ±0.10
(2 SIDES)
TYP
0.29
REF
10
1
0.50 BSC
0.25 ± 0.05
0.40 ± 0.10
(DD) DFN REV C 0310
PIN 1 NOTCH
R = 0.20 OR
0.35 × 45°
CHAMFER
3991fa